Osram Opto Semiconductors Gmbh

Osram Oled Gmbh

Siemens Aktiengesellschaft

Osram Gesellschaft MIT Beschraenkter Haftung

Osram Opto Semi-conductors Gmbh Co. Ohg

Osram Oledgmbh

Osram Gmbh

Martin Haushalter

Frank Möllmer

Andreas Wojcik

Heinz Haas

Frank Singer

David J O'Brien

Stephan Haslbeck

Michael Schwind

Markus Foerste

Frank M&ouml;llmer

Hubert Halbritter

Thomas Schwarz

Andreas Ploessl

Joachim Reill

Thomas Reiners

Michael Schumann

Dirk Becker

Tilman Eckert

Claus Jaeger

Markus Arzberger

Thomas Höfer

Josip Maric

Thomas Hoefer

Mario Wiengarten

Markus Lermer

Wilhelm Karsten

Christine Rüth

Stefan Strüwing

Rainer Friedrichs

David O'brien

Frank MÖLLMER

A light-emitting component includes a light-emitting chip and a housing including a plastic body and a reflector, the reflector includes an electrically conductive layer, the light-emitting chip includes a top side and an underside, the underside of the light-emitting chip is arranged on the plastic body, an electrical terminal on the top side of the light-emitting chip electrically conductively connects to the reflector by a bond wire, the underside of the light-emitting chip and the reflector are electrically insulated from one another, a conduction region is provided within the plastic body, thermal conductivity of the conduction region is greater than thermal conductivity of the plastic body, the conduction region adjoins the underside of the light-emitting chip, and the conduction region extends from the side of the plastic body facing the light-emitting chip as far as the side of the plastic body facing away from the light-emitting chip.

Light-emitting component and method of producing a light-emitting component

A measuring arrangement having an optical transmitter and an optical receiver are disclosed. In an embodiment a measuring arrangement includes an optical transmitter configured to transmit electromagnetic measuring radiation into a transmission space, an optical receiver configured to receive measuring radiation reflected by an object in a reception space and a covering configured to reduce reception of an interference radiation by the receiver, wherein the interference radiation is measuring radiation not reflected by the object.

Measuring arrangement having an optical transmitter and an optical receiver

An optoelectronic component includes an optoelectronic semiconductor chip that emits electromagnetic radiation, arranged in a housing, wherein the housing has an outer wall face and an exit face transparent to the electromagnetic radiation, the exit face is set back relative to the outer wall face in a direction of an interior of the housing, the optoelectronic semiconductor chip is arranged such that radiation emitted by the optoelectronic semiconductor chip in an emission direction can emerge from the optoelectronic component through the exit face, and the outer wall face has separating marks and the exit face is free of separating marks.

Housing having a recess exterior for an optoelectronic component

A laser component includes a housing that includes a base section including a top side and an underside, wherein a plurality of electrical soldering contact pads are configured at the underside of the base section, the electrical soldering contact pads enabling surface mounting of the laser component, a plurality of electrical chip contact pads are configured at the top side of the base section and electrically conductively connect to the soldering contact pads, the housing includes a cavity adjoining the top side of the base section, and a laser chip is arranged in the cavity and electrically conductively connects to at least some of the chip contact pads.

Laser component and method of producing same

An embodiment optoelectronic semiconductor device includes a housing having a leadframe with a first and second connection conductor. The housing further has a housing body surrounding the leadframe in one or more regions. The housing body extends in a vertical direction between a mounting side of the housing body and a front side of the housing body opposite the mounting side. The first connection conductor has a recess. A semiconductor chip configured to generate radiation is arranged within the housing, and the semiconductor chip is disposed in the recess and is affixed to the first connection conductor within the recess. A side face of the recess forms a reflector for reflecting the generated radiation. The first connection conductor protrudes from the housing body at the mounting side. The semiconductor chip is, in at least some regions, free of an encapsulation material adjoining the semiconductor chip.

Optoelectronic light-emitting component and leadframe assemblage

A housing for a semiconductor chip has a front side and a rear side opposite the front side, wherein the front side has a fastening area for the semiconductor chip; the rear side has a mounting area to mount the housing, wherein the mounting area runs obliquely to the fastening area; and the rear side has a resting area running parallel to the fastening area.

