Hella Gmbh & Co Kgaa

Osram Opto Semiconductors Gmbh

Hella Kgaa Hueck and Company

Martin Wüller

Moritz Engl

Joachim Reill

Franz-Josef Kalze

Thomas Albert Röbbecke

Christian Wieck

Frank Passgang

Miguel Lebrato-Rastrojo

Thomas Wiese

Susanne Hagedorn

Ulrich Temme

Frank Brinkmeier

Nikolaus Decius

Heinz-Michael Dirks

Karsten Eichhorn

Frank Sohrweide

Björn Dreßler

Sonja Seibt

Christof Gorczyca

Timo Puls

Jürgen Wessling

Lukas Schwenkschuster

Christian Lüder

Mirko GÖTZ

Andreas Sprute

A method is provided for joining a pin member of a first component to a second component with a cavity, using an adhesive, to fasten the pin in a target position extending at least partially into the cavity. A distance (D) is provided between the bottom surface of the cavity and the facing end of the pin. A flexible spacer is positioned on the bottom surface of the cavity. The thickness of the spacer equals or exceeds the distance (D) between the bottom surface of the cavity and the facing end of the pin in the target position. The adhesive is filled into the cavity onto the flexible spacer, and the pin is positioned in the target position. The adhesive is cured to obtain a joint between the pin and the second component.

Method of joining a pin to a cavity and joint assembly

A lighting assembly is provided for a lighting device of a motor vehicle. The lighting assembly includes an objective module with at least one objective lens mounted in a lens holder. The objective module also includes at least two first pins. The lighting assembly further includes a light source module with at least one light source mounted on a heat sink element, and with at least two first cavities. The objective module and the light source module are joined by adhesive joints between the first pins and the first cavities. The lens holder further includes the first pins, and/or the heat sink element comprises the first cavities.

Lighting assembly for a lighting device of a motor vehicle

A housing for an electromagnetic radiation emitting optoelectronic component is specified. The housing comprises a housing base body provided with a recess in which at least one chip mounting surface is disposed. At least one outer surface of the housing base body, disposed on an emission side of the housing and adjoining the recess, is provided with a baffle layer suitable for screening an electromagnetic radiation. An electromagnetic radiation emitting component provided with such a housing and a method of making a corresponding housing or component are also specified.

Housing for an electromagnetic radiation emitting optoelectronic component, component and method of making a housing or a component

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Warendorf, Germany

Martin Wüller