Shipley Company LLC

Rohm & Haas Electronic Materials LLC

Masaaki Imanari

Yu Luo

Hidemi Nawafune

Elissei Iagodkine

Yi Qin

Hideki Tsuchida

Koichi Yomogida

Motoya Shimazu

Yasuo Ohta

Yasushi Takizawa

Masaru Seita

Inho Lee

Yoshihiro Sugita

Fai Lung Ting

This invention offers a method for forming a resin composite material, containing the steps of: (1) treating the surface of a carrier resin to treatment introduce ion exchange groups, (2) introducing metal ions to treat the carrier resin surface by treating the surface of said carrier resin with a solution containing metal ions, (3) converting said metal ions to a component containing a metal element, (4) forming a metal foil on top of said component containing a metal element, and (5) transferring said metal foil to a resin substrate by heating said metal foil. This method provides a carrier resin substrate having a metal foil of any desired thickness laminated or cast onto it. In this way a carrier resin containing a metal foil, particularly a copper foil, having a thickness, such as 8 &#x3bc;m or less, can be prepared that is otherwise difficult to prepare using conventional methods.

Method for forming resin composite material

A method for forming copper-resin composite materials is disclosed. This method affixes a palladium or palladium-tin catalyst onto resin substrate, and then subjects the catalyst-containing resin to an electroless copper plating bath without performing a catalyst acceleration treatment step.

Method for manufacturing copper-resin composite material

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Misato, Japan

Masaaki Imanari