Raytheon Company

University of Massachusetts

Brazonics, Inc.

Mary K Herndon

Thomas V Sikina

James E Benedict

Andrew R Southworth

Kevin Wilder

John P Haven

Alkim Akyurtlu

Ralph Korenstein

Erika Klek

Keith Carrigan

Sunder S Rajan

Oshadha K Ranasingha

Chae Deok Lee

Nicholas J LoVullo

Wenping Zhao

Matthew A Morton

Randal W Tustison

Craig H McCordic

Joey L Mead

Carol M F Barry

Anurag Gupta

Artee Panwar

Michael Cason

Ralph P Mason

Jiyun C Imholt

Edward I Holmes

Mahdi Haghzadeh

David A Brooks

John David Lovaasen

Lei Xing

Scott J Champagne

Lee P Barber

Jordan Joel Castillo

Brian K Bacon

David Joseph Palumbo

Russell Anderson

Nahid Rahman

Sridhar Siddhamalli

Orlando Mijares

Danielle Grolman

Chae Doek Lee

Carolyn R Reistad

Payam Shoghi

Vincent B Tucci, Jr

Kevin M Wilder

Erika C Klek

A method of decreasing a cycle time of a brazing process is provided. The method includes arranging each of first and second pairs of braze parts together, each of the first and second pairs of the braze parts having braze material interposed between the braze parts, stacking the first and second pairs of the braze parts to form a stack, interposing pyrolytic graphite (PG) between the first pair of the braze parts and the second pair of the braze parts in the stack and heating the first and second pairs of the braze parts to a brazing temperature to braze the braze parts of each of the first and second pairs of the braze parts together.

Furnace braze cycle enhancement

Described herein is an apparatus and a method for a cluster connector. The cluster connector comprises at least three coaxial-cable core conductors formed in an additive manufacturing process; a dielectric around each of the three coaxial-cable core conductors, formed in the additive manufacturing process; a metallic shield around each dielectric, formed in the additive manufacturing process; at least one stub on each metallic shield, formed in the additive manufacturing process; and a common ground connection connected to each metallic shield, formed in the additive manufacturing process.

Additively manufactured cluster connector

A joint between dissimilar thermoplastic materials comprising a first thermoplastic material layer; a second thermoplastic material layer having a melting point temperature different from a melting point temperature of the first thermoplastic material layer; and an interface layer coupled between the first thermoplastic material layer and the second thermoplastic material layer; wherein the interface layer is configured to join the first thermoplastic material layer and the second thermoplastic material layer together to form the joint, wherein the interface layer comprises a melting point temperature having a value selected from the group consisting of between the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer; or lower than the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer.

Multi-functional interface/surface layer for thermoplastic components

A flexure including a bipod strut pair extending from a base and a titanium-zirconium-niobium alloy, which includes titanium, about 13.5 to about 14.5 wt. % zirconium, and about 18 to about 19 weight % (wt. %) niobium. The titanium-zirconium-niobium alloy has a congruent melting temperature of about 1750 to about 1800° Celsius (° C.).

Congruently melting high purity titanium alloy for optical mounts, flexures, and structural elements requiring compliance

A flexure including a bipod strut pair extending from a base and a titanium-zirconium-niobium alloy, which includes titanium, about 13.5 to about 14.5 wt. % zirconium, and about 18 to about 19 weight % (wt. %) niobium. The titanium-zirconium-niobium alloy has a congruent melting temperature of about 1750 to about 1800&#xb0; Celsius (&#xb0; C.).

A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

Wall for isolation enhancement

A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.

Advanced communications array

A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250&#xb0; C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. Blending the dielectric material with the carbon-based ink causes the modified carbon-based ink to have a resistivity that is at least double a resistivity of the carbon-based ink.

