Siemens Aktiengesellschaft

Martin Peisl

Dominique Savignac

Peter Muhmenthaler

Hans D Oberle

Matthias Utesch

An integrated semiconductor memory includes a parallel test device and block groups. The parallel test device is used for writing in and evaluating data to be written into and read out of the semiconductor memory. Several groups of memory cells can be simultaneously tested for operation in a test mode, with each group being disposed along a respective word line. The data read out during the process can be evaluated by the parallel test device. The result of the evaluation is present, separately for each group of memory cells, on I/O data lines of the semiconductor memory. The semiconductor memory can also have redundant memory cells, in which case defective memory cells or groups of memory cells can be replaced in connection with the test mode.

Integrated semiconductor memory with parallel test capability and

A semiconductor memory includes a rectangular chip surface having corners. Four combined cell field blocks are each disposed at a respective one of the corners of the chip surface. Rectangular cell field blocks are combined in each of the combined cell field blocks, with each two of the cell field blocks having edges facing each other. Cell fields are combined into each of the cell field blocks, with the cell fields having word and bit lines. Decoder blocks face each other on the edges of the cell field blocks. The chip surface has a surface area between the decoder blocks being free of cell fields. Peripheral circuit blocks are disposed inside the surface area being free of cell fields. Connection paths are disposed inside the surface area being free of cell fields for connecting the semiconductor memory to connections of a housing.

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Munich, Germany

Martin Peisl