Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Masaaki Hayama

Takeo Yasuho

Hayami Matsunaga

Eiji Kawamoto

Kazuhiro Miura

Noboru Mohri

Noboru Mouri

Masayuki Mizuno

Keiichi Nakao

Akira Hashimoto

Hiroshi Higashitani

Koji Hashimoto

Masaaki Katsumata

Hiroki Yabe

Michiaki Tsuneoka

Yoshihisa Takase

Yuji Yagi

Tomitarou Murakami

Masaya Nakatani

Tetsuya Tsurunari

Yuki Satoh

Yoshiharu Omori

Yuji Mido

Kenji Nagatomi

Kozo Murakami

Akio Oki

Toshio Sugawa

Takuya Hayashi

Morio Nakatani

Satoshi Murakawa

Yoshiyuki Matsumura

Noboru Mori

Tetsu Murakawa

Mitsuteru Yamada

The present invention provides a sample holding carrier that can accurately measure a sample with a simple configuration, and a fluorescence detection system and device that use the same. Biosensor substrate includes: base substrate on which excitation light is incident from a lower surface; reflecting film that is arranged on an upper surface of base substrate to partially reflect the excitation light; and plural wells that are arranged on an upper surface side of reflecting film and have bottom surface portions. The excitation light is converged to be incident on base substrate. Distance from reflecting surface that is of a boundary between reflecting film and base substrate to bottom surface portion of well is less than or equal to a focal depth of the excitation light. Therefore, the sample accommodated in bottom surface portion of well can surely and efficiently be irradiated with the excitation light, and accurately be measured.

Sample holding carrier, and fluorescence detection system and fluorescence detection device that use same

A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.

Circuit board and method of manufacturing the same

A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove () is formed in a solder resist () located between two electrodes () to which a circuit component () is connected. A configuration is used in which the space between the first groove () and circuit component () is filled with a first insulating resin ().

Circuit-component-containing module

The present invention provides a circuit substrate which has a substrate including a first surface and a second surface opposite to the first surface. A first and a second conductor patterns are formed on the first and the second surface respectively. The second surface has larger surface roughness than the first surface. When the circuit substrate is mounted on another substrate, it is mounted to the other substrate via the second surface. The circuit substrate is capable of mounting a device or being mounted on another substrate to form an apparatus.

Circuit substrate and apparatus including the circuit substrate

A module component with a good shield effect and a low height including a circuit board having mounted thereon a mount device including an electronic part. The device is sealed with a sealing body having a metal film formed on the sealing body surface. A ground pattern is formed at the outer periphery of the principal surface of the circuit board. The metal film is conductively connected with the ground pattern.

Module part

A module includes a component, a circuit board having the component mounted thereon, a first grounding pattern formed on an outermost periphery of a surface portion of the circuit board; a first sealer provided on the circuit board and having a dimension projected on the circuit board, and a metal film covering the sealer and connected to the grounding pattern. The dimension of the first dealer is smaller than an outside dimension of the circuit board. The first sealer is made of first resin and sealing the component. The module has a low profile and is adequately shielded.

Module component

A module component which includes circuit substratehaving one or more componentson at least one of the surfaces, and junction circuit substratehaving hollowor hole, disposed corresponding to the portion of the one or more componentsmounted on the one surface of circuit substratefor fitting the mounted componentsin. These substrates are laminated to form a single body so that mounted componentsis contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

A module includes an electronic component having at least two electrodes, a board having electrodes on its surface to be connected to the electrodes of the electronic component, respectively, solders for connecting the electrodes of the electronic component to the electrodes of the board, respectively, an insulating resin covering the electronic component, the surface of the board, the solder, and the electrodes, and solder resists provided on the surface of the board and around the electrodes of the board, respectively. One of the solder resists is separated from the other electrode at a portion between the electronic component and the board. When this module is mounted on a motherboard, the solder does not flow out of the electrodes even when the solder in the insulating resin melts.

Electronic component-built-in module

A voltage converter module is formed by multi-layering a first connecting layer, a first inner wiring layer, a component built-in layer, a second inner wiring layer, a second connecting layer, and a capacitor-mounted layer, and a capacitor built-in layer with resin composite. A connecting terminal formed on a terminal surface of the first connecting layer, the first inner wiring layer, the second inner wiring layer and the capacitor-mounted layer are electrically coupled to each other through via-hole conductors. The second inner wiring layer couples a voltage converter IC to peripheral components, both being incorporated in the component built-in layer. A first capacitor and a second capacitor incorporated in the capacitor built-in layer are mounted to the capacitor-mounted layer. This structure forms a circuit, in which the first capacitor is coupled to the second capacitor, between the voltage converter IC and the grounding.

