Ngk Insulators, Inc.

Tohoku University

Kyushu University

Masaaki Akaiwa

Naokuni Muramatsu

Takahiro Ishikawa

Takashi Goto

Hirokazu Katsui

Masato Sakakibara

Hiromitsu Uchiyama

Hisao Matsunaga

Osamu Takakuwa

A copper alloy bonded body composed of a plurality of members made of an age-hardenable copper alloy, the members diffusion-bonded to one another. The copper alloy bonded body has undergone solution annealing and an aging treatment, the content of beryllium in the age-hardenable copper alloy is 0.7% by weight or less, and (i) a bonding interface between the members has disappeared and/or (ii) a bonding interface between the members remains, and an oxide film at the bonding interface has a thickness of 0 nm or more and 5.0 nm or less.

Copper alloy assembly and production method therefor

A method for manufacturing a copper alloy according to the present invention comprises (a) weighing a copper powder and one of a Cu&#x2014;Zr master alloy and a ZrHpowder such that an alloy composition of Cu-xZr (x is the atomic % of Zr, and 0.5&#x2264;x&#x2264;8.6 is satisfied) is obtained and pulverizing and mixing the copper powder and the one of the Cu&#x2014;Zr master alloy and the ZrHpowder in an inert atmosphere until an average particle diameter D50 falls within the range of from 1 &#x3bc;m to 500 &#x3bc;m to thereby obtain a powder mixture; and (b) subjecting the powder mixture to spark plasma sintering by holding the powder mixture at a prescribed temperature lower than eutectic temperature while the powder mixture is pressurized at a pressure within a prescribed range.

Method for manufacturing copper alloy and copper alloy

Growing community of inventors

Handa, Japan

Masaaki Akaiwa