Watlow Electric Manufacturing Company

Bleckmann Gmbh & Co. Kg

Martin Wallinger

Kevin Ptasienski

Elias Russegger

Gernot Antosch

Gerhard Schefbanker

Sanhong Zhang

Allen Norman Boldt

Kenneth F Fennewald

Andreas Pleschinger

Wolfgang Pöschl

Wolfgang Poeschl

Matt Kenchel

Wolfgang Poschl

Gerhard Schefbänker

Reiner Lehnert

Blake Parkinson

Julian Michelsen

August Burr

Michael Kübler

Reinhardt Lehnert

Gerhard Schefbänke

Allen Boldt

Michael Kubler

Kenneth Fennewald

A heating assembly includes a support member for supporting a target thereon, a diffuser layer attached to the support member, and a heater attached to the diffuser layer. The diffuser layer includes discrete diffuser segments separated by gaps. The discrete diffuser segments are made of the same material and are configured to allow a desired thermal gradient to be maintained between the discrete diffuser segments during heating of the target.

Thermal diffuser for a semiconductor wafer holder

A temperature limiting device for a thermal system includes a modular unit that is configured to connect to a two-wire heater of the thermal system. More particularly, the modular unit includes a heater interface configured to connect to a two-wire heater of the thermal system, a power interface configured to connect to a power source to receive power; and a controller including a sensor circuit. The sensor circuit is configured to measure an electrical characteristic of the two-wire heater, which includes voltage, current, or a combination thereof. The controller is configured to calculate a temperature of the thermal system based on the measured electrical characteristic and determine whether the temperature is greater than a temperature setpoint.

Thermal system with a temperature limiting device

A molding system is provided, which includes at least one mold part and a heating and cooling module. The at least one mold part defines a mold cavity having an opening. The heating and cooling module is inserted into the opening to close the mold cavity. The heating and cooling module includes a die insert defining a mold surface, a layered heater for heating the mold surface, and a cooling unit for cooling the mold surface. The layered heater is disposed between the die insert and the cooling unit and includes functional layers formed directly on a surface of the cooling unit or a surface of the die insert opposite to the mold surface by using layered or layering processes selected from a group consisting of thick film, thin film, thermal spray and sol-gel processes.

High dynamic temperature control system

An electrostatic chuck is formed by depositing a diffuser layer onto an electrostatic puck and removing areas of the diffuser layer to form discrete diffuser segments separated by gaps. The discrete diffuser segments may define continuous concentric rings, discontinuous concentric rings, or a combination of continuous concentric rings and discontinuous concentric rings. The discrete diffuser segments are separated from each other by forming at least one trench in the diffuser layer. The trench may extend partially through the diffuser layer, completely through the diffuser layer to the electrostatic puck, or have a first portion that extends partially through the diffuser layer and a second portion that extends completely through the diffuser layer. Also, the trench can have a constant width or have a variable width.

A method of manufacturing a layered heater includes: applying a dielectric material on a substrate to form a dielectric layer; thermal-spraying a resistive material on the dielectric layer to form a resistive layer on the dielectric layer; forming a plurality of conductive overlays at predetermined locations on the substrate; and forming a plurality of cuts into the resistive layer by laser cutting to form a resistive circuit pattern that overlaps the conductive overlays.

Layered heater system having conductive overlays

A layered heater is provided that includes a sensor layer formed by a layered process having a plurality of independently controllable zones, and a resistive heating layer disposed adjacent the sensor layer. In one form, the sensor layer is formed of a material having a relatively high temperature coefficient of resistance (TCR) and the resistive heating layer is formed of a material having a relatively low TCR.

Temperature detection and control system for layered heaters

A method of adjusting a watt density distribution of a resistive heater includes designing a baseline heater circuit. A detection circuit is designed having a constant trace watt density and the detection circuit overlaps the baseline heater circuit. The detection circuit is manufactured, and its baseline thermal map is obtained. The baseline heater circuit is manufactured, and a nominal thermal map is obtained. A subsequent detection circuit is manufactured, and an actual thermal map is obtained. A subtraction thermal image is created by subtracting the baseline thermal map from the actual thermal map, and a subsequent baseline heater circuit is modified according to the subtraction thermal image.

