Solarworld Innovations Gmbh

Deutsche Cell Gmbh

Solarworld Industries Gmbh

Martin Kutzer

Harald Hahn

Holger Neuhaus

Olaf Storbeck

Andreas Krause

Matthias Georgi

Bernd Bitnar

Christian Koch

Kristian Schlegel

Wieland Pethe

Matthias Schaarschmidt

Thomas Seidel

Paul Grunow

Joachim Koenig

Frank Wecke

Matthias Richter

Michael Heemeier

Alexander Fülle

Torsten Weber

Claudia Lengsfeld

Thilo Richter

Alexander Fuelle

Wolfgang Enger

A bifacial photovoltaic module with at least one bifacial solar cell is provided. The at least one bifacial solar cell includes a substrate with a front-side and a rear-side. The front-side is the light incident side and the rear-side has rear-side contact structure. The rear-side contact structure includes a plurality of electrically conductive contact fingers, which have a first metal, a plurality of solder pads electrically connected to the contact fingers. The solder pads have a top. The solder pads have a second metal, which is different from the first metal. The rear-side contact structure further includes several cell connectors electrically connected to the solder pads. The top of the solder pads is free from the contact fingers in an area along one direction. The cell connectors are disposed planar on or above this area.

Bifacial photovoltaic module

In various embodiments, a solar cell screen-printing composition is provided, comprising aluminum; and silicon; the percentage by mass of silicon lying in a range from 5% to 95% of the sum of the percentages by mass of silicon and aluminum.

Method for manufacturing a metallization structure comprising aluminum and silicon

In various embodiments, a photovoltaic module may include: a plurality of photovoltaic cells, at least one photovoltaic cell of the number of photovoltaic cells comprising: a first plurality of contact wires on a front of the photovoltaic cell; and a second plurality of contact wires on a rear of the photovoltaic cell. The first plurality of contact wires and the second plurality of contact wires may be arranged offset with respect to one another.

Photovoltaic module, method for electrically connecting a plurality of photovoltaic cells, and device for electrically connecting a plurality of photovoltaic cells

For contacting a silicon solar cell a pre-processed silicon substrate with a frontside and a backside is provided. Then, aluminum is deposited on the backside of the pre-processed silicon substrate, wherein aluminum-free regions remain on the backside. Then, a silver-free layer suitable for soldering on the backside of the silicon substrate is deposited so that the silver-free layer suitable for soldering covers at least the aluminum-free regions on the backside.

Method for backside-contacting a silicon solar cell, silicon solar cell and silicon solar module

A method for contacting and connecting solar cells, according to which at least one electrode is formed by at least one wire conductor, and including the following steps:

Method for contacting and connecting solar cells

An electrode for electrically connecting two photovoltaic cells is provided. Each photovoltaic cell may include a plurality of lamellar electrically conductive surface regions. The electrode may include a plurality of electrically conductive wires extending adjacent to one other; and a stabilizing structure coupled to the plurality of electrically conductive wires such that the space between the electrically conductive wires to one another is defined until the plurality of electrically conductive wires has been fixed on the plurality of lamellar electrically conductive surface regions of a photovoltaic cell.

Photovoltaic cell electrode and method for electrically connecting a photovoltaic cell

In different embodiments, a method is provided for processing at least one crystalline Silicon-wafer or a Solar-cell wafer. The method may include: a movement of the wafer with respect to a laser producing a laser beam; and therefore the formation of a laser channel in the wafer by means of a laser beam, wherein a thermal budget applied on the wafer by means of the laser beam is reduced in the peripheral region of the wafer, wherein the peripheral region includes a wafer edge, through which the laser beam exits the wafer after formation of the laser channel.

Method for processing at least one crystalline silicon-wafer with a thermal budget or a solar-cell wafer with a thermal budget by a laser beam

In various embodiments, a method for fitting contact wires to a surface of a photovoltaic cell is provided. The method may include: feeding the contact wires to a contact wire positioning and placement device, wherein the contact wire positioning and placement device comprises a plurality of nozzles or eyes, wherein at least one contact wire is in each case passed through a respective nozzle or eye, for positioning and placement thereof onto the surface of the photovoltaic cell; positioning and placing the contact wires on the surface of the photovoltaic cell by means of the contact wire positioning and placement device; and attaching the contact wires to the surface of the photovoltaic cell.

Method for fitting contact wires to a surface of a photovoltaic cell, photovoltaic cell, photovoltaic module, arrangement for fitting contact wires to a surface of a photovoltaic cell

A semiconductor component, especially a solar cell comprises a semiconductor substrate of a planar design having a first side and a second side lying opposite thereto, at least one contact structure arranged on at least one side of the semiconductor substrate, the at least one contact structure exhibiting a diffusion barrier to prevent the diffusion of ions from the contact structure into the semiconductor substrate.

Semiconductor component with contacts made of alloyed-in metal wires

A semiconductor component, in particular in the form of a solar cell, comprises a two-dimensional semiconductor substrate with a first side, a second side which is arranged opposite thereto, a surface normal which is perpendicular to said first and second sides, and a plurality of recesses which are at least arranged on the second side and extend in the direction of the surface normal, at least one dielectric passivation layer which is arranged on the second side, an electrically conducting contact layer arranged on the passivation layer, a plurality of contact elements for electrically connecting the contact layer with the semiconductor substrate, which contact elements are electrically conductive, are in electrically conducting connection with both the semiconductor substrate and with the contact layer, fill at least 50%, in particular at least 90%, preferably 100% of in each case one of the recesses, project beyond the recesses with a projection in the direction perpendicular to the surface normal and are of an easily solderable material.

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Penig, Germany

Martin Kutzer