Murata Manufacturing Co., Ltd.

Masaaki Hirayama

Tomoaki Onoue

Yoshinori Saito

Yoshiki Aburatani

Shunjiro Imagawa, Deceased

A conductive resin composition which includes (a) a curable resin and (b) hard spherical carbon formed by coating the surface of a spherical base carbon particle with fine carbon particles and/or pitch-derived fine carbon pieces is used to electrically bond two conductive elements. The conductive resin composition is supplied to a space between areas of at least two works respectively having the areas to be electrically connected to each other, and the conductive resin composition is cured while applying a pressure between the areas.

Conductive resin composition, method for manufacturing electronic component using same, bonding method, bonding structure, and electronic component

Disclosed is a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a dimethylpolysiloxane having epoxy groups at its both ends, and (C) a dispersing agent comprising the reaction product of (C-1) a dimethylpolysiloxane having amino groups or carboxyl groups reactive with epoxy resins at its side chains or both ends and having phenyl groups or polyether groups for improving its compatibility with epoxy resins at its side chains, and (C-2) an epoxy resin having the same structure as the component (A). The composition has a reduced internal stress, while maintaining the heat resistance intrinsic to epoxy resins, and has excellent resistance, crack resistance and heat shock resistance.

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Nagaokakyo, Japan

Masaaki Hirayama