Dow Corning Corporation

Dow Corning Toray Silicone Company Limited

Dow Corning Toray Company, Ltd.

Dupont Toray Specialty Materials Kabushiki Kaisha

Dow Silicones Corporation

Rohm & Haas Electronic Materials LLC

Dow Toray Co., Ltd.

Ddp Specialty Electronic Materials US 9, LLC

Masaaki Amako

Steven Swier

Tadashi Okawa

Shin Yoshida

Makoto Yoshitake

Masayuki Onishi

Hiroji Enami

Maki Itoh

Eiji Kitaura

Haruna Yamazaki

Yoshitsugu Morita

Haruhiko Furukawa

Randall Gene Schmidt

Toshio Suzuki

Tomohiro Iimura

Michitaka Suto

Nanguo Liu

Hiroshi Ueki

Kazumi Nakayoshi

Kasumi Takeuchi

Osamu Mitani

Shawn K Mealey

Takashi Sagawa

Fumito Nishida

Takeaki Tsuda

Geoffrey Bruce Gardner

Anna Ya Ching Feng

Toshiki Nakata

Shihe Xu

Mayumi Matsuzaki

Paul Schalk

A curable silicone composition is disclosed. The composition comprises: (A) a hydrosilylation-reactive resin-linear block copolymer type organopolysiloxane; (B) an organopolysiloxane resin containing a curing-reactive group having a carbon-carbon double bond in the molecule; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. An absolute value (ΔRI) of a difference between refractive indices of component (A) and component (B) measured at room temperature is less than 0.05. The curable silicone composition generally has excellent handleability, moldability, and mechanical strength (hardness, in particular) and flexibility of a cured product while achieving high transparency. Also disclosed is a resin sheet for an optical member including the composition or cured product thereof, and a light-emitting device or the like including the composition or cured product thereof.

Curable silicone composition, optical member resin sheet comprising same, and light-emitting device

An optical member resin sheet has excellent characteristics as an optical member and exhibits excellent performance even if used for a light-emitting device or the like. The optical member resin sheet is characterized in that the difference between the thickness of an end of the sheet and the thickness of the center of the sheet in the width direction of the sheet is within 5.0% of the total film thickness of the sheet; in that the thickness of the center of the sheet is in the range of 10-1000 μm; in that the sheet area is 225 mmor more; and by containing at least one fluorescent substance or reflective material.

Optical member resin sheet, optical member, layered body, or light-emitting device comprising optical member resin sheet, and method for manufacturing optical member resin sheet

Disclosed is a method of making an optoelectronic device that incorporates a crosslinked resin-linear polyorganosiloxane.

Method of manufacturing an optoelectronic device

A method for producing a sealed optical semiconductor device includes: placing inner and outermost layer sealing films on a substrate on which an optical semiconductor element is mounted within a pressure reduction chamber, and reducing the pressure; a step in which the outermost film is heated, and at least the periphery of the outermost film is thermally fused to the surface of the substrate; and a step in which the reduction of pressure is released, and the substrate is sealed by the outermost film and the inner film. The temperature Tof the substrate when the reduction of pressure is released is a temperature at which the outermost film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 200-450%. The inner film exhibits a loss tangent (tan &#x3b4;) of 1.6 or more at the temperature T.

Method for producing sealed optical semiconductor device

A method for producing a sealed optical semiconductor device makes it possible to seal an optical semiconductor element using a sealing film. The method includes: placing a sealing film on an optical semiconductor element substrate on which an optical semiconductor element is placed within a pressure reduction chamber, and the pressure within the chamber is reduced; heating the film where at least the periphery of the film is thermally fused to the surface of the optical semiconductor element placement substrate; and a step in which the reduction of pressure within the chamber is released and the optical semiconductor element placement substrate is sealed by the film. The temperature Tof the optical semiconductor element placement substrate when the reduction of pressure within the chamber is released is a temperature at which the film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 150-450%.

The present disclosure relates to a method of making an optical assembly. An optical device is secured in a fixture, the optical device having an optical surface, wherein a silicone film is positioned with respect to the optical surface, the silicone film having a distal surface relative to the optical surface. The method includes, among other features, imprinting the distal surface of the silicone film to create a surface imprint in the distal surface of the silicone film.

