Nichia Corporation

Dai Nippon Printing Co., Ltd.

Nichsa Corporation

Masaaki Katsumata

Koji Taguchi

Yumiko Kameshima

Eiko Minato

Masakazu Sakamoto

Tomohiro Ikeda

Rie Maeda

Yohei Inayoshi

Yosuke Noda

Tomohisa Kishimoto

Shinichi Daikoku

Yoshiki Sato

Yoshikazu Matsuda

Yosuke Nakayama

Ryuma Marume

Norifumi Sasaoka

Ryohei Yamashita

Daisuke Matsuura

Toshiaki Moriwaki

Naoto Yamanaka

Takayuki Komai

Satoshi Shibasaki

Takashi Matsuo

Yukihiro Miura

Kazuhito Fukui

A method for manufacturing a circuit board includes: providing a first board including a post portion, and a second board defining an opening portion extending through a base material, the base material including a circuit pattern disposed on a first surface and an adhesive member disposed on a side of a second surface; and bonding the first board and the second board using the adhesive member by pressurizing and heating the first board and the second board in a state of the post portion being inserted in the opening portion and a top surface of the post portion being exposed from the second board. In a plan view, the second board includes a base material exposed portion. In the bonding, the adhesive member melted by the pressurizing and the heating is disposed between a lateral surface of the post portion and the second board.

Circuit board with convex shaped post, light emitting device, and manufacturing method therefor

A lighting device includes a light emitting element having element electrodes; a light guide member to receive incoming light from the light emitting element and to emit light spreading along a plane; and a substrate including a base substitute. Conductors are formed on a first surface of the base substrate. An adhesive member is formed on a second surface of the base substrate, and through-holes penetrating the substrate in a thickness direction of the substrate. The substrate is provided on the light emitting element via the adhesive member of the substrate such that a surface of the light emitting element is exposed through each of the through-holes to define a bottomed hole. Each of the element electrodes is connected to each of the conductors via a filler filling the bottomed hole. The filler has a lower surface than a surface carrying the conductors of the substrate in a cross-sectional view.

Lighting device with connection to element electrodes using filler

A printed circuit board includes a printed wiring board including an insulative substrate having a first surface and a second surface opposite to the first surface, and wiring provided on the second surface of the insulative substrate to face the through-holes. The insulative substrate has flexibility and through-holes passing through the insulative substrate from the first surface to the second surface. A semiconductor element is mounted on the first surface of the insulative substrate of the printed wiring board and has element terminals interposed between the printed wiring board and the semiconductor element. Conductive members filled in the through-holes connect the element terminals and the wiring. The insulative substrate has elasticity in which an elongation percentage of the insulative substrate is 20% or more. The wiring is formed from a conductive polymer or an elastic conductive paste in which conductive particles are mixed into a resin material.

Printed circuit board

A light emitting module includes: a base board; and a plurality of divisional planar light emitters disposed adjacent to each other on one surface of the base board. The base board includes: a plurality of conductive parts, a flexible base part joined to the conductive parts, and an insulating base part joined to the flexible base part. Each of the plurality of divisional planar light emitters includes: a plurality of wiring parts electrically connected with corresponding ones of the conductive parts of the base board, a plurality of light emitting elements each disposed on corresponding ones of the wiring parts, and a sealing part sealing the plurality of light emitting elements and facing the insulating base part.

Light emitting module and method for manufacturing same

A planar light source includes: a support member; a light guide member disposed on the support member and having a light source positioning part; and a light source disposed on the support member while being in the light source positioning part of the light guide member. The support member includes: an insulation base having a first face positioned closer to the light source and a second face positioned opposite the first face, a first conductive layer disposed on the first face of the insulation base and electrically connected to the light source, an adhesive layer disposed on and in contact with the first face of the insulation base and the first conductive layer, and a light reflecting sheet disposed on the adhesive layer.

Planar light source

A light emitting device including a first light emitting element that includes a first electrode having a first polarity and a second electrode having a second polarity that is different from the first polarity. The device has a circuit element that includes a main body, and first and second terminals electrically connected with one another via the main body. The device includes a first wiring having the first polarity connecting the first electrode of the first light emitting element and the first terminal, and a second wiring having the second polarity located in a layer common with a layer of the first wiring and including a portion elongated between the first terminal and the second terminal in a bottom view. An upper surface of the main body is positioned at a distance below an interface between a lower surface of the first wiring and the first electrode.

Light emitting device

A light-emitting device comprising a package comprising a light-emitting element comprising a first surface and a second surface opposite to the first surface, a first light-transmissive member arranged on the second surface of the light-emitting element, paired electrodes at the first surface of the light-emitting element, and a first covering member covering the light-emitting element such that the paired electrodes are exposed from the first covering member. The light-emitting device further comprises a light-guiding plate on which the package is placed, and a second covering member arranged on the light-guiding plate and covering laterally the package. The light-emitting device further comprises paired wirings continuously covering the paired electrodes exposed and the first covering members and being connected to the paired electrodes respectively. The paired wirings are formed by irradiation of laser light on a metal paste layer continuously covering the paired electrodes and the first covering member to remove the metal paste layer between the paired electrodes, the metal paste layer comprising a mixture of a resin and metal powder.

