Infineon Technologies Ag

Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies Fiber IP (singapore) Pte. Ltd

Siemens Aktiengesellschaft

Osram Opto Semiconductors Gmbh

Infineon Technologies Fiber Optics Gmbh

Martin Weigert

Hans Hurt

Hans-Ludwig Althaus

Josef Wittl

Wolfgang Gramann

Thomas Lichtenegger

Ralf Dietrich

Gustav M&uuml;ller

Detlef Bernd Krabe

Georg Bogner

Bernd Waidhas

Joachim Reill

Gerhard Kuhn

Jörg-Reinhardt Kropp

Franz Schellhorn

Albert Auburger

Thomas Killer

Bernhard Bachl

Lothar Stoll

Markus Wicke

Robert Swoboda

Gunther Steinle

Günter Kirchberger

Hans-Dietrich Wolf

Bernd Luecke

Mathias K&auml;mpf

Peter Gattinger

Compact systems, compact devices and methods are provided to sense changes in luminescence due to environmental influences on a luminescent material. Such systems, devices and methods may be implemented in a compact device, e.g., an integrated circuit package, which may be incorporated into or attached to a device, such as a smartphone, watch, flashlight, vehicle, etc. The systems, devices, and methods described herein are useful in sensing luminescence, as well as changes in luminescence that are indicative of environmental influences, such as the presence and concentration of a gas or chemical, ambient temperature, pressure, light, etc., in an area surrounding a luminescent material included in a compact device.

Compact systems, compact devices, and methods for sensing luminescent activity

Embedded Wafer-Level Packaging (eWLP) methods and optoelectronic devices, packages and assemblies made by the eWLP methods are described. The eWLP methods allow electrical interconnections to be easily and economically made to the back sides of the chips of the eWLP wafer using eWLP wafer-level processes, thereby eliminating the need to use TMVs or TSVs to make such interconnections. The eWLP methods also allow thermal and optical interconnections between the back side and the front side of the eWLP wafer to be easily and economically made. In addition, the eWLP methods allow electrical and optical interfaces to be formed on the front side and/or on the back side of the eWLP wafer. The eWLP methods may be used to form a variety of very thin optoelectronic devices, packages and assemblies having a various useful configurations with high volume, yield and throughput.

Methods for performing embedded wafer-level packaging (eWLP) and eWLP devices, packages and assemblies made by the methods

A photodetector integrated circuit (IC) having an electromagnetic interference (EMI) sensor integrated therein is provided for sensing EMI at the photodetector. Integrating the EMI sensor into the photodetector IC ensures that the EMI sensor is in proximity to the photodetector so that any EMI that is sensed is actually EMI to which the photodetector is exposed. The sensed EMI may then be used for a number of reasons, such as to determine the root cause of damage to circuitry of the system, to determine the point in time at which an EMI event occurred, or to trigger a warning when a determination is made that an EMI limit has been reached.

Photodetector integrated circuit (IC) having a sensor integrated thereon for sensing electromagnetic interference (EMI)

A light emitter and methods of constructing the same is disclosed. The light emitter is disclosed as including a jumper chip and one or more light sources, such as Light Emitting Diodes (LEDs). The light sources are connected to the jumper chip via conductive traces manufactured with semiconductor processing techniques. The jumper chip is disclosed as having a plurality of isolated conductive vias, thereby allowing the jumper chip to present multiple different bonding areas that are electrically isolated from one another.

Light-emitting diodes on a wafer-level package

An electronic display includes a light source system and a light guide system, where the light guide system emits light features laterally, i.e., from the side, at selected positions along its length. The light source system includes one or more electronically controllable light sources and further includes optical switches or other arrangements for coupling the light sources to the optical fibers or other light guides of the light guide system. The light source system can sequentially or progressively increase the selected longitudinal position at which the light feature is emitted, resulting in the appearance of movement of the light feature along the length of the light guide system.

Moving light spots in illumination fibers

A communication arrangement and a method are provided for bidirectionally transmitting data between a first communication unit and a second communication unit. The first communication unit and the second communication unit are connected to one another via a fiber-optic link. In addition, the first communication unit and the second communication unit have a nonoptical link between them. Data in one transmission direction is transmitted via the fiber-optic link and data in the other transmission direction is transmitted via the nonoptical link.

Communication arrangement and method for bidirectionally transmitting data between a first communication unit and a second communication unit

A method for optical coupling an optical waveguide to an optical unit arranged in or on an optical module, a corresponding optical module, coupling element, and a kit of coupling elements is provided. The optical module has a reference geometry which defines a first axis of symmetry. Any offset between a first optical axis of the optical unit and the axis of symmetry of the reference geometry is determined. A coupling element corrects the offset and has an input/output area on opposite faces having offset second and third optical axes. Light input along the second optical axis is guided in the coupling element and output along the third optical axis, and vice versa. Once assembled, the center axis of the coupling element coincides with the axis of symmetry of the optical module, and the first optical axis of the optical unit and second optical axis of the coupling element coincide.

