Littelfuse, Inc.

Tyco Electronics Corporation

Raychem Limited

Dongguan Littelfuse Electronics Company Limited

Martin G Pineda

Yuriy Borisovich Matus

Kedar V Bhatawadekar

Boris Golubovic

Anthony Vranicar

Werner Johler

Edward W Rutter, Jr

Minh V Ngo

Sergio Fuentes

Sergio Fuentes Godinez

Jianhua Chen

Dov Nitzan

Mario G Sepulveda

Deepak Nayar

Marco Doms

Paul Becker

Dong Yu

Chun-Kwan Tsang

William C Beadling

Dongjian Song

Frank Wasilewski

Cesar Martinez

Hajime Takahashi

Satoshi Sakamoto

Oluwaseun Kehinde Oyewole

Keiichiro Nomura

Toshikazu Yamaoka

Francois Perraud

Thanh U Chung

Francis M Yankello

Sirikhit Maniraj

Brad A Benson

A battery protection device includes a Charge/Discharge Over Temperature (CDOT) device and a wireless charging coil. The CDOT device consists of a first electrode, a second electrode, and a variable resistance material. The first electrode is located on a substrate and has a first collection of fingers. The second electrode is located on the substrate and has a second collection of fingers. The first fingers and the second fingers are disposed in an interdigitated, spaced-apart relationship with one another, resulting in a gap between them that is serpentine and tortuous. The variable resistance material changes its resistance in response to a change in temperature.

CDOT device for wireless charging

A semiconductor device protection arrangement. The semiconductor device protection arrangement may include a semiconductor chip; a controller, coupled to the power semiconductor chip; and a temperature sensor, disposed in thermal contact with the semiconductor chip, where the temperature sensor includes a positive temperature indicator (PTI) component.

Overcurrent protection of power semiconductor packages using integrated positive temperature indicator

A method for creating a dielectric thin-film coating for devices having a fusible element is disclosed. The method comprises mixing insoluble and soluble polymers in solid form and exposing the mixture to heat to create a melt mixture. The melt mixture is then dissolved in a solvent to create a slurry which can then be deposited on the device as a thin-film coating to create an interior insulation layer or an external surface.

Thin film coating packaging for device having meltable and wetting links

A fuse comprising including a housing, a fusible element disposed within the housing, first and second terminals extending from opposite ends of the fusible element and out of the housing, and a quantity of arc suppressing material disposed on the fusible element, wherein the arc suppressing material is formed of a polyamide hotmelt adhesive mixed with a flame retardant.

Fuse with arc suppressing mastic material

A metal oxide varistor (MOV) device including a MOV chip, electrically conductive first and second electrodes disposed on opposite sides of the MOV chip, and electrically conductive first and second leads connected to the first and second electrodes, respectively, wherein the first and second electrodes are formed of a material having a melting point greater than 1100 degrees Celsius.

Metal oxide varistor with reinforced electrodes

A circuit protection device including a positive temperature coefficient (PTC) device and a backup fuse electrically connected in series with one another, the backup fuse comprising a quantity of solder disposed on a dielectric chip and having a melting temperature that is higher than a trip temperature of the PTC device, wherein the a surface of the dielectric chip exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the surface to create a galvanic opening in the backup fuse.

Circuit protection device with PTC device and backup fuse

A thermal sensor wire. The thermal sensor wire may include a thermal sensing portion extending along a wire axis of the thermal sensor wire; and a carrier portion, the carrier portion extending along the wire axis, adjacent to the thermal sensing portion, the thermal sensing portion comprising a polymer positive temperature coefficient (PPTC) material or a negative temperature coefficient (NTC) material.

Thermal sensing wire and techniques for thermal sensing

A circuit protection device including a PTC device having a PTC element, first and second electrodes disposed on opposing first and second surfaces of the PTC element, respectively, first and second chip fuses disposed on the first and second electrodes, respectively, the second chip fuse electrically connected in series with the PTC device, and the first chip fuse electrically in connected parallel with the PTC device and the second chip fuse, the first chip fuse having a lower electrical resistance than the PTC element when the PTC element is in a non-tripped state, wherein a fusible element of the first chip fuse has a first melting temperature and is configured to carry a current higher than the PTC element can carry without tripping, and wherein a fusible element of the second chip fuse has a second melting temperature that is greater than the first melting temperature.

PTC device with integrated fuses for high current operation

A device may include an inner layer comprising a polyvinylidene fluoride (PVDF) material. The device may also include a first interface layer, disposed on a first side of the inner layer, and a second interface layer, disposed on a second side of the inner layer. The first interface layer and the second interface layer may comprise a mixture of PVDF material and a scavenger component.

PVDF piezoelectric reliability and electrode adhesion improvement

A temperature sensing tape including a flexible, electrically insulating substrate, a plurality of temperature sensing elements disposed on the substrate, each temperature sensing element including a first electrode and a second electrode arranged in a confronting, spaced-apart relationship to define a gap therebetween, and a variable resistance material disposed within the gap and connecting the first electrode to the second electrode, wherein the first electrode of at least one of the temperature sensing elements is connected to the second electrode of an adjacent temperature sensing element by a flexible electrical conductor.

Temperature sensing tape, assembly, and method of temperature control

Temperature sensing tape

An overheat protection device and a varistor are provided. The overheat protection device comprises: a first electrode and a second electrode disposed to be spaced apart; a hot-melt wire located between the first electrode and the second electrode, the hot-melt wire being in electrical contact with the first electrode and the second electrode; and an insulator supporting the first electrode and the second electrode, wherein the hot-melt wire is melted into a liquid hot-melt material when the ambient temperature reaches a predetermined temperature, the liquid hot-melt material wets the first electrode and the second electrode, and the liquid hot-melt material does not wet the insulator at least at a portion located between the first electrode and the second electrode.

Overheat protection device and varistor

Embodiments of the disclosure are directed to a harness assembly including a substrate having a plurality of vias, and a trace formed atop the substrate, the trace extending between each of the plurality of vias. The harness assembly may further include a surface mounted device disposed within a via of the plurality of vias.

Flexible harness assembly for surface mounted devices

A PPTC device is provided. The PPTC device may include a first electrode and a second electrode, disposed opposite the first electrode. The PPTC device may include a PPTC layer, disposed between the first electrode and the second electrode, the PPTC layer comprising a polymer matrix formed from a thermoplastic polyurethane (TPU) material.

Growing community of inventors

Fermont, CA, United States of America

Martin G Pineda