Infineon Technologies Ag

Mary Teo

Gerald Ofner

Swain Hong Yeo

Ai Min Tan

Pei Siang Lim

Khoon Lam Chua

A method of forming an integrated circuit package, such as a Flip Chip package, in which a void is provided in the underfill material in the central region of the package between the chip or die and the substrate on which the chip or die is mounted. This reduces delamination of the package as a result of moisture.

Integrated circuit package and a method for forming an integrated circuit package

An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an electrically conductive inductor coil for magnetically aligning the semiconductor chip with the rewiring substrate.

Magnetically alignable integrated circuit device

A semiconductor chip includes flip chip contacts that are arranged on contact surfaces of an active top side of the semiconductor chip. The contact surfaces are surrounded by a passivation layer that covers the active top side while leaving exposed the contact surfaces. The passivation layer includes thickened portions that surround the contact surfaces. The semiconductor chip formed with thickened portions around the contact surfaces is protected from delamination during packaging of the semiconductor chip to form a semiconductor device.

Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip

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Singapore, Singapore

Mary Teo