Method and apparatus for optically coupling an optical waveguide to an optical module

The invention relates to an optoelectronic arrangement having a laser component. There are provided: a cooling device of small design for cooling the laser component down to a constant temperature, a device for the direct optical detection of the emitted wavelength of the laser component, whose signal is used to control the cooling device, and a package of small design with an extent of at most 6.5 mm perpendicular to the optical axis of the laser component and in which the above named components are arranged. The invention also relates to a method for controlling the emitted wavelength of a laser component.

Optoelectronic arrangement having a laser component, and a method for controlling the emitted wavelength of a laser component

An optoelectronic component with an optoelectronic transducer device and an electrical circuit electrically connected to the transducer device mounted on a carrier substrate which is optically transparent for specific wavelengths. The transducer device is arranged on the front side of the carrier substrate, and light coupling takes place through the back side. The electrical circuit is formed as a circuit integrated into the carrier substrate or is formed on the carrier substrate using hybrid technology, the terminal contacts of the circuit being arranged on the front side of the carrier substrate. An optoelectronic arrangement with an optoelectronic component includes an at least partly planar-formed mounting element, which is connected by its one side to an outer side of the component or is integrated in the latter and extends at least as far as an outer edge of the component, and includes a mechanical interface for the mechanical connection of the component.

Optoelectronic component and optoelectronic arrangement with an optoelectronic component

A laser device has a laser diode with an optical resonator. The resonator has an exit side for emitting light into an optical system. A monitor diode is provided and has a light-sensitive face for measuring optical quantities of the laser diode. The light-sensitive face of the monitor diode is optically coupled to a backside of the laser diode, on the other side from the light exit side of the resonator, the backside also emitting light. This configuration permits a space-saving SMD layout for the laser device.

Laser device

An LED module includes a substrate having good thermal conductivity and one or more radiation-emitting semiconductor components that fixed on the top side of the substrate. The underside of the substrate is fixed on a carrier body having a high thermal capacity, in which the component fixing between the semiconductor components and the substrate and the substrate fixing between the substrate and the carrier body are embodied with good thermal conductivity. Furthermore, the invention relates to a method for producing the LED module, in which metal areas that are suitable as an etching mask improve the impressing of the current required during the anodic bonding, and at the same time, are used as contact areas for contact-connecting the radiation-emitting semiconductor components. The LED module has the advantage that the semiconductor components can be subjected to higher energization as a result of the high thermal capacity of the carrier body.

LED module and methods for producing and using the module

An electrooptical transmitting and/or receiving module has a lead frame and an optoelectronic transducer mounted thereon. The lead frame and the optoelectronic transducer are potted by a shaped body made from transparent, formable material. Introduced into the shaped body is a reflector element. A radiation beam emitted by a transmitter, or a received radiation beam to be directed onto a receiver is deflected at a prescribed angle by the reflector element. The module can be used in an electrooptical transmitting and/or receiving unit which is constructed as a sidelooker. A method is also provided for molding the electrooptical transmitting and/or receiving module.

Electrooptical transmitting/receiving module, and method for producing the module

A photo-optical transmitter assembly is produced in the following manner: a glass wafer is fixed onto a transparent submount and a V-shaped recess is subsequently created between optical prism elements using targeted sawcuts. A rod-shaped element with a reflective coating is inserted into the V-shaped recess. A laser beam from a semiconductor laser is thus deflected by 90&deg; on the rod-shaped element with the reflective coating and traverses the submount.

Method for fabricating an optical transmitting subassembly

An etching mask with at least one etching window is applied on a glass object consisting substantially of boron silicate glass. Subsequently, the glass object is etched through the etching window by using, for instance, HF, thereby producing trapezoidal trenches or truncated pyramidal grooves in its cross-section.

Process for the production of a glass article having at least one recess

A module essentially includes a module housing, into which is introduced a lead frame. An electro-optical transducer is mounted on the lead frame. The interior of the module housing is filled with a transparent potting compound. A plug receptacle part is moulded onto the outer housing wall and has a defined outer contour. Situated in the interior of the plug receptacle part is an optical waveguide piece, which proceeding from the surroundings of an outer area of the plug receptacle part, extends through the interior of the plug receptacle part and through a housing opening right into the housing interior. The optical waveguide piece is optically coupled to the electro-optical transducer. An optical waveguide plug interacting with the module has a sleeve-shaped plug section corresponding to the plug receptacle part.

Growing community of inventors

Hardt, Germany

Martin Weigert