Infineon Technologies Ag

Martin Woelz

Georg Borghoff

Reinhold Spanke

Oliver Schilling

Thomas Nuebel

A method for reducing variations in the bending of rolled metal base plates for semiconductor modules is disclosed. In this method, the base plates are rolled in their longitudinal direction in a specific manner.

Method for reducing variations in the bending of rolled base plates and semiconductor module having such a base plate sensor

A power semiconductor module having a carrier plate, on which at least four substrates are arranged, and having a first and a second busbar having two conductive plates is disclosed. The conductive plates are arranged such that they are at a distance from one another and are insulated from one another, for respectively carrying a lower and an upper electrical potential, said busbars each being fitted with outer connecting lugs which lead away from the substrates and inner connecting lugs on the substrate side. Symmetrization of the current during dynamic commutation operations is achieved by correctly selecting the order of the outer connecting lugs of the respective first busbar for a lower potential and of the second busbar for an upper potential in accordance with the order of the inner connecting points of the parallel-connected half-bridge circuits and also of the inner connecting lugs of the first busbar and of the second busbar.

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Soest, Germany

Martin Woelz