Thick film resistors having customizable resistances and methods of manufacture

An apparatus includes a module base configured to carry one or more devices to be cooled. The module base includes a cover and a heat sink connected to the cover. The cover includes first and second encapsulation layers and a thermal spreader between the encapsulation layers. The first encapsulation layer is configured to receive thermal energy from the device(s). The thermal spreader is configured to spread out at least some of the thermal energy and to provide the spread-out thermal energy to the second encapsulation layer. The heat sink is configured to receive the thermal energy through the second encapsulation layer and to transfer the thermal energy out of the module base. The first encapsulation layer includes multiple openings. The module base includes multiple tabs inserted through the openings. Each tab is configured to provide a thermal interface between at least one of the device(s) and the thermal spreader through the first encapsulation layer.

Module base with integrated thermal spreader and heat sink for thermal and structural management of high-performance integrated circuits or other devices

A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250&#xb0; C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. An amount of the dielectric material blended with the carbon-based ink does not exceed about 15% by weight of the modified carbon-based ink. The modified carbon-based ink has a resistivity that is at least double a resistivity of the carbon-based ink. The thick film resistor may be configured to handle up to about 200 mA of current without fusing and/or handle up to about 1.0 W of power without fusing.

Flexible substrates including a polymer selected from a thermoplastic polymer, a thermoset polymer, and/or a polymer blend, and ferroelectric perovskite-type oxide particles dispersed in the polymer, where the ferroelectric perovskite-type oxide has a dielectric constant that varies with applied voltage. The flexible substrates can be used in tunable electronics.

Flexible functionalized ceramic-polymer based substrates

Systems and methods described herein are provided for electrically coupling conductors within a multilayered printed circuit board (PCB) using an interconnect formed along an outer surface of one or more stripline boards making up the multilayered PCB. The multilayered PCB may include first and second stripline boards each having multiple dielectric layers. A first conductor may be formed in the first stripline between the multiple dielectric layers and a second conductor may be formed in the second stripline between the multiple dielectric layers. The interconnect may be formed over an outer surface the dielectric layers such that the interconnect extends from the first conductor to the second conductor. An electrically conductive wall may be formed over the edge or side portion of the dielectric layers to form a cavity that encloses the interconnect and the outer surface of the multilayered PCB.

Interconnection system for a multilayered radio frequency circuit and method of fabrication

An apparatus includes a beta particle source configured to provide beta particles. The apparatus also includes a diamond moderator configured to convert at least some of the beta particles into lower-energy electrons. The apparatus further includes a PN junction configured to receive the electrons and to provide electrical power to a load. The diamond moderator is located between the beta particle source and the PN junction. The apparatus could also include an electron amplifier configured to bias the diamond moderator. For example, the electron amplifier could be configured to receive some of the beta particles and to generate additional electrons that bias the diamond moderator. Also, the diamond moderator can be configured to receive the beta particles having energies that are spread out over a wider range including higher energies, and the diamond moderator can be configured to provide the electrons concentrated in a narrower range at lower energies.

Betavoltaic battery with diamond moderator and related system and method

The present disclosure relates, in some embodiments, to pre-concentrator compositions, devices, systems, and/or methods for concentrating small quantities of chemical or biological compounds, e.g., CBRNE compounds. A pre-concentrator of the disclosure may be operable to releasably bind and concentrate CBRNE compounds. In some embodiments, a pre-concentrator may comprise a 3-D structure of electrospun nanofibers, that comprise at least one polymer, one conducting agent and at least one chemical-specific functional group and/or biological-specific moiety configured to selectively bind to a CBRNE compound. Bound compounds may be released and detected. Pre-concentrator devices and systems operable to bind, concentrate, and/or detect one or more CBRNE compounds are described. Devices and systems of the disclosure may be configured to concentrate and detect multiple compounds. Methods for synthesizing pre-concentrators as well as methods for concentrating, detecting and identifying compounds of interest are also set forth.

Electrospun fiber pre-concentrator

Growing community of inventors

Littleton, MA, United States of America

Mary K Herndon