Other

Kionix, Inc.

Rohm Co., Ltd.

Maxim Integrated Products, Inc.

Hanking Electronics, Ltd.

Martin Heller

Douglas H Smith

Joel Rudder

Andrew Hocking

Edward Pecha

Toma Fujita

Sangtae Park

Philip Alcock

Wenting Gu

Scott A Miller

Kristin J Lynch

Jonah deWall

Stanley J Arasim, Jr

Nicole Kerness

Stanley J Olaskowitz

Randy Phillips

Mizuho Okada

Richard L Cheney

Karl H Kautzmann

A MEMS device formed in a first semiconductor substrate is sealed using a second semiconductor substrate. To achieve this, an Aluminum Germanium structure is formed above the first substrate, and a polysilicon layer is formed above the second substrate. The first substrate is covered with the second substrate so as to cause the polysilicon layer to contact the Aluminum Germanium structure. Thereafter, eutectic bonding is performed between the first and second substrates so as to cause the Aluminum Germanium structure to melt and form an AlGeSi sealant thereby to seal the MEMS device. Optionally, the Germanium Aluminum structure includes, in part, a layer of Germanium overlaying a layer of Aluminum.

Eutectic bonding with AlGe

A micro-electromechanical system (MEMS) device comprises a fixed portion and a proofmass suspended by at least one composite beam. The composite beam is cantilevered relative to the fixed portion and extends between a first end that is integrally formed with the fixed portion and a second distal end. The composite beam comprises an insulator having a top surface and at least two side surfaces; a conductor extending away from the fixed portion and surrounding at least a portion of the insulator; and a second conductor positioned adjacent to the top surface of the conductor and extending parallel with the insulator away from the fixed portion. The second conductor is separated from the first conductor to provide a low parasitic conductance of the composite beam.

Composite spring for robust piezoelectric sensing

A micro-electromechanical system (MEMS) device includes a substrate and a beam suspended relative to a surface of the substrate. The substrate includes a buried insulator layer and a cavity. The beam includes a first portion and a second portion that are separated by an isolation joint. The cavity separates the surface of the substrate from the beam.

Micro-electromechanical system devices and methods

Eutectic bonding with ALGe

A method of fabricating a semiconductor device, includes, in part, growing a first layer of oxide on a surface of a first semiconductor substrate, forming a layer of insulating material on the oxide layer, patterning and etching the insulating material and the first oxide layer to form a multitude of oxide-insulator structures and further to expose the surface of the semiconductor substrate, growing a second layer of oxide in the exposed surface of the semiconductor substrate, and removing the second layer of oxide thereby to form a cavity in which a MEMS device is formed. The process of growing oxide in the exposed surface of the cavity and removing this oxide may be repeated until the cavity depth reaches a predefined value. Optionally, a multitude of bump stops is formed in the cavity.

Method for manufacturing a micro electro-mechanical system

A method of processing a semiconductor substrate having a first conductivity type includes, in part, forming a first implant region of a second conductivity type in the semiconductor substrate where the first implant region is characterized by a first depth, forming a second implant region of the first conductivity type in the semiconductor substrate where the second implant region is characterized by a second depth smaller than the first depth, forming a porous layer within the semiconductor substrate where the porous layer is adjacent the first implant region, and growing an epitaxial layer on the semiconductor substrate thereby causing the porous layer to collapse and form a cavity.

Pseudo SOI process

A micro-gyroscope for determining a rate of rotation about a Z-axis includes a substrate and two sensor devices each of which comprises at least one drive mass, at least one anchor, drive elements, at least one sensor mass and sensor elements. The drive mass is mounted linearly displaceably in the direction of an X-axis, and can be driven in an oscillatory manner with respect to the X-axis. The sensor mass is coupled to the drive mass by means of springs. The sensor mass is displaceable in the Y-direction, and sensor elements detects a deflection of the sensor mass in the Y-axis. The two sensor devices are disposed parallel to each other and one above the other in the direction of the Z-axis, and the drive mass in these two sensor devices are coupled to each other by means of a coupling spring.

Micro-gyroscope and method for operating a micro-gyroscope

The invention includes lead forming and trimming apparatus particularly for transistors with a flat side on the body. Such transistors have a plurality of wire leads extending from the bottom of the body. These wire leads are in an alignment and are fed to a guideway between two strips with these strips at a slope sufficient to cause gravitational advancement of the components on their bottom. A finger metering means is provided and is cam actuated so as to cause one finger to be brought in way of the leading wire of a component as the other finger is being withdrawn from in way of a component in the metering station. The die for shaping and trimming consists of two halves moved first toward each other and then away from each other. The die halves are carried by slide supports and are removably mounted on support blocks. The slides are moved by circular cams enclosed in rectangular followers. The die actuating apparatus and slide mechanism is carried on an adjusting lead screw and guide rods so as to provide the exact lead and bend length. The finished component is delivered to an accumulating bin and the trimmed leads are accumulated in another bin for disposal. Resiliency is provided in the guideway to prevent damage of the leads during forming and trimming.