Voltage converter module

A multilayer ceramic substrate has a first conductive pattern that is transfer-printed on a ceramic substrate using an intaglio plate made of a flexible resin. The intaglio plate has a plurality of grooves with different depts. A first insulation layer is on the first conductive pattern, and a second conductive pattern is on the insulating layer. The two conductive patterns are coupled by a via.

Multilayer ceramic substrate utilizing an intaglio plate with a plurality of grooves having different depths

The present invention provides a method of manufacturing a low-temperature sintering multilayer ceramic wiring board comprising the steps of: forming a wiring layer by printing conductive paste () on an unfired green sheet (); forming a laminate by laminating, on at least one side of a ceramic substrate, the unfired green sheet having the wiring layer; and firing the laminate. The present invention also provides paste for use with this method. In the firing step, after an adhesive layer () or binder resin in said green sheet used for lamination burns, glass ceramic in the green sheet starts to sinter, and upon or after the start of sintering of the glass ceramic, conductive particles in the conductive paste starts to sinter. This manufacturing method can provide an precise wiring board without pattern deformation and also provide a low-temperature ceramic multilayer wiring board that has no cracks in the glass ceramic on the periphery of electrodes and has electrodes of a dense film structure.

Method of manufacturing multilayer ceramic wiring board and conductive paste for use

A module component includes a wiring circuit pattern formed on an insulated resin layer, and a connecting conductor, which is formed within the insulated resin layers, for electrically connecting at least two of the wiring circuit patterns each other. The module component further includes an active component and a passive component, which are formed on at least one of the wiring circuit patterns and electrically connected thereto, and a coil formed within a laminated member. The coil is formed of a coil pattern made of a conductive material, and formed on the insulated resin layer. Magnetic materials, which are formed on the insulated resin layers, sandwich the coil pattern.

A small radio-frequency hybrid switch module is provided for switching between transmitted signals and received signals in plural frequency bands. This module includes: a laminated body including a dielectric layer; a diplexer; a switching circuit; a low pass filter (LPF); a conductive pattern provided on the dielectric layer for forming at least one of the diplexer, the switching circuit and the LPF; a surface acoustic wave (SAW) filter mounted on the laminated body; a cover provided on the SAW filter for forming a cavity which allows surface acoustic wave vibration and for hermetically sealing the cavity; and a semiconductor switching device mounted on the laminated body for forming a part of the switching circuit.

Radio-frequency hybrid switch module

The conductive particles can be sintered without being influenced by softening and removing of the adhesive layer. As a result, a wiring pattern of high precision can be formed without causing deformation of conductive pattern. It includes a step of filling grooves having a wiring pattern on a film with a conductive paste containing conductive component and resins, a step of adhering the conductive paste side surface of the film having the conductive paste to the adhesive layer side surface of the ceramic substrate having the adhesive layer, a step of forming a conductive pattern on the adhesive layer surface by peeling off the film substrate from a first laminated body having the film, conductive paste, adhesive layer, ceramic substrate, and film, and transferring the conductive paste filling up the grooves onto the surface of the adhesive layer, and a step of firing a second laminated body having the ceramic substrate, adhesive layer and conductive pattern, removing the adhesive layer, and sintering the conductive particles, in which the conductive component in the conductive paste is sintered at least (i) after the adhesive layer is softened, or (ii) after the adhesive layer is burnt.

Manufacturing method of wiring board, and conductive paste used therein

A method of fabricating a multi-layer ceramic substrate for forming a first conductive pattern on a ceramic substrate. An intaglio plate is manufactured which has first and second grooves. The grooves are filled with an electroconductive paste. Conductivity of paths in the grooves is increased by deaerating and drying the paste. The intaglio plate is glued to and then separated from a ceramic substrate so that the pattern of the pattern of the electroconductive paste is transferred to the substrate. An insulation layer and a further conductive pattern are then applied.

Growing community of inventors

Nara, Japan

Masaaki Hayama