Vega Grieshaber Kg

Martin Mosmann

Martin Mellert

Herbert Auber

Thomas Oehler

A fill level measurement device senses the fill level of an object within a container. A fill level measurement sensor provides a sensed fill level signal indicative of the level within the container. A signal processing device is responsive to the sensed fill level signal and includes a first removable and replaceable component that includes a first memory device. The signal processing device also includes a second removable and replaceable component that includes a second memory device containing component customer parameter data. The second removable and replaceable component transmits the component customer parameter data to the first removable and replaceable component via a data link that electrically isolates the first and second removable and replaceable components, and the first removable and replaceable component stores the received component customer parameter data into the first non-volatile memory device.

Fill level measurement device

A fill level measurement device includes at least first and second removable and replaceable components that each includes a non-volatile memory device. The device senses that the first removable and replaceable component has been inserted into the fill level measurement device, and provides a sensed signal indicative thereof. In response to the sensed signal, component customer parameter data is received at the first removable and replaceable component, and the received component customer parameter data is written into the non-volatile memory device of the first removable and replaceable component.

Fill level measurement device with removable and replaceable components

A fill level measurement device includes at least first and second removable and replaceable components that each include a non-volatile memory device. The device senses that the first removable and replaceable component has been inserted into the fill level measurement device, and provides a sensed signal indicative thereof. In response to the sensed signal, component customer parameter data is received at the first removable and replaceable component, and the received component customer parameter data is written into the non-volatile memory device of the first removable and replaceable component.

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Wolfach, Germany

Martin Mosmann