Osram Opto Semiconductors Gmbh

Osram Oled Gmbh

Martin Mueller

Karsten Heuser

Marc Philippens

Ralph Paetzold

Richard Scheicher

Karl-Heinz Hohaus

Andreas Lovich

Guenther Groenninger

Wolfgang Goergen

Ansgar Fischer

Johannes Krijne

Erwin Eiling

The invention relates to an edge-emitting semiconductor laser comprising &#x2014;at least two laser diodes, each of which is designed to generate electromagnetic radiation, wherein &#x2014;the laser diodes are arranged on top of one another in a vertical direction, &#x2014;the laser diodes are monolithically connected to one another, and &#x2014;at least one frequency-stabilizing element is arranged in an end region of the laser diodes. The invention also relates to a method for producing an edge-emitting semiconductor laser.

Edge-emitting semiconductor laser and method for producing an edge-emitting semiconductor laser

A semiconductor laser array may include a plurality of semiconductor lasers and a common substrate configured as a common anode of said plurality of semiconductor lasers. Each semiconductor laser may have a pn junction region between the common anode and a cathode contact layer. The pn junction region may include a p-doped layer and an n-doped layer. The p-doped layer of the pn junction region may face the substrate. The semiconductor laser array circuit arrangement may include a semiconductor laser array, each laser may be controlled by a driver with an n-MOSFET.

Semiconductor laser array and semiconductor laser array circuit arrangement

An arrangement () for holding a substrate () in a material deposition apparatus, which substrate () has a deposition side () upon which material (M) is to be deposited, and which arrangement () comprises: a shadow mask () comprising a number of deposition openings (Di); a support structure () comprising a number of surround openings (Si); and a support structure holding means () for holding the support mask () and/or a substrate holding means () for holding the substrate (), such that the support structure () is on the same side as the deposition side () of the substrate (), and the shadow mask () is positioned between the substrate () and the support structure () such that at least one deposition opening (Di) of the shadow mask () lies within a corresponding surround opening (Si) of the support structure ().

Arrangement for holding a substrate in a material deposition apparatus

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Bernhardswald, Germany

Martin Mueller