Dai Nippon Printing Co., Ltd.

Tomoegawa Paper Co., Inc.

Masaaki Asano

Shinji Maekawa

Hiroshi Mawatari

Takamasa Takano

Hiroshi Kudo

Yoshiaki Tsuruoka

Satoru Kuramochi

Yozo Kosaka

Katsuhiko Mizuno

Takafumi Okamura

Yasuko Baba

Takeshi Nakamura

Koji Arai

Hiroshi Funada

Hisao Tanabe

Tsukasa Yonekawa

Yasunori Kurima

Masami Yanagisawa

Yoshiko Fujita

Takuma Hattori

Naoki Gotoh

Kazuo Senda

A through electrode substrate includes a substrate provided with a through hole, a through electrode positioned in the through hole, and a first wiring structure including at least a first wiring layer positioned on a first surface of the substrate, and a second wiring layer positioned on the first wiring layer. The first wiring layer and the second wiring layer respectively have an insulation layer and an electroconductive layer. A first insulation layer of the first wiring layer includes at least an organic layer. At least one wiring layer of the first wiring structure includes an inorganic layer having insulation properties, the inorganic layer being positioned to a first side of the organic layer of the first insulation layer of the first wiring layer.

Through electrode substrate and mounting substrate

A through electrode substrate includes a substrate provided with a through hole; a through electrode having a sidewall portion extending along a sidewall of the through hole, and a first portion positioned on a first surface of the substrate and connected to the sidewall portion; an inorganic film that at least partially covers the first portion of the through electrode from the first side and is provided with an opening positioned on the first portion; and a first wiring structure including at least a first wiring layer having an insulation layer that is positioned to the first side of the inorganic film and includes at least an organic layer provided with an opening communicating with the opening of the inorganic film, and an electroconductive layer connected to the first portion of the through electrode through the opening of the inorganic film and the opening of the insulation layer.

Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrate

A method of manufacturing a through electrode substrate, the method includes: preparing a substrate including a first surface positioned on a first side, and a second surface positioned on a second side opposite to the first side, the substrate being provided with a through hole; forming a through electrode having a sidewall portion extending along a sidewall of the through hole, and a first portion positioned on the first surface of the substrate and connected to the sidewall portion; forming an organic film inside the through hole; forming an inorganic film at least partially covering the first portion of the through electrode from the first side; forming an insulation layer positioned to the first side of the inorganic film; and forming an electroconductive layer passing through the inorganic film and the insulation layer so as to be connected to the first portion of the through electrode.

An image sensor module includes an interposer substrate having a first surface and a second surface opposite to the first surface, the interposer substrate being light-transmissive and having a plurality of through-holes; an image sensor located to face the first surface of the interposer substrate, the image sensor having a light receiving surface on a side of the interposer substrate, a plurality of photoelectric conversion elements being located at the light receiving surface, the image sensor being connected with an external circuit via electrodes provided in the plurality of through-holes; and a lens unit located to face the second surface of the interposer substrate.

Through-hole electrode substrate

A through electrode substrate includes: a substrate including first and second surfaces respectively on a first side and a second side opposite to the first, the substrate having a through hole; and a through electrode. The through electrode has a sidewall portion along the through hole sidewall, and a first portion the first surface and connected to the sidewall portion. The through electrode substrate includes: an organic film inside the through hole; an inorganic film that at least partially covers the through electrode first portion from the first side and has an opening on the first portion; and a first wiring layer having an insulation layer to the inorganic film first side and includes an organic layer with an opening communicating with the inorganic film opening, and an electroconductive layer connected to the through electrode first portion through the inorganic film opening and the insulation layer opening.

Image sensor module including a light-transmissive interposer substrate having a through-hole

A through-electrode substrate includes a base including a first surface and a second surface mutually opposing each other, and a through-electrode arranged in a through-hole passing through the second surface from the first surface of the base, wherein the through-electrode includes an first end surface of the first surface side and an second end surface of the second surface side exposed from the base in the first surface and the second surface, and a periphery edge of one or both of the first end surface of the first surface side and the second end surface of the second surface side is covered by a part of the base.

