Neomax Materials Co., Ltd.

Hitachi Metals, Ltd.

Sumitomo Special Metals Co., Ltd.

Daishinku Corporation

Proterial, Ltd.

Neomax Co., Ltd.

Sumitomo Special Metal Co. Ltd.

Aoyama Seisakusho Ibaraki Plant Co., Ltd.

Masaaki Ishio

Yoshimitsu Oda

Kazuhiro Shiomi

Tsuyoshi Hasegawa

Masaharu Yamamoto

Shinji Yamamoto

Minoru Iizuka

Kenji Ikeuchi

Keita Watanabe

Toshiaki Fujita

Yoshikiyo Ogasawara

Akio Hashimoto

Fumiaki Kikui

Ken Yamamoto

Takayuki Hayashi

Yoshitsugu Sakamoto

Kenji Hirano

Hidetoshi Noda

Norihide Kawachi

Yasuto Nozawa

Masayuki Yokota

Masami Ueda

Junya Nishina

Ryouji Inoue

Masaaki Tomita

Naonori Ishii

Hirofumi Nakano

Shunji Kajikawa

Kenichi Funamoto

Kenichiro Kamon

Yoshiki Takai

Minoru Suenaga

An electrical connection member () includes a clad material () including at least both a first Cu layer () made of a Cu material and a low thermal expansion layer () made of an Fe material or Ni material having an average thermal expansion coefficient from room temperature to 300° C. smaller than that of the first Cu layer, the first Cu layer and the low thermal expansion layer being bonded to each other.

Electrical connection member, electrical connection structure, and method for manufacturing electrical connection member

A high-temperature bimetal capable of being inhibited from considerably shifting from an original position when the temperature has fallen to an ordinary temperature is provided. This high-temperature bimetal () includes a high thermal expansion layer () made of austenitic stainless steel and a low thermal expansion layer () made of a thermosensitive magnetic metal having a Curie point and bonded to the high thermal expansion layer. The high-temperature bimetal is employed over both a high temperature range of not less than the Curie point and a low temperature range of less than the Curie point, while an upper limit of operating temperatures in the high temperature range of not less than the Curie point is at least 500° C.

High-temperature bimetal

A high-temperature bimetal capable of being inhibited from considerably shifting from an original position when the temperature has fallen to an ordinary temperature is provided. This high-temperature bimetal (1) includes a high thermal expansion layer (2) made of austenitic stainless steel and a low thermal expansion layer (3) made of a thermosensitive magnetic metal having a Curie point and bonded to the high thermal expansion layer. The high-temperature bimetal is employed over both a high temperature range of not less than the Curie point and a low temperature range of less than the Curie point, while an upper limit of operating temperatures in the high temperature range of not less than the Curie point is at least 500° C.

Thermosensitive deformation apparatus

A battery terminal includes a shaft portion and a flange portion. The battery terminal is made of a clad material in which at least a first metal layer and a second metal layer are bonded to each other. Each of the shaft portion and the flange portion includes the first metal layer on a first side in a shaft direction and the second metal layer on a second side in the shaft direction. The first metal layer in the shaft portion includes a protruding portion that further protrudes to the second side in the shaft direction with respect to a surface of the first metal layer on the second side in the shaft direction in the flange portion.

Battery terminal, method for manufacturing battery terminal, and battery

This metal substrate for a dye-sensitized solar cell includes a clad material including a nonporous first metal layer, arranged on an anode side of a dye-sensitized solar cell element, made of a metal having corrosion resistance against an electrolyte of the dye-sensitized solar cell element and a second metal layer made of a metal having lower electrical resistance than the first metal layer and bonded to a side of the first metal layer opposite to the dye-sensitized solar cell element.

Metal substrate for dye-sensitized solar cell

An aluminum copper clad material has excellent bonding strength and includes an aluminum layer and a copper layer that are bonded without a nickel layer interposed therebetween. The aluminum layer and the copper layer are diffusion-bonded via an Al&#x2014;Cu intermetallic compound layer. The copper layer satisfies Dcs&#x2266;0.5&#xd7;Dcc, where Dcc represents the average crystal grain size of crystal grains in a central portion in the thickness direction of the copper layer, and Dcs represents the average crystal grain size of an interface adjacent portion Cin the copper layer that is about 0.5 &#x3bc;m apart from the interface between the copper layer and the intermetallic compound layer. The intermetallic compound layer has an average thickness of about 0.5 &#x3bc;m to about 10 &#x3bc;m.