Method for manufacturing light-emitting device

A method of manufacturing a circuit substrate includes forming, in an insulating substrate and circuit patterns that are provided on a first surface and a second surface of the insulating substrate, a through-hole penetrating the insulating substrate and the circuit patterns, where the circuit patterns contain Cu as a main component. The method includes filling, in the through-hole, an electrically conductive paste that is a melting-point shift electrically conductive paste including Sn—Bi solder powder, Cu powder, and resin, and forming a protrusion obtained by causing the electrically conductive paste to protrude from the through-hole. The method further includes performing pressure treatment on the protrusion near the through-hole; and performing heat treatment on the insulating substrate whose protrusion is subjected to the pressure treatment and causing the circuit patterns and the electrically conductive paste to be electrically connected with each other.

Sn—Bi and copper powder conductive paste in through hole of insulating substrate

A surface-emitting light source includes: a wiring substrate including a wiring layer on a base member; a light-guiding plate having a first primary surface and a second primary surface facing the wiring substrate; a light-reflective resin portion having an opening and being disposed between the light-guiding plate and the wiring substrate; and a light source portion including an element electrode on a first surface thereof and a light-extracting surface on a second surface thereof that faces the light-guiding place. The element electrode is electrically connected to the wiring layer via the opening, which is equal to or smaller than an area in which a side surface of the light source portion contacts the resin portion. The resin portion and the light-guiding plate face each other and are bonded to each other, and the resin portion and the wiring substrate face each other and are bonded to each other.

Surface-emitting light source and method of manufacturing the same

A surface-emitting light source includes: light-emitting modules; a wiring substrate including a base member having a surface at a light-emitting modules side and a rear surface opposite to that, a wiring layer on the rear surface of the base member and including wiring pads being portions of the wiring layer, electrically-conductive members each supplied across corresponding two or more of a plurality of vias in each of the wiring pads, and a covering layer covering the wiring layer and defining openings in each of which a portion of a corresponding one of the wiring pads is exposed; and an adhesive layer between the light-emitting modules and the wiring substrate. Each light-emitting module has an array of light emitting devices. The covering layer defines the openings at locations corresponding to the wiring pads with an area dimension smaller than respective area dimensions of the wiring pads.

A light-emitting device including a light-emitting module, a first wiring and a second wiring. The light-emitting module includes one or more light-emitting elements and a package covering the one or more light-emitting elements. Each of the one or more light-emitting elements has a first electrode and a second electrode. The light-emitting module has a groove structure on a lower surface side. The first wiring and the second wiring are partially or entirely present in the groove structure. At least part of the first electrode and at least part of the second electrode are exposed to an inside of the groove structure. The first wiring is electrically connected with the first electrode, and the second wiring is electrically connected with the second electrode.

Light-emitting device including wirings in groove structure

A light emitting device includes a base, a first external terminal, a second external terminal, a plurality of wirings respectively electrically connecting the first external terminal and the second external terminal, and a plurality of light emitting elements each electrically connected to a corresponding one of the wirings. The wirings include a first wiring connecting the first external terminal and the second external terminal at a smallest distance, a second wiring longer than the first wiring, and a third wiring longer than the second wiring. The first, second, and third wirings have a substantially equal electric resistance. At least two of the first, second and third wirings are each provided with at least two of the light emitting elements with an average width in an intermediate region between adjacent ones of the light emitting elements being smaller than an average width in a region other than the intermediate region.

Light emitting device, and method of manufacturing light emitting device

A light-emitting module includes (i) a board provided with: a circuit pattern and a plurality of bottomed holes in each of a set of wiring pads continuous with the circuit pattern on a first surface; electrically conductive paste extending over two or more of the bottomed holes; and an insulating resin covering the electrically conductive paste at a side close to the first surface, and (ii) a plurality of light-emitting segments connected to a second surface of the board with an adhesive sheet interposed therebetween. The light-emitting segments each include a plurality of light-emitting devices that are aligned. The electrically conductive paste includes a portion disposed on a portion of a surface of the wiring pad extending over two or more of the bottomed holes.

Light-emitting module

A surface-emitting light source includes a plurality of light-emitting modules each including an array of a plurality of light sources and a wiring board disposed on an array of the plurality of light-emitting modules with an adhesive interposed therebetween. The plurality of light-emitting modules to be disposed on the wiring board are arranged such that a space is left between adjacent ones of the light-emitting modules. The adhesive contains a thermosetting resin and includes a penetrating portion inside the space. The penetrating portion includes a gap detached from a lateral surface of the light-emitting modules.

A light emitting module includes a first terminal part, a first light emitting device including a first electrode, a second light emitting device including a second electrode, a first conductive thin film including a first thin film region and a second thin film region, and a first conductive layer electrically connected to the first thin film region. The first thin film region electrically connects the first terminal part and the first electrode, and has a first current path length. The second thin film region electrically connects the first terminal part and the second electrode, and has a second current path length shorter than the first current path length. At least a portion of the first conductive layer overlaps with the first thin film region in a first direction that is perpendicular to a plane in which the first thin film region extends.

Growing community of inventors

Anan, Japan

Masaaki Katsumata