Sharp Kabushiki Kaisha Corporation

Kabushiki Kaisha Toshiba

Masaaki Katoh

Masatsugu Masuda

Tsukasa Inoguchi

Hiroyuki Katayama

Toshio Hata

Hiroshi Chikugawa

Teruo Tsutsumi

Jun Okazaki

Masataka Miyata

Nobuhiro Nishiyama

Masatoshi Omoto

Masaki Kondoh

Kazuhisa Murata

Masahiro Seko

Tsukasa Inoquchi

Keiji Takasugi

Naoki Sato

A light-emitting device includes a light-emitting element for emitting primary light, and a wavelength conversion unit for absorbing part of the primary light and emitting secondary light having a wavelength longer than that of the primary light, wherein the wavelength conversion unit includes plural kinds of phosphors having light absorption characteristics different from each other, and then at least one kind of phosphor among the plural kinds of phosphors has an absorption characteristic that can absorb the secondary light emitted from at least another kind of phosphor among the plural kinds of phosphors.

Light emitting device and fabricating method thereof

A light emitting device has a lead frame which has a lead frame body and a plurality of bumper sections raised from the lead frame body. A rectangular case member with a hole is mounted to the lead frame. A light emitting element is placed in the hole of the case member, which is filled with a sealing resin that seals the light emitting element. The bumper sections are arranged on two opposite sides of the case member. Tip surfaces of the bumper sections are at a level higher than or equal to an upper end surface of the case member.

Light emitting device and backlight device

A low-cost and productivity-oriented surface mount light-emitting device is provided. The light-emitting device includes an insulating film, at least one pair of land portionsandcomprising metal film pieces formed on the top surface of the insulating film, external connection terminal portionsandcomprising metal film pieces formed on the bottom surface of the insulating film, that are opposed to the land portionsandacross the insulating filmin one-to-one correspondence, through-conductorsandthat connect between the land portionsandand the terminal portionsandcorresponding to each other through the insulating film, and a light-emitting elementthat is electrically connected to the pair of the land portionsandand disposed in a unit section which contains the pair of the land portionsand

Light-emitting device with liquid-repellent layer and manufacturing method therefore

Light emitting device provided with a wavelength conversion unit incorporating plural kinds of phosphors

An outer lead connected to an inner lead penetrating a molded resin section, and another outer lead connected to another inner lead penetrating the molded resin section are provided on an outer wall surface of the molded resin section. The outer lead has a surface area greater than that of the another outer lead.

Semiconductor light-emitting device

An LED lamp has a convex lens 3 which has an upper portionand a lower portion. An upper curved surfaceA of the upper portion is different in shape from a lower curved surfaceA of the lower portionso as to refract rays of light from an LED chipmore strongly than the lower curved surfaceA does. This avoids reflection of incident outside light toward a front and hence prevents misrecognition. An interface plane Sbetween the upper and lower portionsandof the convex lensis located on an upper end faceA to thereby prevent collection of outgoing light upon the interface plane Sand generation of an irregular emission peak at the front.

Light emitting diode lamp and light emitting diode display unit

An electronic equipment includes a light source, in which light of the light source is guided and emitted from an operation member having translucent properties via an optical waveguide, wherein a phosphor emitting visible light by being excited by the light from the light source is contained in a path through which the light of the light source is guided. A backlight structure in which a light source is provided in a printed substrate that is inside a casing having a waveguide plate, and light of the light source is transmitted through the waveguide plate and emitted, wherein a wavelength-converting phosphor that emits light by being excited by the light of the light source is provided in a waveguide path leading to a point where the light of the light source is transmitted through the waveguide plate and is emitted out, except the light source and the printed substrate.

Electronic equipment, backlight structure and keypad for electronic equipment

A current of the same amount or in a constant ratio is applied to each of a combination of a blue light emitting diode having a small wavelength variation and a green light emitting diode having a large wavelength variation. With this, as an amount of applied current increases, an oscillation wavelength of the green light emitting diode having the large wavelength variation changes from a long wavelength side to a short wavelength side and mixes with a blue color of the blue light emitting diode having the small wavelength variation to gradually change chromaticity as a whole. When desired chromaticity is obtained, the amount of the current is fixed.

Light emitting apparatus generating white light by mixing of light of a plurality of oscillation wavelengths

The present invention provides a surface-mounted LED that is easy to be made thin and having high reliability, as well as provides its manufacturing method. Specifically, the present invention provides a light-emitting diode having a light-emitting diode chip mounted on a surface of a printed substrate, this light-emitting diode chip comprising a substrate; a semiconductor layer laminated on the substrate and comprising an N-type semiconductor layer and a P-type semiconductor layer, wherein its PN junction surface is perpendicular to the surface of the printed substrate and a portion in the vicinity of the PN junction surface is rendered to be a light-emitting portion; a pair of electrodes that applies voltage to the semiconductor layer; and a light reflecting layer formed on the front surface or back surface of the light-emitting chip or in the chip so as to be approximately parallel to the PN junction surface, this light reflecting layer reflecting light emitted from the light-emitting portion.

Light-emitting diode and its manufacturing method

An LED lamps capable of composing a display panel that is installed at any outdoor place and capable of displaying an image thereon with a high contrast under any working conditions at any place. The LED lamp comprises at least one LED chip for emitting visible light, a lead frame comprising a common part and separate parts for supplying electric power to each of electrode terminals of the LED chip and a transparent resin part disposed on the common lead frame for mounting the LED chip and converging light emitted from the LED chip, wherein the LED-chip-mounted surface is provided with an anti-reflection black-colored layer for absorbing light. The LED chip may be a four-element LED chip composed of an active layer of AlGaInP and the light-absorbing layer formed from any of black silver sulfide, silver oxide, iron oxide, chromium oxide, black silver paste and black copper paste.

LED lamp configured to minimize image contrast

A light emitting element having a cavity at the center of the top surface of an insulating block body. A through-hole extends downward through the block body to the bottom of the cavity. A metallic layer is present on the sides and bottom of the cavity, the sides of the through-hole, the bottom surface and part of the side surfaces of the block body. An LED chip is disposed on the metallic layer to the side of the bottom of the cavity. The LED chip and the metallic layer formed on a side of the bottom of the cavity separate from the first side are connected by a metallic wire. The cavity and the through-hole are filled with resin for encapsulating the LED chip.

Leadless chip-type light emitting element

An LED array comprising a substrate, a plurality of first LEDs, and a plurality of second LEDs, wherein the range of wavelengths of light from the first LEDs is different from the range of wavelengths of light from the second LEDs; the first LEDs and the second LEDs are respectively connected in series so that a current alternatively flows through the first LEDs and the second LEDs in the opposite directions; the first LEDs connected in series and the second LEDs connected in series are further connected in parallel; and the first LEDs and second LEDs are arranged in a line on the substrate.

Growing community of inventors

Osaka, Japan

Masaaki Katoh