Infineon Technologies Ag

Ecpe Engineering Center for Power Electronics Gmbh

Martin März

Franz Hirler

Gerald Deboy

Hans Weber

Ernst Schimanek

Dieter Brunner

Andreas Schletz

The invention concerns a power electronic arrangement comprising an insulating substrate, a cooling element arranged beneath the insulating substrate and one or more power electronic components disposed on a respective metallization surface of the insulating substrate. Disposed on the surface of the insulating substrate is a metal layer portion which projects beyond the insulating substrate at all sides. The region of the metal layer portion, that projects beyond the insulating substrate, forms a metal flange which borders the insulating substrate. The cooling element, on its side towards the insulating substrate, beneath the insulating substrate, has one or more recesses, whereby a cavity delimited by the insulating substrate and wall surfaces of the one or more recesses is formed beneath the insulating substrate for receiving a liquid cooling agent. The metal flange is further connected to the cooling element.

Power electronics assembly with cooling element

The invention relates to a switching transistor presenting reduced switching losses. In the switching transistor, output capacitance is very high when drain/source voltages are low. As the drain/source voltage increases, the capacitance falls to such low values that the energy stored in the transistor becomes very low.

Switch mode power supply with reduced switching losses

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Nuremberg, Germany

Martin März