Method of manufacturing and adjusting a resistive heater

A layered heater includes a resistive layer formed from a conductive material and separated into an intermediate area and a resistive circuit pattern by a plurality of cuts that extend all the way through the resistive layer. The resistive circuit pattern includes termination pads electrically connected to the resistive circuit pattern with the intermediate area being electrically inactive. A conductive overlay is disposed over a continuous portion of the resistive circuit pattern. The plurality of cuts extend longitudinally into the conductive overlay such that no portion of the resistive pattern is present outside the conductive overlay.

An electrical heating device for medical equipment is provided. The electrical heating device includes a conducting body forming a channel therethrough for fluid travel, a base dielectric layer disposed on the conducting body, a heater surrounding the base dielectric layer and the conducting body, a top dielectric layer disposed on the heater, and a protection housing that is preformed and that defines a cavity to receive the top dielectric layer and the heater in the cavity. The base dielectric layer and the top dielectric layer jointly enclose the heater. At least one of the base dielectric layer and the top dielectric layer has a radial portion at a side of the heater such that the radial portion surrounds a portion of the base layer dielectric that is sandwiched between the heater and the conducting body and no portion of the heater is exposed from the base dielectric layer and the top dielectric layer. The protection housing defines side pieces that are in direct contact with the conducting body.

Flow through heater

A method of forming a layered heater assembly includes: forming a plurality of layers onto a substrate, the plurality of layers including a resistive element layer; forming electrical terminations in contact with the resistive element layer; securing a protective cover over the layers using a laser welding process, wherein edges of the protective cover are welded circumferentially around raised end portions of the substrate and welded longitudinally along a slotted portion of the substrate; securing a pair of lead wires to the electrical terminations; and securing a lead cap assembly around the pair of lead wires and to the protective cover using a laser welding process.

Moisture resistant layered sleeve heater and method of manufacture thereof

A layered heater includes a resistive layer defining a resistive circuit pattern having at least one bend portion. A conductive overlay is provided on at least one of a top surface and a bottom surface of the bend portion to alleviate the current crowding effect, thereby protecting the electric circuit from premature failure. Methods of manufacturing the layered heater are also disclosed. The overlay may be formed on the bend portion after the resistive layer is formed. The overlay may also be formed on a substrate or a dielectric layer that supports the resistive layer before the resistive layer is formed.

A heater assembly is provided that includes a substrate having opposed end portions defining raised flanges, a slot extending between the opposed end portions, and opposed chamfered surfaces extending along the slot and across the raised flanges. A plurality of layers are disposed onto the substrate, along with a pair of terminal pads. A protective cover defining at least one aperture is disposed over the layers and is secured to the raised flanges and the opposed chamfered surfaces of the substrate, and the aperture is disposed proximate the terminal pads. A pair of lead wires is secured to the pair of terminal pads, and a lead cap assembly is disposed around the pair of lead wires and is secured to the protective cover.

A system for detecting and controlling temperature of a layered heater is provided that includes a layered heater having in one form a substrate, a first dielectric layer disposed on the substrate, a sensor layer disposed on the first dielectric layer, a second dielectric layer disposed on the sensor layer, a resistive heating layer disposed on the second dielectric layer, and a third dielectric layer disposed on the resistive heating layer. An overtemperature detection circuit is provided in one form that is operatively connected to the resistive heating layer. The circuit includes a resistor, the sensor layer, and an electromechanical relay in parallel with the sensor layer. The sensor layer defines a material having a relatively high TCR and the resistive heating layer defines a material having a relatively low TCR such that a response time of the control system is relatively fast.

An electrical heating device for medical equipment is provided. The heating device includes a body, which may be an insulating body forming a channel therethrough for fluid travel, an insulating material surrounding the body, and a heater surrounding the body and the insulating material. In other forms, the electrical heating device for medical equipment has a conducting body, instead of an insulating body, forming a channel therethrough for fluid travel. A base dielectric layer is disposed on the conducting body, and a heater surrounds the base dielectric layer and the conducting body. A top dielectric layer is disposed on the heater, and a protection housing surrounds the top dielectric layer.

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Abtenau, Austria

Martin Wallinger