Xilinx, Inc.

Martin Newman

Sagheer Ahmad

Ygal Arbel

Rafael C Camarota

Jonathan Jasper

A memory controller includes transaction queue circuitry, a first skip event, a second skip event, a third skip event, and scheduler circuitry. The transaction queue circuitry is configured to store a first transaction, a second transaction, and a third transaction. The first transaction received is by the transaction queue circuitry before the second transaction and the third transaction. The second transaction is received by the transaction queue circuitry before the third transaction. The first skip event counter is associated with the first transaction. The second skip event counter is associated with the second transaction. The third skip event counter is associated with the third transaction. The scheduler circuitry is configured to select the third transaction before selecting the first transaction, increase a value of the first skip event counter based on selecting the third transaction before the first transaction, and communicate the third transaction to a memory device.

Memory controller with reduced latency transaction scheduling

Examples describe memory refresh operations for memory subsystems. One example is a method for a memory controller, the method including entering a first state upon exiting self-refresh state, wherein the first state comprises activating a first timer. The method includes entering a second state from the first state upon detecting an end of an active period and detecting that the first timer has not expired. The method includes entering a third state from the second state upon detecting expiration of the second state, wherein the third state comprises re-entering the self-refresh state.

Memory self-refresh re-entry state

Methods and apparatus are described for adding one or more features (e.g., high bandwidth memory (HBM)) to a qualified stacked silicon interconnect (SSI) technology programmable integrated circuit (IC) region by providing an interface (e.g., an HBM buffer region implemented with a hierarchical switch network) between the added feature device and the programmable IC region. One example apparatus generally includes a programmable IC region and an interface region configured to couple the programmable IC region to at least one fixed feature die via a first plurality of ports associated with the at least one fixed feature die and a second plurality of ports associated with the programmable IC region. The interface region is configured as a switch network between the first plurality of ports and the second plurality of ports, and the switch network includes a plurality of full crossbar switch networks.

High bandwidth memory (HBM) bandwidth aggregation switch

Methods and apparatus are described for adding one or more features (e.g., HBM) to a qualified SSI technology programmable IC region by providing an interface (e.g., an HBM buffer region with a switch network) between the added feature device and the programmable IC region. One example IC package generally includes a package substrate; at least one interposer disposed above the package substrate; a programmable IC region disposed above the interposer; at least one fixed feature die disposed above the interposer; and an interface region disposed above the interposer and configured to couple the programmable IC region to the fixed feature die via a first set of interconnection lines routed through the interposer between a first plurality of ports of the interface region and the fixed feature die and a second set of interconnection lines routed between a second plurality of ports of the interface region and the programmable IC region.

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Saratoga, CA, United States of America

Martin Newman