Aluminum copper clad material

The present invention relates to a lithium ion battery employed by connecting the positive electrode side to a negative electrode portion made of Cu or a Cu alloy by a bus bar made of Al or an Al alloy and provides a negative electrode terminal for a lithium ion battery capable of providing sufficient bonding strength between the negative electrode portion and the bus bar when the negative electrode portion and the bus bar are metallurgically bonded to each other by resistance welding or the like, for example. This negative electrode terminal for a lithium ion battery is made of a clad material having a first metal layer made of Al or an Al alloy and a second metal layer made of Cu or a Cu alloy bonded to each other through a reaction-suppressing layer suppressing a reaction therebetween.

Negative electrode terminal and cover member for lithium ion battery, and lithium ion battery

A negative electrode terminal for a battery in which a first metal layer and a second metal layer hardly separate from each other is provided by inhibiting an intermetallic compound from being formed between the first metal layer and the second metal layer. This negative electrode terminal () for a battery is composed of a clad material formed by bonding a first metal layer (), made of Al, including a first region connected with a battery terminal connecting plate and an adjacent second region on the same surface side as the first region and a second metal layer (), made of Ni, connected with battery negative electrodes, while the second metal layer is arranged to be stacked on the first metal layer in the second region of the first metal layer.

Negative electrode terminal for battery and method for producing negative electrode terminal for battery

A battery terminal includes an overlay clad plate material including at least a first metal layer made of Al or Al alloy and a second metal layer made of Cu or Cu alloy, formed by bonding at least the first metal layer and the second metal layer to each other in the thickness direction. Either the first metal layer or the second metal layer of the clad plate material is partially removed to form an exposure surface on which either the second metal layer or the first metal layer is exposed in the clad plate material.

This chassis () is made of a clad material in which a first layer () made of austenite stainless steel, a second layer () made of Cu or a Cu alloy, stacked on the first layer, and a third layer () made of austenite stainless steel, stacked on the side of the second layer opposite to the first layer are roll-bonded to each other, and the thickness of the second layer is at least 15% of the thickness of the clad material.

Chassis and method for manufacturing chassis

A connection plate for battery terminals capable of inhibiting a first member and a second member from being detached from each other is provided. This bus bar(connection plate for battery terminals) includes a first member () including a first hole () and an embedding hole (), made of first metal and a second member () having a second hole (), including a base () made of second metal, embedded in the embedding hole of the first member, while an intermetallic compound layer () containing at least one of the first metal and the second metal is formed on an interface between the embedding hole of the first member and the second member.

Connection plate for battery terminals and method for manufacturing connection plate for battery terminals

A negative-electrode terminal for a cell in which separation between a first metal layer and a second metal layer hardly takes place is provided by suppressing excess formation of an intermetallic compound on a bond interface between the first metal layer and the second metal layer. This negative-electrode terminal for a cell includes a clad portion formed by bonding a first metal layer made of Al or an Al alloy and a second metal layer containing Ni and Cu and consisting of one or a plurality of layers to each other. The first metal layer includes a connected region connected with a cell terminal connecting plate and a stacked region adjacent to the connected region on the side of the same surface, while the second metal layer is bonded to the first metal layer in the stacked region and configured to be connectable to cell negative electrodes of cells.

Negative-electrode terminal for cell

An aluminum bonding alloy is an Ni&#x2014;Mg alloy for bonding aluminum and a non-aluminum metal selected from steel, copper, nickel or titanium. The Ni&#x2014;Mg alloy consists essentially of 0.08-0.90 mass % Mg, and the balance of Ni and inevitable impurities. A clad material includes a non-aluminum metal layer made of the non-aluminum metal and a bonding alloy layer made of the aluminum bonding alloy. The non-aluminum metal layer and the bonding alloy layer are bonded together by pressure welding and diffusion bonding.

Aluminum bonding alloy, and clad material and aluminum bonding composite material each having bonding alloy layer made of the alloy

A clad plate includes an aluminum plate and a hard metal plate joined together at side end surfaces thereof. Side end surfaces of an aluminum plate and a hard metal plate are jointed together via a nickel layer by pressure welding. A ridge and a groove formed in the side end surface of the aluminum plate are respectively engaged and joined, via the nickel layer, to a groove and a ridge formed in the side end surface of the hard metal plate, and an end portion of the nickel layer extends beyond the rear end portion of the side end surface of the aluminum plate and is jointed to the plate surface of the aluminum plate with the end portion exposed thereon. The average width W of the exposed portion of the nickel layer exposed on the plate surface is preferably from about 0.2 mm to about 1.5 mm.

Growing community of inventors

Osaka, Japan

Masaaki Ishio