Precitec Optronik Gmbh

Precitec Gmbh & Co. Kg

Dusemund Pte. Ltd.

Martin Schönleber

Berthold Michelt

Christoph Dietz

Rüdiger Moser

Markus Kogel-Hollacher

Matthias Kunkel

Andreas Rudolf

Thibault Bautze

Jean-Francois Pichot

Claus Dusemund

David Marsaut

Stephan André

Christian Fraas

A processing head for a laser processing device adapted for processing a workpiece using laser radiation has: adjustable focusing optics to focus laser radiation in a focal spot having an adjustable distance from the processing head; an optical coherence tomograph to measure a distance between the processing head and the workpiece by measuring an optical interference between measuring light reflected by the workpiece and measuring light not reflected by the workpiece; a path length modulator that can change, synchronously with and dependent on a change of the focal spot distance from the processing head, an optical path length in an optical path along which measuring light propagates; a scanning device, which deflects the laser radiation in different directions; and a control device, which i) controls a focal length of the focusing optics in such a way that the focal spot is situated at a desired location on the workpiece, ii) receives, from the coherence tomograph, information representing the distance between the processing head and the workpiece, and iii) uses information received from the coherence tomograph for a continuous correction of a positioning of the focal spot on the workpiece.

Machining head for a laser machining device

The present disclosure concerns a device for distance measurement for a laser processing system. The device comprises a light source, which is configured to generate a primary beam for direction onto a workpiece, at least one detection device configured to record a secondary beam reflected from the workpiece, at least one optical amplifier configured to amplify the primary beam and/or the secondary beam, and an evaluation unit configured to evaluate interference between spectral components in the frequency domain.

Measuring distance using a laser processing system with optical amplifier for amplifying measuring beam or reflected part of measurement beam

A method for measuring the depth of the vapour cavity during an industrial machining process employs a high-energy beam. An optical measuring beam is directed towards the base of a vapour cavity. An optical coherence tomograph generates interference factors or other raw measurement data from reflections of the measurement beam. An evaluation device generates undisturbed measurement data, wherein raw measurement data that is generated at different times is processed together in the course of a mathematical operation. This operation can be a subtraction or a division. Slowly changing interference factors can thus be eliminated. An end value for the distance to the base of the vapour cavity is calculated from the undisturbed measurement data using a filter. As a result, the depth of the vapour cavity can be determined, in the knowledge of the distance at a part of the surface of the work piece that is not exposed to the high-energy beam.

Method and device for measuring the depth of the vapor capillary during a machining process with a high-energy beam

A device for measuring the depth of a weld seam in real time during the welding or joining of a workpiece by means of radiation, including: its measuring light source, the light of which is coupled by a beam splitter into a reference arm and a measuring arm; a collimator module having at least one collimation lens for collimating a measuring light beam, which is fed to the collimator module via an optical waveguide in the measuring arm, and for imaging the measuring light beam, which is reflected from a workpiece to be processed, on an exit/entry surface of the optical waveguide; a coupling element for coupling the measuring light beam into the beam path of a processing beam; a focusing lens for the joint focusing of the measuring light beam and the processing beam on the workpiece and for the collimating of the reflected measuring light beam; and an analysis unit for determining the depth of a weld seam, into which the measuring light reflected from the workpiece is guided with the superimposed, reflected light from the reference arm. The collimator module includes a device for setting the axial focal position of the measuring light beam, and for setting the lateral focal position of the measuring light beam, and a field lens, which is arranged between the exit/entry surface of the optical waveguide and the collimation lens and defines the beam widening of the measuring light beam and therefore the focus diameter of the measuring light beam.

Device for measuring the depth of a weld seam in real time

A chromatic confocal measuring device for the measurement of distances and/or thicknesses of several locations has a light source that emits polychromatic measuring light through a light exit surface. The light source is a laser pumped luminophore-based light source and has an oblong exit surface. The measuring device further has at least one first confocal aperture through which the measuring light passes and which comprises a plurality of punctiform orifices or at least one slit-shaped orifice. The measuring device also includes imaging optics configured to cause a chromatic focus shift of the measuring light and to image the first confocal aperture in a measurement volume so that different wavelengths are focused at different heights. A first receiving and evaluating unit measures the intensity of the measuring light reflected by the measurement object as a function of the wavelength and of the transverse position of the reflection location on the measurement object and determines therefrom distances and/or thicknesses of several locations or of a region of the measurement object extending in at least one spatial direction.

Phosphor light source for CLS or multipoint

A device for machining material by means of laser radiation, including a focusing optics for focusing a laser beam onto a workpiece and an adjusting optics for adjusting the intensity distribution comprising at least two plate-shaped optical elements which are arranged one behind the other in the beam path of the laser beam, which are rotatable relative to one another in the circumferential direction, and which each have a surface with a circular pattern of sector-shaped facets which, in the circumferential direction, are alternately inclined with respect to the respective plate plane.

Device for machining material by means of laser radiation

A chromatic confocal distance sensor has a housing in which a polychromatic light source, imaging optics having a longitudinal chromatic aberration, a spectrometer and a planar beam splitter surface are arranged. These lie in the light path of the measurement light between the light source and the imaging optics and between the imaging optics and the spectrometer. A first diaphragm is arranged in the light path between the light source and the beam splitter surface, and a second diaphragm is arranged in the light path between the beam splitter surface and the spectrometer. The diaphragms are arranged mirror-symmetrically with respect to the beam splitter surface. The measurement light propagates as a free beam inside the housing. The beam splitter surface, the first diaphragm and the second diaphragm are fastened together on a carrier which has an isotropic thermal expansion coefficient. This way, temperature changes cannot significantly affect the measurement accuracy.

