Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Micronic Mydata Ab

Martin Friedrichs

Thor Bakke

Peter Duerr

Peter Dürr

Detlef Kunze

Andreas Gehner

Andreas Neudert

Dirk Rudloff

Arnd Huerrich

Linus Elsäber

Matthias Schulze

Benjamin Völker

Sebastian Doering

Christoph Hohle

Thomas Haase

Linus ELSÄSSER

Jan Uwe Schmidt

An MMS includes a substrate, an element movable with respect to the substrate and a frame structure. A first pair of springs is arranged between the substrate and the frame structure along a first spring direction. A second pair of springs is arranged between the movable element and the frame structure along a second spring direction. The frame structure is configured to generate tensile stress in the second pair of springs at tensile stress acting in the first pair of springs.

MMS, MMS array, MEMS actuator and method for providing an MMS

In a microelectromechanical component according to the invention, at least one microelectromechanical element (), electrical contacting elements () and an insulation layer () and thereon a sacrificial layer () formed with silicon dioxide are formed on a surface of a CMOS circuit substrate () and the microelectromechanical element () is arranged freely movably in at least a degree of freedom. At the outer edge of the microelectromechanical component, extending radially around all the elements of the CMOS circuit, a gas- and/or fluid-tight closed layer () which is resistant to hydrofluoric acid and is formed with silicon, germanium or aluminum oxide is formed on the surface of the CMOS circuit substrate ().

Microelectromechanical component and method for producing same

An electromechanical component and an electromechanical component arrangement for proving the existence of a potential difference which consists of a first electrode, a second electrode and a proving structure. The proving structure is configured to be deflected in the event of there being a potential difference. In addition, an electromechanical component is configured to generate a useful effect. A method implements operation of an electromechanical component for proving the existence of a potential difference, other methods implement operation for performing a functional test on the electromechanical component.

Electromechanical component, electromechanical component arrangement, method of detecting a potential difference by using an electromechanical component, and method for performing a functional test on the electromechanical component

Embodiments of the present invention provide an MEMS actuator with a substrate, at least one post attached to the substrate and a deflectable actuator body that is connected to the at least one post via at least one spring, wherein, during electrostatic, electromagnetic or magnetic force application, the actuator body takes a second position starting from a first position by a tilt-free translational movement, wherein the first position and the second position are different, and wherein in a top view of the MEMS actuator the actuator body is arranged outside an area spanned by the at least one post.

MEMS actuator, system having a plurality of MEMS actuators, and method for producing a MEMS actuator

A method of producing a device with a movable portion spaced apart from a support wafer comprises a step of providing the support wafer having a structured surface and a further step of providing a device wafer with a backing layer and a device layer disposed thereon. Further, the method comprises the step of generating a first planarization layer from a first starting material on the support wafer with a first method to fill in the structures of the structured surface of the support wafer, whereby a surface with a first degree of planarization is obtained. Further, the method comprises a step of generating a second planarization layer from a second starting material on the planarized surface of the support wafer with a second method to obtain a surface with a second degree of planarization, which is higher than the first degree of planarization, wherein the first and second planarization layers can be removed together. Additionally, the support wafer is connected to the device wafer such that the device layer and the planarized surface of the support wafer are connected. Then, removing the backing layer of the device wafer is performed, followed by structuring the resulting structure and removing the first and second planarization layers via a common method to generate the moveable portion of the device.

Method of producing a device with a movable portion

Growing community of inventors

Dresden, Germany

Martin Friedrichs