Namics Corporation

Masaaki Hoshiyama

Toyokazu Hotchi

Hiroki Myodo

Toshiaki Enomoto

Toshiyuki Sato

Yoshihide Fukuhara

Hiromi Saito

Kenichi Tosaka

Yosuke Sakai

Arata Hayashigaki

There are provided a syringe filled with a resin composition and a storage method thereof. According to the syringe and the storage method, mixed air, which causes the resin composition to be intermittently discharged from the syringe, is suppressed. The syringe filled with the resin composition includes a syringe, a resin composition filling the syringe, and a plunger. The resin composition contains voids. The ratio of the volume of the voids relative to the volume of the resin composition is 1.0 ppm by volume to 520 ppm by volume. The voids have a maximum diameter of 2,500 μm or less.

Syringe filled with resin composition and storage method therefor

There is provided a syringe filled with a resin composition which prevents a barrel cap from being detached due to temperature change during storage or during transportation, a production method thereof, and a storage method thereof. This syringe filled with the resin composition includes a syringe having a syringe barrel, a resin composition filling the syringe barrel, a plunger inserted in the syringe barrel, a barrel cap blocking an opening of the syringe barrel, and a spatial part between the plunger and the barrel cap in the syringe barrel. The pressure of the spatial part in a frozen state is 50 kPa to 92 kPa.

Resin composition-filled syringe, and production method and preservation method for same

There is provided a pre-applied semiconductor sealing film for curing under pressure atmosphere as a non conductive film (NCF) suitable for pressure mounting. This NCF includes (A) a solid epoxy resin, (B) an aromatic amine which is liquid at room temperature and contains at least one of structures represented by formulae 1 and 2 below, (C) a silica filler, and (D) a polymer resin having a mass average molecular weight (Mw) of 6000 to 100000. The epoxy resin of the component (A) has an epoxy equivalent weight of 220 to 340. The component (B) is included in an amount of 6 to 27 parts by mass relative to 100 parts by mass of the component (A). The component (C) is included in an amount of 20 to 65 parts by mass relative to 100 parts by mass in total of the components. A content ratio ((A):(D)) between the component (A) and the component (D) is 99:1 to 65:35. This NCF further has a melt viscosity at 120&#xb0; C. of 100 Pa&#xb7;s or less, and has a melt viscosity at 120&#xb0; C., after heated at 260&#xb0; C. or more for 5 to 90 seconds, of 200 Pa&#xb7;s or less.

NCF for pressure mounting, cured product thereof, and semiconductor device including same

An object of the present invention is to provide a semiconductor device in which peeling between a mold resin and a substrate is suppressed. A semiconductor deviceincludes a semiconductor chipand a substratethat are molded with a mold resin layerThe semiconductor deviceincludes a resin layerhaving a thickness of 200 nm or less different from the mold resin layerbetween the cured mold resin layerand the substrateThe resin layerpresent between the mold resin layerand the substrateis preferably present on a periphery of 30% or more of the chip when an entire peripheral length of the chip is 100%.

Semiconductor device

Provided is a thermosetting resin composition, which can be used as underfill for obtaining favorable solder connectivity while suppressing the formation of voids in the case of treating under heating conditions required by the underfill in a semiconductor chip thermocompression bonding step using the thermal compression bonding technique. The thermosetting resin composition contains a thermosetting resin, a curing agent and a fluxing agent, and the temperature at which the rate of temperature change of viscosity when temperature is increased according to a prescribed heating profile reaches 30 Pa&#xb7;s/&#xb0; C. is 200&#xb0; C. to 250&#xb0; C.

Thermosetting resin composition and method of producing same

A method of predicting viscosity behavior of a thermosetting resin is provided that is capable of predicting viscosity behavior of a thermosetting resin and void generation in the underfill is suppressed while good solder connection is obtained. The method includes: measuring a reaction rate and measuring viscosity behavior to measure a calorimetry peak and viscosity behavior of the thermosetting resin with three or more rates of temperature increase respectively; fitting a reaction rate to fit measurement data with each rate of temperature increase obtained by the measuring a reaction rate to a Kamal model formula to obtain fitting curves; fitting viscosity behavior to fit parameters in the Kamal model formula and the measurement data for each rate of temperature increase obtained by the measuring viscosity behavior to a Castro-Macosko model formula to obtain fitting curves; and calculating virtual viscosity behavior to calculate virtual viscosity behavior of the thermosetting resin at the arbitrary rate of temperature increase by simulation based on each fitting curve for each rate of temperature increase obtained by the fitting viscosity behavior.

Method of predicting viscosity behavior of thermosetting resin, simulation software, method of producing thermosetting resin, and underfill produced in the production method

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Niigata, Japan

Masaaki Hoshiyama