Xilinx, Inc.

Tabula, Inc.

Altera Corporation

Altera Corporaton

Martin L Voogel

Jason Rupert Redgrave

Trevis Chandler

Steven L Teig

Steven P Young

Michael J Hart

Kameswara K Rao

Venu M Kondapalli

Philip D Costello

Shahin Toutounchi

Randy Renfu Huang

James Karp

Kevin T Look

Daniel Gitlin

Jingcao Hu

Andrew Edward Caldwell

Brian C Gaide

Manoj Chirania

Praful Jain

Joe Entjer

Austin H Lesea

Trevor J Bauer

David P Schultz

Jung Ko

Jan Lodewijk De Jong

Vasisht Mantra Vadi

Rafael C Camarota

Carl H Carmichael

Henri Fraisse

Jongheon Jeong

Yanran Chen

Radko Gerard Bankras

Joseph J Fabula

Leon Ly Nguyen

Thomas S Chanack

Suresh Ramalingam

Mohsen Hossein Mardi

Hong Shi

Jun Liu

Hing Yan To

David M Mahoney

Christopher D Ebeling

Pierre Maillard

Tiemin Zhao

Sheau-suey Li

Narasimhan Vasudevan

Chi Minh Nguyen

Yakov Karpovich

Edward C Priest

Siow Chek Tan

Betty Y Lau

Matt Crowley

Ly Nguyen

Leon L Nguyen

Examples described herein generally relate to forming and/or configuring a die stack in a multi-chip device. An example is a method of forming a multi-chip device. Dies are formed. At least two or more of the dies are interchangeable. Characteristics of the at least two or more of the dies that are interchangeable are determined. A die stack comprising the at least two or more of the dies that are interchangeable is formed. Respective placements within the die stack of the at least two or more of the dies that are interchangeable are based on the characteristics.

Forming and/or configuring stacked dies

One example of the present disclosure is an integrated circuit (IC). The IC includes an inverter with an input and an output, a clock transmission gate coupled to the output of the inverter; and a plurality of storage cells. The clock transmission gate is coupled to each of the plurality of storage cells, wherein each of the plurality of storage cells comprises a plurality of nodes arranged based on a minimum spacing.

Designing single event upset latches

Some examples described herein provide for an on-die virtual probe in an integrated circuit structure for measurement of voltages. In an example, an integrated circuit comprises a voltage-controlled frequency oscillator circuitry and a processor circuitry. The voltage-controlled frequency oscillator circuitry comprises a plurality of circuitry components and is configured to generate a signal having a frequency related to a supply voltage. The voltage-controlled frequency oscillator circuitry is disposed at a location of the integrated circuit proximal to the supply voltage being monitored. The processor circuitry is configured to identify a relationship between the frequency of the signal and the supply voltage. The processor circuitry is also configured to determine a value of the supply voltage associated with the signal based on the identified relationship. The processor circuitry further monitors on-die transient voltages at the location of the integrated circuit based on the value of the supply voltage.

On-die virtual probes (ODVP) for integrated circuitries

An apparatus includes a first die including a first substrate with first TSVs running through it, a first top metal layer and first chimney stack vias (CSVs) connecting the first TSVs with the first top metal layer. The apparatus further includes an uppermost die including an uppermost substrate and an uppermost top metal layer, and uppermost CSVs connecting the uppermost substrate with the uppermost top metal layer. The first and uppermost dies are stacked face to face, the first TSVs and the first CSVs are mutually aligned, and the dies are configured such that current is delivered to the apparatus from the first TSVs up through the first CSVs, the first and uppermost top metal layers, and the uppermost CSVs.

Power delivery network for active-on-active stacked integrated circuits

Techniques for electrostatic discharge (ESD) protection in integrated circuit (IC) chip packages methods for testing the same are described that are configured to directs the risk of ESD events through ground and power interconnects preferentially over I/O interconnects to enhance ESD protection in chip packages. In one example, a chip package is provided that includes an IC die, a substrate, and a plurality of interconnects. The plurality of interconnects are exposed on a side of the substrate opposite the IC die. The interconnects provide terminations for substrate circuitry formed within the substrate. At least one of the last 5 interconnects of the plurality of interconnects respectively comprising rows and columns of interconnects disposed along the edges of the substrate that closest to each corner of substrate project farther from the substrate than interconnects within those rows and columns that are configured as I/O interconnects.