Imprinting process of hot-melt type curable silicone composition for optical devices

An optical article includes a silicone-containing composition. The silicone composition includes a first region having a first refractive index and a second region having a second refractive index. The first refractive index is different than the second refractive index.

Gradient polymer structures and methods

A method of forming an optical article includes the step of applying a silicone composition to a surface, wherein the silicone composition is a solid and has a glass transition temperature greater than room temperature. The silicone composition is heated to a temperature at or above the glass transition temperature such that the silicone composition flows. The silicone composition forms a light transmitting sheet upon cooling following the heating.

Optical article and method of forming

The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal.

Hot-melt type curable silicone composition for compression molding or laminating

The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by a general formula; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a phosphor; and (E) a hydrosilylation reaction catalyst, to a cured product obtained by curing said composition, and to an optical semiconductor device in which a light emitting element is sealed or coated with a cured product of the aforementioned composition. The curable silicone composition has excellent fluidity and cures to form a cured product in which phosphors are homogeneously dispersed and which has a high refractive index.

Curable silicone composition, cured product thereof, and optical semiconductor device

Optical assemblies comprising an optical device and a composition comprising a resin-linear organosiloxane block copolymer are disclosed. In some embodiments, the organosiloxane block copolymers has a weight average molecular weight of at least 20,000 g/mole and includes 40 to 90 mole percent disiloxy units of the formula [R2SiO] arranged in linear blocks each having an average of from 10 to 400 disiloxy units [R2SiO] per linear block, 10 to 60 mole percent trisiloxy units of the formula [R&#x2014;SiO] arranged in non-linear blocks each having a weight average molecular weight of at least 500 g/mol, and 0.5 to 25 mole percent silanol groups. Ris independently a Cto Chydrocarbyl and Ris independently a Cto Chydrocarbyl. At least 30% of the non-linear blocks are crosslinked with another non-linear block and aggregated in nano-domains. Each linear block is linked to at least one non-linear block.

Optical assembly and method of forming an optical assembly

Polyheterosiloxane compositions are disclosed containing at least 70% by weight of the following components: (A) a first metal (M1) selected from Ti, Zr, or Zn, (B) a second metal (M2) selected from a non-lanthanide metal, (C) siloxy units having the formula RSiOor R'SiO, where R&#x2032; is independently a hydrocarbon group or halogen substituted hydrocarbon group containing 1 to 18 carbon atoms. The disclosed compositions are useful to prepare high refractive index materials.

Polyheterosilxoanes for high refractive index materials

The present invention provides an electrophosphorescent organic light-emitting diode (OLED). The electrophosphorescent OLED includes a substrate having a first opposing surface and a second opposing surface, a first electrode layer overlying the first opposing surface, and a light-emitting element overlying the first electrode layer. The light emitting element includes a hole injection layer and a phosphorescent emissive layer. The hole injection layer is formed of a crosslinked polysiloxane, which includes at least one siloxane unit R&#x2014;Y&#x2014;Si&#x3b8;3/2 having at least one aromatic amine group (R) and at least one divalent organic group (Y). The aromatic amine group includes at least one of a carbazolyl group, a substituted carbazolyl group, a triarylamine group, and a substituted triarylamine group.

Electrophosphorescent organic light emitting diode formed using solvent soluble materials

Curable organosiloxane composition

A thermally conductive silicone rubber composition, comprising (A) a curable organopolysiloxane (B) a curing agent; and (C) a filler prepared by treating the surface of a thermally conductive filler with an oligosiloxane having a formula selected from (i) (R O) Si(OSiR ) and (ii) (R O) R SiO&lsqb;R SiO&rsqb; Si(OSiR ) R wherein R is alkyl, each R is independently a monovalent hydrocarbon group free of aliphatic unsaturation, subscript a is an integer from 1 to 3, b is an integer from 1 to 3, and n is an integer having a value greater than or equal to 0.

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Chiba, Japan

Masaaki Amako