Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Martin Thoms

Dirk Tews

Christian Sparing

Markku Lager

Gabriela Schmidt

Wonjin Cho

Norbert Lützow

Felix Tang

Mirko Kloppisch

Aaron Hahn

Toshio Honda

Norbert Luetzow

Anika Exner

The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps:

Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer

To achieve good adherence of a resist coating, more specifically a photo imageable resist coating, to a copper base while ensuring that the copper base being very thin is not compromised, a non-etching non-resist composition for the treatment of the copper base is provided, said composition comprising at least one adhesion agent selected from the group comprising (i) heterocyclic compounds comprising at least one thiol moiety and (ii) quaternary ammonium polymers having the following general chemical formula: {N(R)(R)&#x2014;(CH)&#x2014;N(H)&#x2014;C(Y)&#x2014;N(H)&#x2014;(CH)&#x2014;N(R)(R)&#x2014;R}n X, with R, R, R, R, R, Y and Xbeing defined as claimed.

Non-etching non-resist adhesion composition and method of preparing a work piece

Disclosed is a composition for and applying said method for micro etching of copper or copper alloys during manufacture of printed circuit boards. Said composition comprises a copper salt, a source of halide ions, a buffer system and a benzothiazole compound as an etch refiner. The inventive composition and method is especially useful for manufacture of printed circuit boards having structural features of &#x2266;100 &#x3bc;m.

Composition and method for micro etching of copper and copper alloys

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Berlin, Germany

Martin Thoms