The Boeing Company

Mary Helen Vargas

Megan Nicole Watson

Michael Walter Evens

Joseph Lawrence Hafenrichter

Russell Lee Keller

John F Spalding, Jr

Joel Patrick Baldwin

Kathy Lynn Ferguson

James D Chanes

Nicholas H Room

Joesph Lawrence Hafenrichter

Joel P Baldwin

Methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.

Apparatus for void-free debulking of adhesive bonded joints

An installation assembly and an associated method for forming a bonded join are provided to permit the adhesive attachment of a first workpiece, such as a patch, to a portion of a second workpiece. The installation assembly and the associated method provide for at least partial debulking of the adhesive prior to curing of the adhesive such that the resulting bondline may have improved mechanical properties as a result of having fewer voids and/or porosity. The installation assembly may include an installation stand and a carrier plate supported by the installation stand and including an attachment surface configured to carry the first workpiece. The installation stand also includes an adjustment mechanism for positioning a carrier plate to a first predefined position to define a gap between the first and second workpieces and also to a second predefined position such that a predetermined bondline thickness is defined between the first and second workpieces.

Installation assembly and associated method for forming a bonded joint

A surrogate patch assembly for a rework area of a structure comprises a surrogate patch body which may be formed of a material for drawing moisture from the rework area. The patch assembly may include a sensor mounted to the surrogate patch body. The sensor may comprise a thermal sensor for sensing the temperature of the rework area and the surrogate patch body. The sensor may comprise a moisture sensor for sensing moisture drawn into the surrogate patch body.

Surrogate patch assembly for a rework area of a composite structure

A method of processing a patch includes mounting the patch on a surface of a caul plate having at least one suction hole, and drawing a vacuum through the suction hole to maintain the patch in contact with the caul plate.

Method of processing a composite patch

Method of repairing a composite structure

A tool comprises a caul plate having at least one suction hole and a vacuum port fluidly coupled to the suction hole for drawing a patch against the caul plate under vacuum.

High temperature composite patch tool

Methods for void-free debulking of adhesive bonded joints

Growing community of inventors

Woodinville, WA, United States of America

Mary Helen Vargas