Robert Boschgmbh

Martin Rittner

Georg Hejtmann

Michael Guenther

Gerhard Meixner

Karl Frauhammer

Heinz Schnerring

Andreas Strasser

Uwe Glanz

Michael Guyenot

Rainer Holz

Walter Daves

Thomas Kalich

Heiner Jacobs

Franz Wetzl

Andreas Fix

Christiane Frueh

Bernd Rometsch

Andrea Feiock

Stefan Kaessner

Knut Alexander Kasper

Nicolas Maier

Silvia Duernsteiner

Ulrich Kessler

Bernd Hohenberger

The invention relates to a power module. The power module has at least one power semiconductor and at least one further electronic component. The power module has a housing which is formed by a shaped body and is formed by an encapsulation compound. According to the invention, the housing is formed in at least two levels. At least one power semiconductor component is arranged in a first level and the at least one further electronic component is arranged in the second level. At least one electrically conductive layer, which forms an electrically conductive connecting structure, is formed on a surface of an inner boundary of the power module which extends between the levels. The connecting structure is applied directly to the surface. The at least one further electronic component is electrically conductively connected, in particular soldered or sintered, to the wiring structure. The power semiconductor  component in the first level is electrically connected to the further component in the second level by means of the connecting structure.

Power module comprising a housing which is formed in levels

The invention relates to an electronic module (), in particular a power module, having at least one electrical/electronic component () and having a housing (), which at least partly extends around the component (), wherein the housing () is made of cement composite (), and wherein the cement composite () has at least one particulate filler (). According to the invention, the particulate filler () has aluminum nitride particles (), which each have a coating only of aluminum oxide ().

Electronic module, method

A contacting arrangement between an electrical component and a circuit carrier, the component being connected to a connection element formed as a part separate from the component, and the connection element being electroconductively contacted directly with the circuit carrier via at least one press-fit connection.

Contacting arrangement and method for forming the contacting arrangement

A commutation cell having at least one electrical capacitor, at least one controllable semiconductor switch and at least one semiconductor which is connected in series with the controllable semiconductor switch. The commutation cell has three circuit substrates situated in parallel with one another. The controllable semiconductor switch is connected in series with the semiconductor via a circuit substrate situated partially between the controllable semiconductor switch and the semiconductor, and the two remaining circuit substrates being connected to one another in an electrically conductive manner via a subassembly made up of the controllable semiconductor switch, the semiconductor and the circuit substrate situated partially between the controllable semiconductor switch and the semiconductor, the electrical capacitor being switched between the two remaining circuit substrates, separately from the subassembly.

Commutation cell

Laminated composite () comprising at least one electronic substrate () and an arrangement of layers () made up of at least a first layer () of a first metal and/or a first metal alloy and of a second layer () of a second metal and/or a second metal alloy adjacent to this first layer (), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (), a region with at least one intermetallic phase () is formed between the first layer and the second layer, wherein the first layer () or the second layer () is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melting temperature of the AgX, CuX or NiX alloy is greater than the melting temperature of the basic solder. The invention also relates to a method for forming a laminated composite () and to a circuit arrangement containing a laminated composite () according to the invention.

Laminated composite made up of an electronic substrate and a layer arrangement comprising a reaction solder

The invention relates to a machine tool comprising an electric motor () which serves to drive a tool and which has an adjustable, electric brush arrangement (), and comprising a mode selector switch () having various switch positions. Provision is made for an adjusting device () to displace the brush arrangement () as a function of the switch position of the mode selector switch (). Furthermore, the invention relates to a corresponding method.

Machine tool and method for operating a machine tool

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Ludwigsburg, Germany

Martin Rittner