Apparatus and method for forming and trimming the leads of electrical

This invention pertains to apparatus for processing end-taped electronic components. This apparatus provides means for high-speed trimming, bending, or combinations thereof, of the leads of these components. The dies as assembled portions are carried in blocks for easy removal from reciprocated slide members. Left- and right-hand die assemblies are carried in by blocks removably attached to slide members mounted in groove portions of a support block. This support block may be moved by screw threads on a shaft to provide desired fine adjustment of the trimming of the leads. Barrel-type eccentric cams are carried on this apparatus and are moved in timed relationship to each other and the motor drive. Each of these eccentric cams engages and reciprocably drives box-like follower members which move a slide member, and an associated die block and die assembly. The driven sprocket is positioned between and adjacent the reciprocated die assemblies at the processing station. Fixed guide means is provided to insure guiding of the tape and components at a high speed and positive alignment. The severed component is deposited into an accumulating bin.

Method and apparatus for processing end-taped radial components

This invention provides an apparatus and method of setting up apparatus for the automatic cutting and/or shaping of IC components carried in a tubular carrier and advanced for processing by gravity. A base plate is disposed at an angle of approximately forty degrees to the horizontal and provides a supporting means for gravitational feeding of these components from a removable U-shaped retainer to a guide and then to a die station. At this die station a resiliently tired feed wheel engages the body of the IC component which is metered and advanced with an intermittent motion. This motion is provided in a timed relationship with two rotating shafts which have pins moved in a precise orbit around a shaft centerline. These pins are one-hundred-eighty degrees out-of-phase with each other. The rotated feed wheel and attached tire are intermittently moved in a strict timed relationship to the movement of the two shafts by a one-way clutch driven by one of the shafts and by an eccentrically moved Pitman arm. The several stations in this apparatus retain these components by clamp means and manipulable thumb screws.

Apparatus and method of setting up apparatus for shaping and trimming

The trimming apparatus and fixture for holding a PC board prior to and during trimming of an upper surface of the PC board utilizes a trimming blade rotated by a variable speed motor. This apparatus includes X and Y motion mechanism moved by hand grips that are spaced apart and cooperate with push button switches providing a safety control circuit. The X and Y motion mechanism employs linear ball bushings mounted and movable on hardened steel shafts. Removable holding fixtures are employed to hold and retain the PC boards during trimming. One holding fixture is used for PC boards that are not warped and not likely to warp. This fixture holds the PC board on three sides and a quick acting cam clamp is actuated to retain and release a PC board. Another fixture is adapted to hold and retain a PC board that is warped or likely to warp. Vacuum is used with a plurality of standoffs to establish the desired holding plane of this PC board. A quick opening aperture is uncovered to release both negative pressure and the PC board after trimming. A third fixture employs a top plate which is positioned by dowells. On this fixture and in this plate is formed a plurality of receiving openings for PC boards of small and/or irregular size. Vacuum is also employed as well as standoffs. The interior chamber of this fixture is provided with a quick opening lever plate that is manipulated to uncover an aperture and bring the interior of the fixture to atmospheric pressure.

Holding fixture and trimmer for PC boards

This dispensing apparatus provides a high speed feeding device with a one-at-a-time positive delivery of an electrical component having a generally cylindrical body and two wire-like members. The members are disposed to extend one from each end of the body and substantially central thereof. The dispensing apparatus includes a zig-zag feeder or chute from which the electrical component is delivered to cam actuated plunger means which is reciprocated to present a first supportive position and in response to a cam displacement the component is dropped into a receiver pocket and then moved to a discharge position whereat the transferred component is delivered to other operations.

High speed dispenser for electrical components

The present apparatus provides for the automatic shaping and/or cutting of the leads of integrated circuit components which are intermittently advanced to and through a straightening and cutting portion of the apparatus. A base plate is disposed at an angle of approximately 40.degree. to the horizontal and provides a base for the gravitational feeding of integrated circuit components carried in plastic guides both before and after trimming. The untrimmed components are fed by gravity to a metering station whereat a rubber roller is intermittently rotated so that each component is brought in way of a pair of opposed processing blades. These blades are simultaneously advanced by eccentric means which are moved in strict timed relationship to the movement of the component in way of the processing blades. As cutoff blades they cooperate with a center guide die to provide the desired shearing action. Both blades and die may be sharpened several times without losing the desired registration. By changing advance or rotation of the rubber wheel the length of the component to be accommodated is changed.

Growing community of inventors

Ithaca, NY, United States of America

Martin Heller