Osram Gmbh

Osram S.p.a. - Societa' Riunite Osram Edison Clerici

Martin Reiss

Alberto Alfier

Simon Bobbo

Alberto Zanotto

Simon Schwalenberg

Lorenzo Baldo

Steffen Strauss

Simone Massaro

Valerio Michielan

Dina Pasqualini

Lorenzo Roberto Trevisanello

Marco Munarin

Thomas Rieger

Gerhard Holzapfel

Roberto Didone'

Luigi Pezzato

Antonio Callegaro

Alessandro Biscaro

A lighting device comprising: an elongated laminar substrate having opposed front and back surfaces, one or more electrically-powered light radiation sources, e.g. LED sources, at the front surface of the substrate, a protective encapsulation sealingly encapsulating the substrate and the light radiation source(s), the encapsulation being light-permeable to facilitate propagation of light radiation from the device. The encapsulation includes thermally-conductive material at the back surface of the substrate.

Lighting device and corresponding manufacturing method

In various embodiments, a lighting device is provided. The lighting device includes a channel-shaped elongate profiled body having a central or web portion and two side portions sidewise of the web portion, a profiled body having mutually opposed undercuts opening inwardly of the channel shape of profiled body, and a light radiation source assembly including an elongate support board carrying one or more light radiation sources, e.g. LED sources, the support board having longitudinal sides extending into the said undercuts, wherein the light radiation source assembly is retained by the channel-shaped profiled body.

Lighting device and method of manufacturing it

Various embodiments may relate to a method for producing an LED module, including providing a housing implemented as a hollow body, having an opening on a light exit side of the LED module, wherein the housing has a base side, arranged opposite to the light exit side, arranging a circuit board having one LED on the base side of the housing, pouring in one first base layer made of a curable material in a non-cured state through the opening into the housing, and pouring in a scattering layer made of a curable material in a non-cured state through the opening into the housing. The scattering layer is poured in onto the first base layer. The first base layer is not cured during the pouring in of the scattering layer, and after the pouring in of the scattering layer, the one first base layer and the scattering layer are cured.

Method for producing an LED module and LED module

A method for producing a lighting module is provided. The method includes providing a light source substrate populated with at least one semiconductor light source, laterally surrounding the at least one semiconductor light source by a wall, applying at least one prefabricated diffuser element to at least one semiconductor light source, introducing potting compound into the space surrounded by the wall up to a height at which both the at least one semiconductor light source, and potting at least part of the at least one diffuser element.

Producing a lighting module

A lighting device, such as for example a LED flexible module, includes an elongated profiled body having a mouth portion, a first and a second lateral sides arranged sidewise of the mouth portion and a web side opposed the mouth portion. The profiled body includes a light-permeable portion, extending between the mouth portion and the first lateral side, and a light-impermeable portion extending between the second lateral side and the web side. A light radiation source assembly including a support member with one or more electrically powered light radiation sources is arranged at the mouth portion with the light radiation source(s) facing the light-permeable portion, whereby light radiation is directed towards the first lateral side for emission from the lighting device.

Lighting device and corresponding method

A lighting device may include at least one semiconductor light source cast with at least one first casting compound, wherein at least one region of the lighting device has: at least one connection area, which is electrically connected to the at least one semiconductor light source, and at least one electrical connecting element, which has at least one electrical line, wherein at least one electrical line is connected to an associated connection area and protrudes at one end out of the lighting device, and the at least one connection area and the at least one electrical connecting element are arranged in a cutout in the first casting compound and are cast by means of a second casting compound.

Lighting device and method for producing a lighting device

Growing community of inventors

Sinzing, Germany

Martin Reiss