Intel Corporation

Martin M Maxwell

Ram S Viswanath

Thomas J Birk

Tom Birk

Navid Shahriari

Dave Clay

Dan Weinstein

Thomas A Kvanvig

A device is loaded in a test chamber. The device is positioned for support on a chuck in a non-test position in the test chamber. The device is tested in the test chamber. The chuck is positioned in a test position in the test chamber to place the device in electrical contact with a test apparatus. Coolant is delivered to a heat sink supported by the chuck near the device prior to testing the device and while testing the device. Coolant is delivered to the heat sink through flexible tubing coupled to the chuck as the chuck moves from the non-test position to the test position.

Direct to chuck coolant delivery for integrated circuit testing

A test setup for testing an integrated circuit. A holder is provided which is capable of releasably receiving and holding the integrated circuit. Apparatus is provided which tests the integrity of the integrated circuit. A controller is provided which controls the temperature of the integrated circuit.

Setup for testing an integrated circuit in a semiconductor chip wherein

A test socket having a heat slug for removing heat from an electronic device positioned within the socket. In one embodiment the test socket includes a burn-in board electrically coupled to a test unit that generates a series of test signals to test the performance of the electronic device. Examples of electronic devices that can be tested by the test socket are integrated circuit packages such as tape carrier packages (TCP), ball grid arrays (BGA), pin grid arrays (PGA), land grid arrays (LGA), and other packages. The integrated circuit package is positioned within the socket which electrically connects the package to a printed circuit board, such as a burn-in board. The test socket includes an opening in which a heat slug is disposed. The heat slug has a contact surface that contacts the integrated circuit device under test. In another embodiment, the socket includes a lid having a heat slug attached to the lid, which heat slug has a contact surface that contacts an integrated circuit device under test.

Thermally enhanced test socket

A pickup chuck which includes a body defining a fluid flow path and a first recess for receiving a semiconductor chip package, at least two chip contact members extending out of the body into the recess, each of which being independently movable in a first direction which is out of the body and in a second direction which is into the body, springs biasing the members into the first direction, flanges limiting movement of each member into the first direction, and one or more heat dissipation fins located within the fluid flow path and engaged with the members to conduct heat therefrom.

Pickup chuck for multichip modules

A test contactor having a heat slug for removing heat from an electronic device engaging the contactor. The heat slug is positioned in the test contactor so that a thermally conductive surface of the heat slug will intimately contact a heat-radiating bottom surface of the electronic device when the electronic device is in position for testing by the test contactor. A separate heat slug may also be provided for contacting a heat-radiating top surface of the electronic device. Either or both of the heat slugs may be spring loaded or otherwise movably constrained to maximize surface contact with the electronic device by self-positioning when all elements are placed in proper test position. Improved thermal contact may also be achieved by the use of compliant material between the respective contact surfaces of the heat slug and electronic device. Failure induced by stress at the corners of the electronic device may be minimized by making the contact area of the heat slug smaller than the affected surface area of the electronic device. Heat transfer may be further improved by configuring the heat slug with cooling fins and by using convection flow past the heat slug.

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Chandler, AZ, United States of America

Martin M Maxwell