Chromatic confocal distance sensor

A device for measuring a distance to an object comprises a beam splitter for splitting broadband coherent light emitted by a light source in measuring light which is guided through an object arm to the object to be measured and in reference light which is guided to a reference arm. The object arm includes a focusing optics with a focus movable along an optical axis of the object arm. The focusing optics comprises a movable optical element and is configured such that a movement of the movable optical element along the optical axis causes a higher movement of the focus of the focusing optics along the optical axis. The movable optical element of the focusing optics is coupled to the reference arm such that the optical path length of the reference arm can be tracked synchronously with and dependent on the movement of the focus of the focusing optics.

Distance measuring device and method for measuring distances

A chromatic confocal measuring device includes a light source, which emits light of a plurality of wavelengths, and a first beam splitter, via which the light from the light source into an imaging optical unit having chromatic aberration on. Light reflected from the measurement object is imaged by the imaging optical unit and the first beam splitter onto a first confocal detection stop arrangement, such that the first confocal detection stop arrangement functions as a confocal aperture. Light incident through the first detection stop arrangement is detected and evaluated by a first detection device. The measuring device has a first slit stop, which functions as a confocal aperture of the measuring device. The measuring device additionally includes a second detection device and a second beam splitter, wherein the second beam splitter splits the light reflected from the measurement object into a first and a second partial beam, which image the same spatial region of the measurement object. The first detection device detects light of the first partial beam by a linear detector and evaluates total intensities over all wavelengths in order to create a total intensity profile and/or a total intensity image therefrom. The second detection device at the same time spectrally splits light of the second partial beam and evaluates intensities of the light of a plurality of individual wavelengths.

Device and method for optically measuring a measurement object

The invention relates to an optical measuring process for acquiring a surface topography of a measurement object. To this end, a measuring device with a measuring head in a measuring head guide device is provided for chromatic confocal acquisition of the surface topography or for spectral interferometric OCT acquisition of the distance to the surface topography. Firstly, spectrally broadband light of a light source from a fibre array with i fibres of i measurement spots is directed onto the measurement object via a common measuring head optic, with formation of a spot array of i measurement spots. i reflection spectra of the i measurement channels are then acquired and digitized. Finally, the digitized reflection spectra are evaluated with removal of time variations of systematic measurement errors and time-related deviation movements of the measuring head guide device.

Optical measuring method and measuring device having a measuring head for capturing a surface topography by calibrating the orientation of the measuring head

The invention relates to an optical measuring process for acquiring a surface topography of a measurement object. To this end, a measuring device with a measuring head in a measuring head guide device is provided for chromatic confocal acquisition of the surface topography or for spectral interferometric OCT acquisition of the distance to the surface topography. Firstly, spectrally broadband light of a light source from a fiber array with i fibers of i measurement spots is directed onto the measurement object via a common measuring head optic, with formation of a spot array of i measurement spots. i reflection spectra of the i measurement channels are then acquired and digitized. Finally, the digitized reflection spectra are evaluated with removal of time variations of systematic measurement errors and time-related deviation movements of the measuring head guide device.

The invention relates to a test device for testing a bonding layer between wafer-shaped samples and a test process for testing the bonding layer. The test device comprises a measuring head for an OCT process that is configured to direct an optical measuring beam at a composite comprising at least two wafer-shaped samples with a bonding layer positioned between them. An optical beam splitter is configured to divert an optical reference beam as a reference arm for distance measurements. An evaluation unit is configured to evaluate layer thickness measurements without a reference arm and distance measurements with a reference arm. An optical switch device is configured to connect and disconnect the reference arm.

Test device for testing a bonding layer between wafer-shaped samples and test process for testing the bonding layer

An apparatus and method for determining a depth of a region having a high aspect ratio that protrudes into a surface of a semiconductor wafer are provided. The apparatus comprises a multi-wavelength light source, a semiconductor wafer holder for holding a semiconductor wafer, a head for directing the light source onto the semiconductor wafer, a spectrometer for collecting light comprising multiple wavelengths reflected from the semiconductor wafer and analysis means for determining a depth of the region from an interference pattern of light reflected from the semiconductor wafer by performing Fourier domain optical coherence tomography.

Apparatus and method for determining a depth of a region having a high aspect ratio that protrudes into a surface of a semiconductor wafer

A material-working device with working beams of a beam generator and with in-situ measurement of a working distance between the beam generator and a workpiece, the material-working device including a working laser; a laser scanner for the working laser, the laser scanner including a two-dimensional deflecting device with scanner mirrors and a variable refocusing device at varying working distances; and a sensor device including a spectrometer and at least one sensor light source, wherein measuring beams together scan a working area of the workpiece by the laser scanner and an objective lens while gathering the working distance, and the measuring beams of at least two of the light sources of the sensor device being linearly polarized and being coupled into a working beam path of the laser scanner of the material-working device by an optical coupling element in a collimated state with crossed polarization directions.

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Aschaffenburg, Germany

Martin Schönleber