Nishihara Rikoh Corporation

Toyo Ink Manufacturing Company

Masaaki Ishiyama

Masayoshi Utsugi

Shinya Fujimatsu

Takashi Mihoya

Kouichi Iibuchi

Takeaki Matuura

The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for solder (tin-lead alloy), and aims at providing alloy plating which has been put to a practical use in such a way that the function of existing alloy plating of this type has been significantly improved to eliminate toxic plating from various kinds of electronic components for use in electronic devices so that it is useful in protecting the environment.

Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied

Functional Sn-Bi alloy plating using a substitute material for Pb

An aqueous dispersion of an aqueous polyurethane having an ionic functional group, polyoxyethylene units and terminal hydrazine functional groups is provided. Content of the ionic functional group is about 5 to about 180 milliequivalent per 100 g of the aqueous polyurethane, and content of the polyoxyethylene unit is about 20% by weight or less of a weight of the aqueous polyurethane. The aqueous dispersion is used for a composition for ink, coating or adhesive. Storage stability, water resistance, pigment dispersibility, and adhesion to various kinds of substrates, particularly non-polar substrates, of the aqueous dispersion and the composition are excellent.

Aqueous dispersion of an aqueous hydrazine-terminated polyurethane

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Tokyo, Japan

Masaaki Ishiyama