Intel Corporation

Maruti Tamrakar

Jayprakash Thakur

Prasanna Pichumani

Sagar Gupta

Harry G Skinner

Prakash Kurma Raju

Prathibha Peddireddy

Zaman Zaid Mulla

Praveen Kumar

Mythili Hegde

Bala P Subramanya

Anoop Parchuru

Yagnesh Vinodrai Waghela

Doddi Raghavendra

Sudheera Sudhakar

Rakhi Singh

A wireless communication device including a processor; a memory, coupled to the processor, to store instructions, which when executed by the processor, cause the processor to: connect an antenna to an energy harvesting (EH) circuit, wherein the antenna is configured to capture a Wi-Fi radio frequency (RF) signal; send the Wi-Fi RF signal to the EH circuit; determine a RF signal strength of the Wi-Fi RF signal; and determine a location of the wireless communication device based on the RF signal strength.

Ambient RF/WiFi energy harvesting, indoor location tracking and improved Wi-Fi connectivity using machine learning algorithm

A circuitry including a first antenna configured to communicate via a first RAT; including a substrate; and a second antenna located on the substrate of the first antenna configured to communicate via a second RAT, wherein communication via the first RAT does not interfere with communication via the second RAT.

Combined antenna structure

Various embodiments provide an antenna assembly and associated systems, devices, and methods. The antenna assembly may include two or more antennas, including a first antenna and a second antenna, coupled to a ground plane. The antenna assembly may further include an isolation network coupled to the ground plane between the first and second antennas. The isolation network may include a conductive structure between conductive antenna portions of the first and second antennas, and an isolation circuit coupled between the conductive structure and the ground plane. The isolation circuit may include a resistor, an inductor, and/or a capacitor (e.g., coupled in parallel with one another). Other embodiments may be described and claimed.

Antenna assembly with isolation network

A communication device including a chassis; and a wireless communication interface arranged at least in part on a mounting structure, wherein the chassis houses the wireless communication interface, wherein the wireless communication interface comprises an antenna; and wherein the chassis comprises a recess, and wherein the mounting structure is rotatably arranged in the recess.

Communication device

Disclosed herein is an encapsulated antenna for reducing the impact of radio frequency interference (RFI) that may couple to the antenna at frequencies within the Wi-FI 5/6e bandwidths. The encapsulated antenna device may include an insulating housing and a metal layer arranged within a cavity of the housing. The encapsulated antenna device also includes an antenna device comprising a ground terminal and an antenna body, wherein the ground terminal is connected to the metal layer, wherein the antenna body is arranged above the metal layer and within the cavity. The encapsulated antenna device also includes a spacer between the metal layer and the antenna body that provides an offset distance between the metal layer and the antenna body.

Encapsulated wireless antenna for reducing the impact of radio frequency interference

Various embodiments utilize part of an existing antenna pattern in a computing device to implement a specific absorption rate (SAR) sensor element using a radio frequency (RF) filter circuit. The integrated solutions of the present disclosure help to eliminate the external SAR sensor pad requirement and further help to improve wireless performance. The embodiments of the present disclosure may be implemented with a variety of different types of antenna (e.g., slot, metal ring/aperture, PCB, etc.). Other embodiments may be described and claimed.

Techniques for specific absorption rate (SAR) sensing elements in SAR circuits

Examples relate to concepts for antenna arrangement and particular to an antenna for an electronic device. An electronic device comprises, a case, a lid and a heat spreading structure. Further, an electronic device comprises a hinge arrangement between the case and the lid. The hinge arrangement comprises at least one hinge structure connecting the lid to the case. Further, the electronic device comprises an antenna. The antenna is arranged in an area of the hinge arrangement. The heat spreading structure extends from the case through the area of the hinge arrangement to the lid.

Antenna for an electronic device, an electronic device, a mobile device, a hinge structure, and a method for selecting an antenna

A slot antenna assembly for a portable electronic device is disclosed. The assembly includes a first slot antenna having a first slot through a substrate from an outer surface of the substrate to an inner surface of the substrate. The assembly also includes a second slot antenna including a second slot through the substrate from the outer surface of the substrate to the inner surface of the substrate. An isolator includes at least one of an isolation slot and a conductor. The isolation slot includes a substrate isolation slot which extends through the substrate between the first and second slot antennas; and a conductor. The conductor connects the inner surface of the substrate between the first and second antennas to an opposite inner surface of an opposite substrate opposite the inner surface between the first and second antennas.

Integrated combo slot antennas in full metal chassis and isolation improvement technique

Examples relate to concepts for patch antennas and particular to a method for forming a multiband patch antenna. A multiband patch antenna may comprise a ground layer and an excitation layer, comprising a first excitation patch, a second excitation patch and a feeding patch, wherein the patch is arranged to excite the first excitation patch and the second excitation simultaneously.

Multiband patch antenna

A chassis for an electronic device is provided. The chassis comprises a chassis part made of conducting material. At least one slot antenna is formed in the chassis part made of conducting material.

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Chennai, India

Maruti Tamrakar