Siemens Aktiengesellschaft

Asm Assembly Systems Gmbh & Co. Kg

Martin Pruefer

Wolfgang Huber

Gerhard Haas

Sylvester Demmel

A method and a placement machine for equipping a carrier with components. The procedure includes: (a) positioning of the carrier in a first spatial location within the placement machine, such that components in a first section of the carrier are placeable by a placement head of the placement machine; (b) placement, by means of the placement head, of a multitude of marker components on the carrier in an overlap area of the carrier; (c) transferring of the carrier along a transport direction into a second spatial location within the placement machine, the second spatial location being selected such that components in a second section of the carrier are placeable by the placement head and that the marker components placed in the overlap area are optically detectable by a camera; (d) second optical detection by means of the camera of the marker components placed in the overlap area; and (e) placement of a multitude of components on the carrier in predefined placement positions within the second section, the spatial locations of the placement positions on the carrier depending at least on the result of the second optical detection of the placed marker components.

Use of placeable marker components for a staged placement of components on a carrier

A placement machine for equipping a substrate with unhoused chips is described. The placement machine has a chassis on which is mounted a feed device, providing a wafer which has a multiplicity of chips. A lifting device is mounted on the chassis, and a substrate-receiving device for receiving the substrate is mounted on the lifting device is movable relative to the chassis by the lifting device. The substrate-receiving device has a one-piece support element, which constitutes at least an upper part of the substrate-receiving device, wherein the substrate to be equipped can be laid on the one-piece support element; and a transport device for transporting the substrate on an upper side of the one-piece support element along a transport direction. The transport device is spatially integrated in the one-piece support element on the upper side of the one-piece support element.

Placement machine and method for equipping a substrate with unhoused chips

A method for mounting or equipping components onto substrates that utilizes a number of component mounting process areas. Each of the process areas includes a component mounting head member or equipping head for mounting the components, a number of supply units for supplying the components to the component mounting head member and a transport member for moving the components between the process areas. The method utilizes a single or a multiple stage or a combined single and multiple stage component mounting process for mounting the components, whichever is determined to be optimally utilized. The single stage process is optimally utilized for a small number of components to be mounted. The single stage process includes completely mounting the components at one of the process areas as compared to the multiple stage process which includes mounting or equipping the components at a combination of successive process areas.

Method for mounting components onto a substrate

In a conventional method for controlling successive machine processes, a central control unit only communicates the start commands to the individual decentralized control units when the decentralized control unit responsible for a previous machine process has communicated an end message to the central control unit. As a result of overloading the central control unit with other, a time delay arises between the individual process steps. In the method disclosed herein, the central control unit communicates a preparatory command for a second machine process to the decentralized second control unit during the execution of a first machine process together with a start condition. The second machine process is only started when the second control unit receives a completion signal directly from the first control unit to satisfy the start condition.

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Munich, Germany

Martin Pruefer