Telefonaktiebolaget Lm Ericsson (publ)

Martin Schöön

Andrzej Sawicki

Joakim Plahn

It is presented a power amplifier assembly comprising; a radio frequency multi-order power amplifier comprising a circuit board; a grounding structure connected to the radio frequency multi-order power amplifier and comprising a recess; a combining network connected to a plurality of outputs of the radio frequency multi-order power amplifier. The combining network comprises: a plurality of input connection points, wherein each of the plurality of input connection points is connected to a respective output of the plurality of outputs of the radio frequency multi-order power amplifier; an output connection point; and a conductor arrangement comprising a plurality of conductive paths arranged between the plurality of input connection points and the output connection point; wherein at least one of the plurality of conductive paths is at least partly formed by a suspended conductor positioned in the recess of the grounding structure.

Power amplifier assembly comprising suspended strip lines

The present invention relates to a device adapted in order to decrease stress on connection points between a heat generating source and a substrate. The devicecomprises a larger heat-dissipating part, and at least one smaller heat-dissipating part. The larger partis arranged with at least one cavityfor housing the at least one smaller part. The at least one smaller partis adapted to be attached to at least one heat-generating source, and at the same time more mobile in the cavityand/or less affected by changes in temperature than the larger part.

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Solna, Sweden

Martin Schöön