Growing community of inventors

Bammental, Germany

Martin Hornung

Average Co-Inventor Count = 3.26

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 6

Martin HornungEmilie Barriau (3 patents)Martin HornungMartin Renkel (3 patents)Martin HornungRainer Schoenfeld (1 patent)Martin HornungAndreas Ferencz (1 patent)Martin HornungMichael J Flener (1 patent)Martin HornungGregory Krueger (1 patent)Martin HornungKonrad Becker (1 patent)Martin HornungJosef Hudina (1 patent)Martin HornungWolfgang Weimar (3 patents)Martin HornungMelanie Hagenbucher (1 patent)Martin HornungGregory A Krueger (1 patent)Martin HornungChristian Beirich (1 patent)Martin HornungEmilie Barriau (0 patent)Martin HornungDamien Fourcade (0 patent)Martin HornungRainer SCHÖNFELD (0 patent)Martin HornungRyzhova Anna (0 patent)Martin HornungMartin Hornung (5 patents)Emilie BarriauEmilie Barriau (14 patents)Martin RenkelMartin Renkel (7 patents)Rainer SchoenfeldRainer Schoenfeld (29 patents)Andreas FerenczAndreas Ferencz (25 patents)Michael J FlenerMichael J Flener (6 patents)Gregory KruegerGregory Krueger (5 patents)Konrad BeckerKonrad Becker (3 patents)Josef HudinaJosef Hudina (3 patents)Wolfgang WeimarWolfgang Weimar (3 patents)Melanie HagenbucherMelanie Hagenbucher (2 patents)Gregory A KruegerGregory A Krueger (1 patent)Christian BeirichChristian Beirich (1 patent)Emilie BarriauEmilie Barriau (0 patent)Damien FourcadeDamien Fourcade (0 patent)Rainer SCHÖNFELDRainer SCHÖNFELD (0 patent)Ryzhova AnnaRyzhova Anna (0 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Henkel Ag & Company, Kgaa (5 from 2,062 patents)


5 patents:

1. 10508199 - Photocurable epoxy resin systems

2. 10066134 - Hybrid matrix for fiber composite materials

3. 9988184 - Method of manufacturing a composite insert by molding

4. 9828534 - Impact-modified adhesives

5. 9464153 - Premix and method for producing a thermally expandable and curable epoxy-based compound

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