Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Martin Renkel

Emilie Barriau

Martin Hornung

Rainer Schoenfeld

Sven Wucherpfennig

My Nhu Nguyen

Andreas Ferencz

Thomas Engels

Matthew James Holloway

Eugen Bilcai

Jason Brandi

Petra Padurschel

Rainer Schönfeld

Konrad Becker

Tim Welters

Ruairi O'Kane

Nicholas O Dominguez

William F Torres

Adam Meng

Li Li

Olaf Lammerschop

Mario Marcolini

Ruairi O'kane

Rainer SCHÖNFELD

The present disclosure provides two part, room-temperature curable hybrid epoxy/(meth)acrylate compositions, comprising: (a) a first component, comprising (meth)acrylate monomers, crosslinkers, epoxy curatives, and optional free radical accelerator, tougheners, fillers and additives, and inhibitors; and (b) a second component, comprising epoxy resins, methacrylate free radical initiators, and optional tougheners, fillers and additives. The compositions provide among other advantageous properties fast cure rate, extremely high compression properties, and good thermal cycling performance.

Fast curing epoxy acrylic liquid shim

A fiber composite material obtainable by (a) mixing the components of a multi-component agent immediately before use, wherein component A of the multi-component agent contains at least one compound having two or more isocyanate groups, component B of the multi-component agent contains at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, and at least one of the components of the multi-component agent contains at least one epoxide prepolymer, (b) introducing the resulting application preparation into a mold in which fibers and optionally further additives are present, the resulting mixture containing at least one latent hardener for epoxide prepolymers, (c) pre-curing the resulting mixture at a temperature from 5&#xb0; C. to 90&#xb0; C., and (d) then finally curing the pre-cured fiber composite material at temperatures from 100&#xb0; C. to 240&#xb0; C., wherein the fiber composite material being removed from the mold after step (c) or step (d).

Hybrid matrix for fiber composite materials

The present application provides agents for producing an impact-modified epoxy adhesive encompassing at least two components A and B packaged separately from each other, wherein (a) component A contains at least one compound having two or more isocyanate groups together with one or more further additives, (b) component B contains at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, together with one or more further additives, (c) at least one of components A and/or B contains at least one epoxide prepolymer as an additive, (d) at least one of components A and/or B contains at least one latent hardener for epoxide prepolymers as an additive, and (e) components A and B contain no blowing agent that is capable of being heat activated.

Impact-modified adhesives

The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70&#xb0; C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25&#xb0; C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity of at most 250 Pa*s at 25&#xb0; C., (c) at least one hardener that can be thermally activated, (d) at least one propellant that can be thermally activated, and (e) at least 1 wt. % of organic fibres having a fibre length of 0.2 mm to 10 mm.

Thermally expandable preparations

A two-component premix for preparing a heat-expandable and heat-curable epoxy-based material, comprises an isocyanate, a diol or polyol, an epoxy prepolymer, a heat-activatable hardener for epoxy prepolymers, and a heat-activatable blowing agent.

Premix and method for producing a thermally expandable and curable epoxy-based compound

Provided herein are electronic devices assembled with thermally insulating layers.

Electronic devices assembled with thermally insulating layers

A thermally curable adhesive in strip or film form, having a thickness in the range of 0.1 to 5 mm, containing: a) at least one reactive epoxy prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers that are selected from: c1) thermoplastic polyurethanes, c2) thermoplastic isocyanates, and c3) block copolymers having thermoplastic polymer blocks. Further components can additionally be contained, for example a blowing agent for foaming. The adhesive in the uncured state at 22&#xb0; C. is bendable or wrappable and can be extended at least 100% before tearing. It can be laid onto a foil. It can be used, for example, for adhesive bonding of planar, tubular, or cylindrical components, preferably components made of metal, wood, ceramic, or ferrites.

Adhesive film or adhesive tape based on epoxides

Growing community of inventors

Duesseldorf, Germany

Martin Renkel