Murata Manufacturing Co., Ltd.

Masaaki Kanae

Takuji Nakagawa

Makoto Inai

Yoshifumi Ogiso

Nobuyoshi Okuda

Atsushi Kobayashi

Masaaki Sueyoshi

Naoki Hayasaka

Keizou Inoue

Provide an electronic component that has a hollowed structure and is capable of suppressing the deformation of the hollowed structure due to the pressure during the module resin molding. The electronic component includes a device substratea driver portionformed on one of the principle surfaces of the device substratea protection portionconfigured to cover the driver portionso as to form a hollowed spacearound the driver portionan adhesion layerthat is made of a resin and arranged above the protection portionand a reinforcing platearranged on the adhesion layerwherein the reinforcing plateis a silicon substrate.

Electronic component having a reinforced hollowed structure

A method for producing an electronic component module prevents a space from collapsing. The method includes a step of preparing an electronic component including an element substrate, a drive device formed on a principal surface of the element substrate, and a protection device covering the drive device so as to form a space around the drive device; a step of fixing the electronic component on a common substrate such that a principal surface of the common substrate and another principal surface of the element substrate face each other; a step of fixing a reinforcing plate on the protection device of the electronic component; and a step of forming a resin layer on the principal surface of the common substrate such that the electronic component is contained therein.

Method for manufacturing electronic component module

Provide an electronic component that has a hollowed structure and is capable of suppressing the deformation of the hollowed structure due to the pressure during the module resin molding. The electronic component includes a device substrate, a driver portionformed on one of the principle surfaces of the device substrate, a protection portionconfigured to cover the driver portionso as to form a hollowed spacearound the driver portion, an adhesion layerthat is made of a resin and arranged above the protection portion, and a reinforcing platearranged on the adhesion layer, wherein the reinforcing plateis a silicon substrate.

Electronic component module

A high-frequency module includes first and second switch IC elements and a substrate. The first and second switch IC elements are the same or substantially the same IC chips, and are mounted in the same or substantially the same orientation. The first switch IC element is mounted on the substrate. The second switch IC element is mounted above the first switch IC element. Due to wire bonding, the individual pad electrodes of the first and second switch IC elements are connected to the land electrodes of the substrate, which are to be connected to the individual pad electrodes. Between a pad electrode and a land electrode connected to each other, another land electrode is not provided.

High-frequency module

A semiconductor chip production method in which, when a semiconductor chip is formed by severing from a semiconductor wafer, a short side of a semiconductor device is arranged and disposed along a direction which is parallel to a crystal orientation direction, and a severing area along the short side of the semiconductor device is formed so that its width is smaller than the width of a severing area along a long side of the semiconductor device. Further, the widths of the severing areas along the long and short sides of the semiconductor devices are formed so that after severing, the ratio between the long sides and the short sides of the semiconductor chips is smaller than the ratio between the long sides and the short sides of the unseparated semiconductor devices. The invention aims at preventing a reduction in the mechanical strength of a rectangular semiconductor chip having vertical and horizontal dimensions that are different from each other, when producing the rectangular semiconductor chip.

Semiconductor chip production method and semiconductor wafer

A semiconductor device includes an element formed on a first surface of a semiconductor substrate, a via-hole passing through the semiconductor substrate from the first surface to a second surface of the semiconductor substrate, and an electrode formed on the inner wall of the via-hole, the electrode passing through the semiconductor substrate from the first surface to the second surface. The electrode in the via-hole is electrically connected to at least one electrode of the element; the semiconductor substrate is mounted on a surface mount board; and the electrode formed on the inner wall of the via-hole is electrically connected to an electrode of the surface mount board by a conductive bonding material, such as a conductive adhesive. A method for fabricating the semiconductor device is also disclosed.

Semiconductor device and method for making the same

A magnetoresistance element includes an insulating substrate, a patterned magnetoresistance film of a ferromagnetic material deposited thereon and having a uniaxis magnetic anisotropy, and a patterned hard biasing layer of a ferromagnetic material deposited on the substrate. The biasing layer is divided into two parts on both sides of the magnetoresistance layer and magnetized in the direction parallel to a line which intersects the easy direction of magnetization of the patterned magnetoresistance layer at an acute angle (.theta.).

Growing community of inventors

Nagaokakyo, Japan

Masaaki Kanae