Method and apparatus of package enabled ESD protection

Programmable devices and methods of operation are disclosed. In some embodiments, a programmable device may include programmable logic selectively coupled to a plurality of input/output (I/O) interface circuits by a programmable interconnect fabric and a network-on-chip (NoC) interconnect system. The programmable logic may include configurable logic elements, programmable interconnects, and dedicated circuitry. The programmable interconnects may form part of the programmable interconnect fabric. In some embodiments, the programmable interconnect fabric selectively routes non-packetized data between the programmable logic and a first group of I/O interface circuits, and the NoC interconnect system selectively routes packetized data between the programmable logic and a second group of I/O interface circuits. The NoC interconnect system may operate according to a data packet protocol, and the second group of I/O interface circuits may include memory controllers compatible with the data packet protocol.

Integrating rows of input/output blocks with memory controllers in a columnar programmable fabric archeture

A programmable logic device with fabric regularity is disclosed. For example, the programmable logic device may include a plurality of similar heterogeneous logic blocks. A user's design may be implemented within a first group of heterogeneous logic blocks. The user's design may be moved or copied to a second group of heterogeneous logic blocks. More specifically, routing, timing, and/or placement information associated with the implementation of the users design in the first group of heterogeneous logic blocks may be used to implement the user's design in the second group of heterogeneous logic blocks.

Regularity of fabrics in programmable logic devices

An integrated circuit (IC) die and integrated circuit (IC) chip packages having such dies are described that leverage the symmetry of the arrangement of micro-bumps to advantageously reduce interposer cost and size requirements. In one example, an integrated circuit (IC) die is provided. The IC die includes a die body, a plurality of programmable tiles disposed in the die body, and a plurality of micro-bumps disposed in the die body. The die body includes a front face connecting a bottom exterior surface and a top exterior surface. A centerline of the die body is perpendicular to the front face and bifurcates the top exterior surface. At least two of the programmable tiles are of a common type. The micro-bumps adjacent the front face and coupled to the common type of programmable tiles have a substantially symmetrical orientation relative to a symmetry axis. The symmetry axis being one of (a) collinear with the centerline of the die body, or (b) parallel to the centerline of the die body.

Rotated integrated circuit die and chip packages having the same

A system and method for reducing power consumption in a reconfigurable integrated circuit. Some embodiments provide placement and routing programs that reduce the number of bits to be reconfigured. Some embodiments provide placement and routing programs that increase the number of groups of circuits that do not need reconfiguration at some times. Some embodiments include circuits that selectively block reconfiguration.

System and method for reducing reconfiguration power usage

Some embodiments provide an IC with configuration context switchers. The IC includes several configurable circuits, each of which configurably performs one of several operations at any given time, based on the configuration data set that it receives at that time. The IC includes several storage circuits for storing several configuration data sets for each of the configurable circuits. The IC also includes a context switching interconnect circuit for switchably connecting the configurable circuit to different sets of storage circuits to receive different sets of configuration data sets. The context switcher includes one or more stages for re-timing the data coming from the configuration storage elements. The stages can include interconnect circuitry or storage circuitry. Some embodiments build one of the stages in the configuration data storage elements. Some embodiments encode the configuration data bits and hence utilize a decoder in the context switcher to decode the encoded configuration data.

Configuration context switcher with a latch

Some embodiments provide a configurable integrated circuit (IC) having a routing fabric that includes configurable storage element in its routing fabric. In some embodiments, the configurable storage element includes a parallel distributed path for configurably providing a pair of transparent storage elements. The pair of configurable storage elements can configurably act either as non-transparent (i.e., clocked) storage elements or transparent configurable storage elements. In some embodiments, the configurable storage element in the routing fabric performs both routing and storage operations by a parallel distributed path that includes a clocked storage element and a bypass connection. In some embodiments, the configurable storage element perform both routing and storage operations by a pair of master-slave latches but without a bypass connection. The routing fabric in some embodiments supports the borrowing of time from one clock cycle to another clock cycle by using the configurable storage element that can be configure to perform both routing and storage operations in different clock cycles. In some embodiments, the routing fabric provide a low power configurable storage element that includes multiple storage elements that operates at different phases of a slower running clock.

Configurable storage elements

A low power sub-cycle reconfigurable conduit is provided. The low power reconfigurable conduit is a clocked storage element that consumes less power when performing low-throughput operations that do not require sub-cycle rate. The low power conduit includes a first configurable routing multiplexer that is reconfigurable to select one of several inputs at a first clock rate. The low power conduit also includes an array of storage elements for storing output data from the configurable routing multiplexer at the first clock rate. Each storage element in the array of storage elements operate at a second clock rate that is slower than the first clock rate. Each storage element receives a different phase of a clock that operates at the second clock rate. The low power conduit also includes a second configurable routing multiplexer that is reconfigurable to select from the array of storage elements at the first clock rate.

Growing community of inventors

Niwot, CO, United States of America

Martin L Voogel