Siemens Microelectronics Limited

Siemens Components, Inc.

Siemens Corporate Research & Support, Inc.

Infineon Technologies LLC

Simens Corporate Research & Support, Inc.

Marvin Lumbard

Lynn Karl Wiese

Paul-Martin Gerber

The heat tolerance of an LED alphanumeric display device having a clear epoxy encapsulation can be improved by matching the coefficient of thermal expansion (CTE) of the inner circuit board to the high CTE of the epoxy. When heat is applied to fix the device to a circuit board, the components will expand at a nearly equal rate, avoiding cracking and failure.

Surface mount LED alphanumeric display

An end-wall frame for an LED alphanumeric display circuit board provides full-length accurate standoffs for the display to prevent cracking and crazing of the epoxy coating of the encapsulated device, eliminates the need to apply black paint to the non-display portions of the lens, and provides a device for accurately aligning the printed circuit board in the lensed area.

End-wall frame for led alphanumeric display

A closed mold for encapsulating LED alphanumeric display devices uses opposing platens and top and bottom plates to achieve a seal about the display device. By providing the display device with a dambar, splatter on the leads is avoided.

Closed-mold for LED alphanumeric displays

An optical send-receive module includes a frame which has a front section, a back side, and a top section. A lens carrier is attached to the front section of the frame. The lens carrier includes one or more lenses which face forward. An integrated circuit carrier is placed within the top section of the frame. First metal leads electrically connect components within the lens carrier to an integrated circuit within the integrated circuit carrier. Second metal leads extend from the integrated circuit carrier, along the top section of the frame, down the back side of the frame and are bent under the frame.

Low profile optical device with multiple mounting configurations

A method of manufacturing a printed circuit board (PCB) for interconnecting integrated circuit devices includes a lead frame sandwiched between two multilayer substrates. Integrated circuit devices are mounted on the top of the upper substrate and on the bottom of the lower substrate to provide increased packaging density. Thus, according to the present invention, it is possible to provide a simply constructed electronic component mounting PCB which facilitates the design of circuits, and affords excellent connection reliability, which can readily form a heat radiating structure, and in which the thermal matching with the electronic component is excellent.

Method of manufacturing a printed circuit board

An improved printed circuit board (PCB) for interconnecting integrated circuit devices includes a lead frame sandwiched between two multilayer substrates. Integrated circuit devices are mounted on the top of the upper substrate and on the bottom of the lower substrate to provide increased packaging density. Thus, according to the present invention, it is possible to provide a simply constructed electronic component mounting PCB which facilitates the design of circuits, and affords excellent connection reliability, which can readily form a heat radiating structure, and in which the thermal matching with the electronic component is excellent.

Printed circuit based for mounted semiconductors and other electronic

Processing techniques for various modular components provide various surface mount structures for single device components (10) and multiple device components (FIGS. 6 and 7) suitable as character displays. The technique beings with a slab of substrate material 12 patterned on both sides. Plated through holes (33, 43) connecting back side terminals (19, 20) to front side connective strips (22, 24) are formed. Devices (15, 16) are mounted to land areas (13, 34) and wire bonded to connecting pads (14). The front side is coated with epoxy to encapsulate the devices in a layer having an outer surface formed into optional lenses (262, 263). The slab is then separated to provide the modular components.

Method for producing displays and modular components

A lead frame and method for processing the lead frames from a continuous strip of lead frames. A first insulation support member and a second insulative support member are first molded to the lead frame. After the support members are formed, the positioning member for supporting the leads within the lead frame is stamped from the lead frame. After an integrated circuit (IC) is connected to the leads, the IC can be tested within the lead frame since the leads are electrically isolated from the lead frame and each other. Finally the IC can be encapsulated and the leads severed from the lead frame assembly.

Method for manufacturing the same

Processing techniques for various surface mount modular components provide various structures for single device components (10) and multiple device components (FIGS. 6 and 7) suitable as character displays. The technique beings with a slab of substrate material 12 patterned on both sides. Plated through holes (33, 43) connecting back side terminals (19, 20) to front side connective strips (22, 24) are formed. Devices (15, 16) are mounted to land areas (13, 34) and wire bonded to connecting pads (14). The front side is coated with epoxy to encapsulate the devices in a layer having an outer surface formed into optional lenses (262, 263). The slab is then separated to provide the modular components.

Growing community of inventors

Los Gatos, CA, United States of America

Marvin Lumbard