Robert Boschgmbh

Martin Holzmann

Frieder Haag

Christian Ohl

Florian Grabmaier

Michael Knauss

Harald Emmerich

Michael Munz

Wolfgang Hellwig

Friedemann Eberhardt

Stefan Ruebenacke

Valentin Tils

Kerstin Feddern

A sensor module includes a housing and a chip system disposed therein, the chip system being disposed on a substrate and being embedded in a sealing layer deposited on the substrate. The chip system is disposed in a window region of a frame structure disposed on the substrate, the frame structure featuring substantially the same thermal expansion properties as the substrate.

Sensor module

A current sensor for measuring a current in a conductor includes two magnetic field sensors located adjacent to the conductor. The magnetic field sensors are at least two-dimensional magnetic field sensors having two measuring directions, thereby facilitating compensation for an inhomogeneous interference field.

Current sensor, current measuring module and method for measuring current

A premold housing for accommodating a chip structure includes a first part of the housing which is connected to the chip structure as well as connected in an elastically deflectable manner to an additional part of the housing which is fastened to the support structure bearing the entire housing. A mechanism is provided for damping the deflection of the first part of the housing which is connected to the chip structure.

Chip housing having reduced induced vibration

Growing community of inventors

Gomaringen, Germany

Martin Holzmann