Loctite (r&d) Limited

Henkel Ag & Company, Kgaa

Loctite Corporation

Mary B Ward

Jonathan P Wigham

Matthew James Holloway

Rainer Schoenfeld

Barry N Burns

Olaf Lammerschop

Rajat K Agarwal

Hubert K Schenkel

Martin J Fitzpatrick

Eadaoin D Ledwidge

Helen M Murray

John E Cahill

Aisling Lakes

Rajat Agarwal

This invention relates to compositions useful as adhesives and more particularly to the preparation of heat-cured epoxy-based adhesive compositions with improved impact resistance and good adhesion to oily metal substrates.

Epoxy compositions having improved impact resistance

The present invention is directed to a photocurable composition for use as an encapsulant, for underfill or attachment adhesives, capable of curing at wavelengths greater than 290 nm. Reaction products of these photocurable compositions have a low level of extractable halide ion, such as less than 100 ppm. In use, the photocurable composition may be applied, for instance, over the wire bonds that electrically connect a semiconductor device to a substrate to maintain a fixed positional relationship and protect the integrity of the electrical connection from vibrational and shock disturbances, as well as from interference from environmental contaminants.

Photocurable adhesive compositions, reaction products of which have low halide ion content

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Dublin, Ireland

Mary B Ward