Infineon Technologies Ag

Martin Wurzer

Alfons Dehe

Stefan Barzen

Christian Herzum

Wolfgang Klein

Michael Kropfitsch

Roland Helm

Andreas Wiesbauer

Marc Fueldner

Ulrich Krumbein

Wolfgang Friza

Niccoló De Milleri

Philipp Greiner

Matthias Friedrich Herrmann

Wilfried Florian

Bert Zinserling

A circuit includes a first biasing voltage source, a second biasing voltage source, a first resistor device coupled between the first biasing voltage source and a first terminal of the circuit, a second resistor device coupled between the second biasing voltage source and a second terminal of the circuit, a third resistor device coupled between the second biasing voltage source and a third terminal, a first capacitor coupled between the third terminal and ground, and an amplifier having an input coupled to the second terminal and an output coupled to a circuit output.

Single-ended readout of a differential MEMS device

A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the MEMS device, the signal processing device and the memory element.

Packaged MEMS device comprising adjustable ventilation opening

A MEMS structure and a method for operation a MEMS structure are disclosed. In accordance with an embodiment of the present invention, a MEMS structure comprises a substrate, a backplate, and a membrane comprising a first region and a second region, wherein the first region is configured to sense a signal and the second region is configured to adjust a threshold frequency from a first value to a second value, and wherein the backplate and the membrane are mechanically connected to the substrate.

Adjustable ventilation openings in MEMS structures

A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a counter electrode, wherein the moveable electrode and the counter electrode are mechanically connected to the substrate. The movable electrode is configured to stiffen an inner region of the movable membrane.

MEMS device and method of making a MEMS device

According to an embodiment, a microelectromechanical systems (MEMS) transducer includes a first electrode, a second electrode fixed to an anchor at a perimeter of the second electrode, and a mechanical support separate from the anchor at the perimeter of the second electrode and mechanically connected to the first electrode and the second electrode. The mechanical support is fixed to a portion of the second electrode such that, during operation, a maximum deflection of the second electrode occurs between the mechanical structure and the perimeter of the second electrode.

System and method for a MEMS transducer

Packaged MEMS device and method of calibrating a packaged MEMS device

A MEMS structure includes a backplate, a membrane, and an adjustable ventilation opening configured to reduce a pressure difference between a first space contacting the membrane and a second space contacting an opposite side of the membrane. The adjustable ventilation opening is passively actuated as a function of the pressure difference between the first space and the second space.

MEMS structure with adjustable ventilation openings

A tunable MEMS device and a method of manufacturing a tunable MEMS device are disclosed. In accordance with an embodiment of the present invention, a semiconductor device comprises a substrate, a moveable electrode and a counter electrode. The moveable electrode or the counter electrode comprises a first region and a second region, wherein the first region is isolated from the second region, wherein the first region is configured to be tuned, wherein the second region is configured to provide a sensing signal or control a system, and wherein the moveable electrode and the counter electrode are mechanically connected to the substrate.

Tunable MEMS device and method of making a tunable MEMS device

A method for producing a microphone module includes arranging a MEMS microphone structure on a first surface of a first substrate, the first substrate further including a second surface, which is opposite to the first surface. Furthermore, a cap is arranging on the first surface of the first substrate such that the cap and the first surface enclose the MEMS microphone structure. A readout device for the MEMS microphone structure is arranged on a first surface of a second substrate which further includes a second surface, which is opposite to the first surface. The second surface of the first substrate is attached to the second surface of the second substrate.

Growing community of inventors

Munich, Germany

Martin Wurzer