Nxp B.v.

Martinus P M Maas

Roel Daamen

Pascal Bancken

Robertus A M Wolters

Julien M M Michelon

A damascene process is described using a copper fill process to fill a trench (). The copper fill () is started with a deposited seed layer which includes () copper and titanium. Some titanium migrates to the surface during the copper fill process. The structure is annealed in a nitrogen atmosphere which creates a self-aligned TiN barrier () at the surface of the copper fill (). Air gaps () may be created in the same annealing process. The process may be used to form a multilayer structure.

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Budel, Netherlands

Martinus P M Maas