Alpine Microsystems, Inc.

Martin P Goetz

George E Avery

Sammy K Brown

Andrew K Wiggin

John J Zasio

Tom L Todd

Sam Beal

Allan Calamoneri

A system and method for efficiently interconnecting a plurality of ICs, thereby improving the electrical performance of the overall system while reducing contact degradation due to stress that results from differences in the coefficients of thermal expansion of the various components during thermal cycling

Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact

A method and a system for wafer level burn-in testing of a circuit featuring a flip-jumper to permit selectively connecting signals to the interconnect sites on the wafer that are in constant electrical communication with the circuit.

Wafer-level burn-in

A module and method for interconnecting integrated circuits. The module includes an insulative body that features conductive traces having differing resistivities associated therewith. To that end, the insulative body has, disposed therein, a conductive bond pad and a plurality of spaced apart conductive traces, one of which is in electrical communication with the bond pad, with each of the plurality of conductive traces are formed from a material having a resistivity associated therewith. The resistivity of the material from which one of the plurality of conductive traces is formed being greater than the resistivity of the material from which the remaining conductive traces are formed and defines a decoupling capacitor therebetween.

Module and method for interconnecting integrated circuits that facilitates high speed signal propagation with reduced noise

A system and method for efficiently interconnecting a plurality of ICs, thereby improving the electrical performance of the overall system while reducing contact degradation due to stress that results from differences in the coefficients of thermal expansion of the various components during thermal cycling.

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Discovery Bay, CA, United States of America

Martin P Goetz