Air Liquide America, L.p.

American Air Liquide, Inc.

Other

Martin Theriault

Stephane Rabia

Jason R Uner

Kristen Boyce

Philippe Blostein

The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues. In accordance with one aspect of the present invention, a component placement machine for placing components on printed circuit boards includes a component storage area, a component placement system for taking components from the component storage area and placing the components on the printed circuit boards, an enclosure surrounding the component storage area, and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components.

Apparatus and method for maintaining a dry atmosphere in a surface mount device placement machine

The apparatus and method of the present invention relates use of a warm and dry atmosphere in electronic component storage areas. The warm and dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues by removing moisture from the components. In accordance with one aspect of the present invention, a component storage system includes an enclosed component storage area and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components, and a temperature control system for controlling a temperature of the dry gas to about 10&#xb0; C. to about 60&#xb0; C.

Apparatus and method for maintaining a dry atmosphere to prevent moisture absorption and allow demoisturization of electronic components

Apparatus for placing components on printed circuit boards

Methods and apparatus are presented which allow efficient environmental testing of components such as printed circuit boards, integrated circuits, sub-systems and other components. In one method of the invention, a component can be placed into a chamber having an internal space filled with a gaseous atmosphere. The component is indirectly cooled by smartly positioning one or more cooling coils near the component to be tested, and the cooling coils are fed with a cryogenic fluid from a source of cryogenic fluid. The warm cryogenic fluid is recycled by one of two means: a thermosiphon conduit loop, and a storage and compression facility for reusing the warm cryogenic fluid. The internal space is preferably filled with a dry gas.

Methods and apparatus for recycling cryogenic liquid or gas from test chambers

The apparatus and method of the present invention relates use of a warm and dry atmosphere in electronic component storage areas. The warm and dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues by removing moisture from the components. In accordance with one aspect of the present invention, a component storage system includes an enclosed component storage area and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components, and a temperature control system for controlling a temperature of the dry gas to about 10&deg; C. to about 60&deg; C.

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Evanston, IL, United States of America

Martin Theriault