Asahi Kasei Kabushiki Kaisha

Asahi Kasei Chemicals Corporation

Masaaki Aramaki

Yasukazu Shikano

Shinji Ieda

Yu Nitto

Katsushi Watanabe

Hiroki Matsui

Teruaki Sakuma

Tomofumi Maekawa

Kazunori Terada

Hiroshi Oyamada

Katsuhiro Iwase

Shoji Otani

Hiroshi Fukuoka

Takuto Nakata

Norio Sakata

Kenya Sonobe

Ikutoshi Nakashima

Takashi Saitou

Tatsuro Toda

Asami Ohashi

Shota Ide

Hisanari Yoneda

Osamu Haba

Yusuke Tazawa

A polyphenylene ether having a predetermined structure. 

Polyphenylene ether, composition of the same, and manufacturing method of the same

The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.

Polyamide, polyamide composition, and method for producing polyamide

[Problem to be Solved] To provide a polyamide having a high melting point, which has excellent strength, toughness, and stability under heating. [Solution] This polyamide is obtained by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a pentamethylenediamine skeleton, wherein the polyamide has a cyclic amino end amount of 30 to 60&#x3bc; equivalents/g.

Polyamide and polyamide composition

The present invention can provide a polyamide composition that is more excellent in the heat resistance and tensile elongation of molded products and also more excellent in a balance between these properties than those given by conventional polyamide compositions. The present invention relates to a polyamide composition comprising polyamide, liquid-crystalline polyester, and non-liquid-crystalline polyester, characterized in that Ma part by mass of the polyamide, Mb part by mass of the liquid-crystalline polyester, and Mc part by mass of the non-liquid-crystalline polyester with respect to 100 parts by mass in total of the polyamide, the liquid-crystalline polyester, and the non-liquid-crystalline polyester satisfy the following formulas: 60&#x2266;Ma&#x2266;90, 2&#x2266;Mb&#x2266;38, and 2&#x2266;Mc&#x2266;Ma&#xd7;0.2&#x2212;2.

Polyamide composition

A polyamide masterbatch free from metal copper deposition and metal corrosion in an extruder or a molding machine, deterioration in mechanical physical properties of the product, and a color change of appearance due to water absorption and having improved heat aging resistance is produced by mixing, by melt kneading, a) 100 parts by weight of a polyamide having a water content of from 0.05 to 2.0 wt. %, b) from 0.1 to 10 parts by weight of an organic compound having at least one amide group, c) from 0.1 to 5 parts by weight of a copper compound having a maximum particle size of 50 &#x3bc;m or less, and d) from 1 to 50 parts by weight of a halogen compound (with the proviso that a copper halide is excluded) having a maximum particle size of 50 &#x3bc;m or less.

Method for producing polyamide masterbatch

A polyamide composition has (a) a polyamide, (b) at least one phosphorus compound selected from the group consisting of phosphoric acids, phosphorous acids, hypophosphorous acids, metal phosphates, metal phosphites, metal hypophosphites, phosphoric esters, and phosphorous esters, and (c) a soluble metal aluminate compound represented by the general formula (MO)(AlO)(wherein X+Y=1 and M is a Group 1 metal of the Periodic Table), wherein the molar ratio of polyvalent metal to monovalent metal in the composition (polyvalent metal/monovalent metal) is from 0.25 to 1.0.

The present invention relates to a resin composition comprising a resin and apatite, wherein referring to the particulate form of said apatite present in the resin composition thus obtained, the apatite is present in a particulate form having an average diameter or average thickness (d) of not greater than 100 nm and an average aspect ratio (L/D) of not smaller than 5 as defined by the ratio of the average length (L) to said average diameter or average thickness (d).

Apatite-reinforced resin composition

A polyamide characterized in that the polyamide is obtained by thermal polycondensation of (a) dicarboxylic acid components comprising 10 to 80% by mole in total carboxylic acid components of 1,4-cyclohexanedicarboxylic acid having a trans/cis molar ratio of 50/50 to 97/3 and (b) an aliphatic diamine component is disclosed. The alicyclic polyamide having 1,4-cyclohexanedicarboxylic acid in a backbone thereof as a dicarboxylic acid unit, which is suitable as materials for various uses such as automotive parts, electric/electronics parts, industrial materials, engineering materials and daily household goods, and superior in heat resistance, low water absorption, light resistance, moldability and light weight, as well as superior in toughness, chemical resistance and appearance, and molded articles thereof.

Polyamide

The present invention provides a polyamide resin composition suitable as industrial materials such as automobile parts, electronic or electrical parts, and industrial machine parts, and excellent in various mechanical properties such as various kinds of moldability, rigidity, and strength, and durability such as heat-resistant aging property. Namely, the invention relates to a polyamide resin composition comprising (A) a polyamide, (B) an apatite type compound, and (C) (i) a higher fatty acid metal salt and/or (ii) a mixture of a metal halide and a copper compound, wherein the polyamide resin composition is obtainable by adding component (C) after the formation of the apatite type compound.

Polyamide resin composition

Block copolymer comprising at least two kinds of polymer components each having a different structural unit in the polymer selected from polyamide, polyester, polycarbonate and polyarylate. The present block copolymer has a distinguished moldability and can be produced even from rework products or recycle products in a simple and economical manner.

Block copolymer

A polyamide resin composition which contains 0.5 to 50 wt. % of an apatite type compound and which, when eluted with a phenol solvent and filtered, leaves 1 to 100 parts by weight of residual organic substances per 100 parts by weight of the apatite type compound has high strength and rigidity and is excellent in toughness. Moreover, the composition is reduced in water absorption and warpage and is excellent in rigidity upon water absorption, heat resistance, creep resistance, dimensional stability and moldability. Thus, the composition is suitable for use as an industrial material for producing mechanical parts, electrical/electronic parts, etc.

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Tokyo, Japan

Masaaki Aramaki