Housing for a semiconductor chip, housing composite, semiconductor component and method of producing a semiconductor component

An electronic device includes a printed circuit board having a cutout, wherein an optoelectronic component including a housing having an outer surface, the housing has a chip receptacle space at a top side, an optoelectronic semiconductor chip is arranged in the chip receptacle space, the housing has a first soldering contact surface and a second soldering contact surface, the first soldering contact surface and the second soldering contact surface face in the same spatial direction as the outer surface, and the first soldering contact surface and the second soldering contact surface are set back relative to the outer surface, is arranged in the cutout.

Optoelectronic component and electronic device having an optoelectronic component

A radiation-emitting component is specified, having a metallic carrier body (), which comprises at least two connection locations () for making electrical contact with the component, a laser diode chip (), which is fixed to the metallic carrier body () and is electrically conductively connected to the at least two connection locations (), a housing (), which surrounds the metallic carrier body () in places, wherein the housing () is formed with a plastic, the connection locations () extend in each case at least in places along a bottom face () and a side face () of the housing (), said side face running transversely with respect to the bottom face, and the component is surface-mountable by means of the connection locations () in such a way that the bottom face () or the side face () forms a mounting face of the component.

Radiation-emitting component

An optoelectronic semiconductor component includes a lead frame with two lead frame parts and an optoelectronic semiconductor chip. The semiconductor chip is fitted to a first of the lead frame parts. A radiation-transmissive potting body of the semiconductor component mechanically connects the lead frame parts to one another. The potting body is set up for beam shaping. The first lead frame part has a reflector trough with a base surface on which the semiconductor chip is mounted. The reflector trough has a lateral surface with three sections. When seen in a plan view of the base surface, the sections revolve around the base surface and follow one another in a direction away from the base surface. In the first section, closest to the base surface, the lateral surface is oriented perpendicular to the base surface.

Reflecto trough for an optoelectronic semiconductor component

An optoelectronic device includes an optoelectronic component that receives or generates radiation, a frame having a cavity, the optoelectronic component being arranged in said cavity, a connection carrier to which the optoelectronic component is fixed, and a cover covering the cavity and forming a radiation passage area for the radiation, wherein a beam path from the optoelectronic component to the radiation passage area is free of an encapsulation material for the optoelectronic component.

Optoelectronic device and method for producing optoelectronic devices

A method for producing a plurality of optoelectronic semiconductor components in combination is specified. A plurality of radiation-emitting and radiation-detecting semiconductor chips are applied on a carrier substrate. The semiconductor chips are potted with a respective potting compound. The potting compounds are subsequently severed by sawing between adjacent semiconductor chips. A common frame is subsequently applied to the carrier substrate The common frame has a plurality of chambers open toward the top. The frame is arranged in such a way that a respective semiconductor chip is arranged in a respective chamber of the frame. A semiconductor component produced in such a way and the use of the semiconductor component are furthermore specified.

Method for producing a plurality of optoelectronic semiconductor components in combination, semiconductor component produced in such a way, and use of said semiconductor component

An optoelectronic component includes a circuit board having a top side with a chip connection region, an optoelectronic semiconductor chip fixed to the chip connection region, a housing body fixed to the circuit board at the top side of the circuit board and having a reflector region, wherein the reflector region includes an opening in the housing body, the optoelectronic semiconductor chip being arranged in the opening, and the housing body is formed with a plastics material which is metallized at least in selected locations in the reflector region.

Optoelectronic component

The invention is directed to a tilt sensor comprising at least one body movable along a predefined path and an optoelectronic unit for determining the position of said body, said tilt sensor being surface-mountable. The invention is further directed to a tilt sensor assembly.

Tilt sensor

A lighting device is disclosed, which is provided for the front region of a motor vehicle, for example in a motor vehicle headlight, and which emits electromagnetic radiation during operation. The lighting device comprises at least one first primary radiation source which emits infrared radiation, and at least one second primary radiation source which emits visible light, wherein the first primary radiation source and the second primary radiation source are arranged in such a way that the second primary radiation source outshines the first primary radiation source and thus generates a color impression of the lighting device which deviates from the color impression stemming from the infrared radiation source alone.

Lighting device

A method for a quantitative detection of a linear movement or rotary movement. The method includes the steps of emitting radiation from at least two light emitters in a pulsed mode at a same clock frequency or different clock frequencies and detecting the radiation from the two light emitters by a detection device. It furthermore includes the steps of increasingly shadowing the radiations by a movable grid device or separating signals originating from different light emitters by an evaluation circuit coupled to said detection device.

Growing community of inventors

Wuppertal, Germany

Martin Haushalter