Seiko Epson Corporation

Kitagawa Industries Co., Inc.

Masaaki Ito

Masahiro Saito

Yasuhiro Kawaguchi

Toru Matsuzaki

Toshiyuki Omori

Kensuke Mitsuya

Tsutomu Yamazaki

Hiroki Godo

A connector device includes a housing, a plurality of first couplers each of which has a first coupling part electrically coupled to a first counterpart coupler of a counterpart connector device, a plurality of second couplers each of which has a second coupling part electrically coupled to a second counterpart coupler of the counterpart connector device, and a ground member electrically coupled to a counterpart ground member of the counterpart connector device. The first coupling parts are arranged side by side so as to be exposed from the housing along a first surface. The second coupling parts are arranged side by side so as to be exposed from the housing along a second surface. The ground member is arranged between the first couplers and the second couplers, and is arranged along a coupling direction in which the connector device and the counterpart connector device are coupled to each other.

Connector device, circuit board, circuit board unit, and electronic apparatus

A thermally conductive composition is provided, which has a base material; and at least one of a permittivity adjusting filler having a lower permittivity than the base material and a high permeability filler having a higher permeability than the base material. The entire thermally conductive composition has a relative permeability higher than 1 and a relative permittivity of 7 or lower.

Thermally conductive composition

A heat conducting member includes: a magnetic substance-containing layer containing a magnetic substance, the magnetic substance being oriented along a predetermined orientation direction; and a metal-containing layer containing a metal body including a surface crossing the orientation direction of the magnetic substance.

Heat conducting member, printed circuit board, and electronic apparatus

A printed circuit board includes a printed wiring board having a mounting surface facing a first side, an electronic element provided on the mounting surface, a heat dissipation member disposed on the first side with respect to the electronic element, and a heat conduction member disposed between the electronic element and the heat dissipation member and having a first surface facing the first side and a second surface facing a second side opposite to the first side. The heat conduction member has a high relative magnetic permeability portion and a low relative dielectric constant portion. The high relative magnetic permeability portion surrounds the low relative dielectric constant portion on at least the second surface of the heat conduction member. At least part of the low relative dielectric constant portion overlaps the electronic element in a plan view seen in a direction perpendicular to the mounting surface.

Printed circuit board, electronic device and heat conduction sheet

A printed circuit board includes a plurality of metal layers, a plurality of insulating layers provided between the respective metal layers of the plurality of metal layers, and an electronic device provided on one metal layer of the plurality of metal layers. The plurality of metal layers include a first outer metal layer and a second outer metal layer located on the outermost side of the plurality of metal layers and a plurality of intermediate metal layers located between the first outer metal layer and the second outer metal layer. At least one of the plurality of intermediate metal layers is a thick metal layer thicker than the first outer metal layer and the second outer metal layer. The thick metal layer is connected to one of a ground terminal of the electronic device and a power supply terminal of the electronic device.

Printed circuit board and electronic apparatus

A printed wiring board includes a differential transmission line having a first wiring and a second wiring. The first wiring has a plurality of first linear portions formed of linear wiring and extending in a first direction, and a first bypass portion that is connected to the plurality of first linear portions and includes a linear wiring. The second wiring has a plurality of second linear portions formed of linear wirings and extending in a second direction substantially parallel to the first direction, and a second bypass portion that is connected to the plurality of second linear portions and includes a curved wiring. The first bypass portion and the second bypass portion protrude on the same side. A region in which the first bypass portion is provided and a region in which the second bypass portion is provided are at least partially overlapped in the first direction.

Printed wiring board, information communication device, and display system

The invention provides a heat dissipater such as a heat dissipation member that dissipates heat of an integrated circuit that is formed on a flexible substrate such as a flexible printed circuit board. The heat dissipater according to an aspect of the invention includes; a main body section that is formed in the shape of a hollow sleeve in such a manner that the flexible substrate can be inserted through and inserted inside the main body section; and an adhering section that is formed on an inner surface of the main body section in such a manner that the main body section and the integrated circuit are adhered to each other via the adhering section.

Electro-optical device and electronic apparatus

A tape printer for printing on a tape contained within a tape cassette. The tape cassette is insertable in and removable from the tape printer. The tape printer includes a housing and a printing mechanism supported on the housing for selectively printing on the tape. The printer also includes a tape conveying mechanism supported on the housing for conveying the tape across the printing mechanism. The printing mechanism and tape conveying mechanism are displaceable between first operative positions and second disengaged positions. A cover is pivotably supported on the housing. A coupling mechanism couples the cover to the printing and tape conveying mechanisms. The cover is displaceable between a first open position to actuate the coupling mechanism to move the printing and tape conveying mechanisms to their second disengaged positions and a second closed position to actuate the coupling mechanism to move the printing and tape conveying mechanisms to their first operative positions.

Growing community of inventors

Ina, Japan

Masaaki Ito