Rockwell Collins, Inc.

Marty B McGregor

Alan P Boone

Mark T Dimke

The present invention is directed to use of a polyamide thermal plastic as a potting compound for potting electronic components (ex.&#x2014;printed circuit boards) of an electronics assembly which is implemented in a munition. Use of the polyamide thermal plastic as a potting compound allows for a gun-hardened electronics assembly. Use of the polyamide thermal plastic as a potting compound also allows for reworkability. For example, during early testing phases of the electronics assembly, the potting material of the present disclosure may be removable (ex.&#x2014;such as via a hot solvent bath) from the electronics assembly so that the electronics components may be: examined to determine the cause(s) for low yield during testing; and/or fixed, rather than having to rebuild the entire electronics assembly, thereby promoting lower costs of producing the electronics assembly.

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Robins, IA, United States of America

Marty B McGregor