Through-electrode substrate, method for manufacturing same, and semiconductor device in which through-electrode substrate is used

The structural body related to the present disclosure includes a substrate having insulation properties arranged with a first surface and a second surface opposing the first surface, a through hole passing through the first surface and the second surface of the substrate, and a through electrode including a conductive material arranged within the through hole, the through electrode conducting the first surface and the second surface of the substrate and including a projection part exposed from the second surface to the outside of the through hole, wherein at least a part of the through hole is gradually increasing in size approaching the second surface in a thickness direction of the substrate, and forming a depression part keeping a gap between the through hole and the through electrode.

Structural body and method for manufacturing same

A dynamic quantity sensor includes a first substrate, a fixed part arranged in the first substrate, a spiral shaped movable electrode arranged separated from the first substrate, one end of the spiral shaped movable electrode being supported by the fixed part, a fixed electrode positioned on the periphery of the movable electrode and arranged in a detection direction of a dynamic quantity, and a first terminal electrically connected to the fixed part and a second terminal electrically connected to the fixed electrode.

Dynamic quantity sensor and manufacturing method thereof

Disclosed is a color conversion member which is improved in the prevention of a deterioration in color conversion function, the prevention of reflection of external light, and color rendering properties. The color conversion member comprises a transparent substrate, two or more types of color conversion layers, and a color filter layer. The color conversion layers function to convert incident lights for respective pixels to outgoing lights of colors different from the incident lights. The two or more types of color conversion layers are arranged on said transparent substrate. The color filter layer is provided on the transparent substrate side of any one of the color conversion layers or between the above any one of the color conversion layers and the color conversion layers adjacent to the above any one the color conversion layers.

Color conversion media and EL-display using the same

An object of the present invention is to solve the problem of losing a part of the incident light due to the irregular reflection of the incident light if a layer containing fine particles is formed by coating for the purpose of roughing when providing measures to prevent the reflection of the light at the surface of the color filter layer or at the surface of the color conversion layer inside a display, or a problem of difficulty in management of the paint for obtaining a certain roughened surface or a problem of increase of the number of processes to prevent the reflection when preventing the reflection by laminating plural layers of different refractive indices. By for example, laminating a black matrix, a color filter layer, a color conversion layeror the like on a transparent substrate, and above thereof, combining an optical filterhaving a minute concave-convex surface, with an endless number of minute concave-convex by a pitch of the wavelength of the light or less formed, with an organic EL element, the object can be achieved.

Optical filter and organic EL display using the same

An optical filter having a laminated body which is laminated on a transparent substrate. The laminated body has at least a color filter layer. The laminated body has a minute concave-convex surface formed on a surface of the laminated body opposite from the transparent surface.

A plasma display panel having increased contrast and sharpness of image displayed on the panel. The panel includes (1) a front plate and a back plate in parallel, with a discharge gas between the plates, (2) plural pairs of composite display electrodes, each display electrode including a sustain electrode and a bus electrode, (3) a dielectric layer covering the display electrodes, and a protective film over the dielectric layer, (4) address electrodes on the back plate at right angles to the display electrode pairs, and a dielectric layer covering the address electrodes, and (5) linear ribs between the address electrodes, with phosphor layers between the adjacent linear ribs to extend intermittently in the lengthwise direction of the ribs for each pixel. Each phosphor layer covers both the dielectric layer surface and the surface of the linear ribs within each pixel. No phosphor layers are in the regions between adjacent pixels.

Plasma display panel, back plate of plasma display panel, and method for forming phosphor screen for plasma display panel

Disclosed are a phosphor composition comprising an inorganic phosphor, capable of emitting blue color upon ultraviolet irradiation, and copper or a copper compound; a phosphor paste comprising the phosphor composition dispersed in a dispersing medium; and a photosensitive dry film formed from the phosphor paste.

Growing community of inventors

Tokyo, Japan

Masaaki Asano